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DUAL MOLDED STACK TSV PACKAGE
Packages including an embedded die with through silicon vias (TSVs) are described. In an embodiment, a first level die including TSVs is embedded between a...
3-D Package Having Plurality of Substrates
A package includes an interposer, which includes a first substrate free from through-vias therein, redistribution lines over the first substrate, and a first...
A semiconductor package includes a package substrate. A first semiconductor chip is mounted on the package substrate. The first semiconductor chip includes a...
ARRANGEMENT OF MULTIPLE POWER SEMICONDUCTOR CHIPS AND METHOD OF
MANUFACTURING THE SAME
A semiconductor power arrangement includes a chip carrier having a first surface and a second surface opposite the first surface. The semiconductor power...
METHOD OF FABRICATING AN ELECTRONIC PACKAGE
Some example forms relate a method of fabricating an electronic package. The method includes attaching a source wafer that includes micro devices to a target...
SEMICONDUCTOR CHIP METAL ALLOY THERMAL INTERFACE MATERIAL
Various apparatus and methods are disclosed. In one aspect, a method of manufacturing a thermal interface material on a semiconductor chip is provided. The...
BUMP FORMING METHOD, BUMP FORMING APPARATUS, AND SEMICONDUCTOR DEVICE
A bump forming method includes: a bonding step of bonding the leading end of a wire extending out of the tip of a bonding tool to a first point (X1); a wire...
Wafer Bonding Process and Structure
A semiconductor device and a method of fabricating the same are introduced. In an embodiment, one or more passivation layers are formed over a first substrate....
METHOD FOR BONDING SUBSTRATES
A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the...
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRE
A semiconductor device manufacturing method includes: raising and moving a bonding tool, while paying out a wire, in a direction from a second toward a first...
DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE
A discharge examination device for examining discharge of a wire-bonding apparatus that applies a voltage between a torch electrode and a wire to procure the...
Substrate and Package Structure
According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the...
SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY
A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The...
Conical-Shaped or Tier-Shaped Pillar Connections
A pillar structure, and a method of forming, for a substrate is provided. The pillar structure may have one or more tiers, where each tier may have a conical...
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a first circuit layer, a copper pillar disposed adjacent to the first circuit layer, a second circuit layer and a solder layer....
A semiconductor device capable of inhibiting oxidation of a Cu wiring even in a high temperature operation. The semiconductor device includes a semiconductor...
SUBSTRATE STRUCTURE, FABRICATION METHOD THEREOF AND CONDUCTIVE STRUCTURE
A substrate structure is provided, which includes: a substrate body having a plurality of conductive pads; an insulating layer formed on the substrate body and...
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF
A semiconductor package comprises a semiconductor chip having an active surface with a conductive pad thereon; an electroplated Au--Sn. alloy bump over the...
Filter and Capacitor Using Redistribution Layer and Micro Bump Layer
An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above...
MULTI-DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
A multi-device package includes a substrate, at least two device regions, a first redistribution layer, an external chip and a plurality of first connectors....
An object of the present invention is to provide a semiconductor device capable of eliminating unevenness of current distribution in a plane. A semiconductor...
CONNECTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A connector structure and a manufacturing method thereof are provided. The connector structure includes a semiconductor substrate, a metal layer, a passivation...
Calibration Kits for RF Passive Devices
A method includes measuring a first calibration kit in a wafer to obtain a first performance data. The wafer includes a substrate, and a plurality of...
PACKAGE SUBSTRATE DIFFERENTIAL IMPEDANCE OPTIMIZATION FOR 25 GBPS AND
A package design method is disclosed for the optimization of package differential impedance at data rates of 25 Gb/s and beyond. The method optimizes the...
WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
A semiconductor device includes an interposer having a first side and a second side opposite to the first side, at least one active chip mounted on the first...
A semiconductor module including an insulated circuit substrate having a substrate, a circuit layer on a front surface of the substrate, and a metal layer on a...
METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND
A method of manufacturing a semiconductor chip according to an embodiment includes forming on a semiconductor substrate a plurality of etching masks each...
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
The present disclosure relates to a semiconductor device package and a manufacturing method thereof. The semiconductor device package includes a carrier, at...
REGISTRATION MARK FORMATION DURING SIDEWALL IMAGE TRANSFER PROCESS
Methods of forming a registration mark such as an alignment mark or overlay mark during formation of sub-lithographic structures are provided. Methods may...
CONTACTS TO SEMICONDUCTOR SUBSTRATE AND METHODS OF FORMING SAME
An aspect of the invention includes a method for forming a contact in a dielectric layer over a semiconductor substrate. The method may comprise: forming a...
REDUCING CONTACT RESISTANCE IN VIAS FOR COPPER INTERCONNECTS
A method of forming an electrical transmission structure that includes forming an opening through an interlevel dielectric layer to expose at least one...
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECTRONIC
PART EMBEDDED SUBSTRATE
An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part,...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device is described below that includes a semiconductor substrate, a conductive film mounted on the semiconductor substrate, and an interlayer...
A semiconductor device includes a first power rail, a second power rail, at least one standard cell and at least one power bridge. The first power rail extends...
NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
A nonvolatile memory device may include a stair-shaped structure including a first interlayer dielectric layer and a memory cell repeatedly stacked. The...
Etch Stop Layer in Integrated Circuits
An integrated circuit structure includes a dielectric layer and an etch stop layer. The etch stop layer includes a first sub layer including a metal nitride...
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
A semiconductor device includes a silicon nitride film formed above a front surface side of a semiconductor substrate, a first wiring formed above the silicon...
ELECTRONIC DEVICE INCLUDING MOAT POWER METALLIZATION IN TRENCH
An electronic device is provided. The electronic device includes a semiconductor layer, a dielectric layer disposed on the semiconductor layer, circuitry...
INTEGRATED CIRCUITS INCLUDING ORGANIC INTERLAYER DIELECTRIC LAYERS AND
METHODS FOR FABRICATING THE SAME
Integrated circuits and methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes...
SEMICONDUCTOR DEVICE INCLUDING LANDING PAD
A semiconductor device includes conductive lines spaced from a substrate, and an insulating spacer structure between the conductive lines and defining a...
Flexible Interconnects, Systems, And Uses Thereof
Provided herein are flexible interconnects, systems containing one or more flexible interconnects, and textiles including one or more flexible interconnects.
MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DISPOSED
WITHIN A PACKAGE BODY
A microelectronic package including a passive microelectronic device disposed within a package body, wherein the package body is the portion of the...
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A package structure and a method for fabricating thereof are provided. The package structure includes a substrate, a first connector, a redistribution layer, a...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for...
DUAL ROW QUAD FLAT NO-LEAD SEMICONDUCTOR PACKAGE
Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer...
FIELD-EFFECT TRANSISTOR STRUCTURE FOR PREVENTING FROM SHORTING
A field-effect transistor(FET) structure for preventing from shorting is disclosed. The field-effect transistor(FET) structure is applying to a power discrete...
SEMICONDUCTOR DEVICE INCLUDING A CLIP
A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a...
MICRO-HOSES FOR INTEGRATED CIRCUIT AND DEVICE LEVEL COOLING
A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by...
PACKAGE INTEGRATED SYNTHETIC JET DEVICE
Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling...
CERAMIC CIRCUIT BOARD
[Problem] To obtain a ceramic circuit substrate having high bonding strength, excellent heat cycle resistance, enhanced reliability of operation as an...