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FABRICATING METHOD OF LATERAL-DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE
A lateral-diffused metal oxide semiconductor device including a substrate, a second deep well, a gate, a source, a drain and a first dopant region is provided....
SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD
A semiconductor device may include a gate electrode, an insulating layer, a first channel member, and a second channel member. The insulating layer may overlap...
METHOD AND APPARATUS PROVIDING IMPROVED THERMAL CONDUCTIVITY OF STRAIN
A structure includes a substrate and a strain relaxed buffer (SRB) that has a bottom surface disposed on the substrate and an opposite top surface. The SRB is...
SILICON GERMANIUM FIN FORMATION VIA CONDENSATION
A method of forming a finFET device comprises forming a fin in a silicon layer of a substrate, forming a hardmask layer on a top surface of the fin, forming an...
FULLY DEPLETED SILICON-ON-INSULATOR DEVICE FORMATION
A p-type metal-oxide-semiconductor (pMOS) planar fully depleted silicon-on-insulator (FDSOI) device and a method of fabricating the pMOS FDSOI are described....
FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE
Formation methods of a semiconductor device structure are provided. The method includes forming a gate stack over a semiconductor substrate and forming a...
BIPOLAR JUNCTION TRANSISTORS WITH DOUBLE-TAPERED EMITTER FINGERS
Device structures for a bipolar junction transistor and methods of fabricating a device structure for a bipolar junction transistor. A base layer comprised of...
COLUMN IV TRANSISTORS FOR PMOS INTEGRATION
Techniques are disclosed for forming column IV transistor devices having source/drain regions with high concentrations of germanium, and exhibiting reduced...
FORMING MULTI-STACK NANOWIRES USING A COMMON RELEASE MATERIAL
A method for forming a multi-stack nanowire device includes forming a common release layer on a substrate, the common release layer comprising a common release...
METHOD TO FORM SOI FINS ON A BULK SUBSTRATE WITH SUSPENDED ANCHORING
A method of fabricating non-tilted, electrically isolated fins from a bulk substrate is provided. A plurality of semiconductor fins is formed extending upwards...
SEMICONDUCTOR INTEGRATED CIRCUITS (ICs) EMPLOYING LOCALIZED LOW DIELECTRIC
CONSTANT (LOW-K) MATERIAL IN...
Semiconductor integrated circuits (ICs) employing localized low dielectric constant (low-K) material in inter-layer dielectric (ILD) material for improved...
METAL SELENIDE AND METAL TELLURIDE THIN FILMS FOR SEMICONDUCTOR DEVICE
In some aspects, methods of forming a metal selenide or metal telluride thin film are provided. According to some methods, a metal selenide or metal telluride...
TERMINATION OF HIGH VOLTAGE (HV) DEVICES WITH NEW CONFIGURATIONS AND
This invention discloses a semiconductor power device disposed in a semiconductor substrate comprising a heavily doped region formed on a lightly doped region...
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device, including implanting hydrogen atoms from a second principal surface of a semiconductor substrate, forming a...
A semiconductor device, including a substrate of a first conductivity type, an active region and a termination structure portion formed on a front surface of...
Semiconductor to Metal Transition for Semiconductor Devices
A semiconductor device includes a first semiconductor region having first charge carriers of a first conductivity type and a second semiconductor region having...
Method of Manufacturing a Semiconductor Device Having a Charge
Compensation Region Underneath a Gate Trench
A method of forming a semiconductor device is provided. The device includes a semiconductor substrate having a main surface and a rear surface vertically...
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
In connection with a semiconductor device including a capacitor element there is provided a technique capable of improving the reliability of the capacitor...
IMAGE DISPLAY DEVICE AND METHOD FOR REPAIRING SHORT CIRCUIT FAILURE
The present invention relates to an image display device and a method for repairing a short circuit failure. The present invention is applicable to, for...
A display device is disclosed. In one aspect, the display device includes a substrate comprising an active area and an inactive area adjacent to the active...
A display device is disclosed. In one aspect, the display device includes a first power wire is disposed in a non-display area of a substrate and includes a...
DISPLAY APPARATUS HAVING REDUCED SIGNAL DISTORTION
A display apparatus includes a data line extending in a first direction, a main scan line disposed substantially parallel to the data line, a sub scan line...
DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS
A display panel, comprising an array substrate (1) having a plurality of sub pixels (15), wherein the array substrate (1) comprises: a thin film transistor...
METHOD FOR PRODUCING ARRAY SUBSTRATE AND ARRAY SUBSTRATE
Embodiments of the present application provide a method for producing an array substrate. The array substrate includes a planarization layer provided on a...
ORGANIC LIGHT EMITTING DISPLAY AND MANUFACTURING METHOD FOR THE SAME
An organic light emitting diode (OLED) display comprises a substrate, a semiconductor layer portion disposed over the substrate and comprising an active...
PACKAGING METHOD, DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME, AND
The present invention discloses a method for packaging a display panel, a display panel and a method for manufacturing the same, and a display device. The...
LIGHT-EMITTING SUBSTRATE, PHOTOVOLTAIC CELL, DISPLAY DEVICE, LIGHTING
DEVICE, ELECTRONIC DEVICE, ORGANIC...
A CCM substrate (1) includes as a light-emitting layer on a substrate (11) a red conversion layer (142), a green conversion layer (152), and a light scattering...
ORGANIC EL DEVICE
An organic EL device including: a substrate; a bank layer having therewithin an opening having an elongated shape in plan view; and a functional layer...
PACKAGE METHOD OF SUBSTRATE AND PACKAGE STURCTURE
A package structure includes a substrate and a package plate. A frame is formed of a seal glue arranged between the substrate and the package plate. An...
DISPLAY SUBSTRATE, FABRICATING METHOD THEREOF AND DISPLAY APPARATUS
The present invention provide a display substrate, a fabricating method thereof, and a display apparatus, and belongs to the filed of display technology. The...
ORGANIC LIGHT EMITTING DISPLAY DEVICE
An organic light emitting display device is provided. The organic light emitting display device includes at least one light emitting part between an anode and...
A display device includes: a light emitting element layer which emits light, with luminance controlled in each of a plurality of unit pixels forming an image;...
COA SUBSTRATE, DISPLAY DEVICE AND METHOD FOR MANUFACTURING COA SUBSTRATE
The present disclosure provides a COA substrate, a display device and a method for manufacturing the COA substrate. The COA substrate includes a base...
OLED PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
The present invention provides an OLED panel, a manufacturing method thereof and a display device. The OLED panel includes a substrate, an OLED light emitting...
SOLID-STATE IMAGE-PICKUP DEVICE, METHOD OF MANUFACTURING THE SAME, AND
Solid-state image-pickup devices (10), including: at least one first photoelectric conversion section (11B, 11R) disposed in a substrate (11); a second...
METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
INCLUDING A TRANSISTOR WITH A VERTICAL CHANNEL
In a method of manufacturing a semiconductor integrated circuit device, a pillar may be formed on a semiconductor substrate. A hard mask pattern may be formed...
BIT CELL WITH SHARED BIT LINE
A complementary bit cell includes a first magnetic tunnel junction (MTJ) device having a free layer coupled to a first access transistor and having a pinned...
TOP ELECTRODE COUPLING IN A MAGNETORESISTIVE DEVICE USING AN ETCH STOP
A layer of silicon nitride above the bottom electrode and on the sidewalls of the magnetoresistive stack serves as an insulator and an etch stop during...
CMOS COMPATIBLE THERMOPILE WITH LOW IMPEDANCE CONTACT
In described examples, an integrated circuit containing CMOS transistors and an embedded thermoelectric device may be formed by forming active areas which...
LIGHT EMITTING DEVICE
A light emitting device is provided. The light emitting device includes a substrate and a plurality of light emitting elements. The light emitting elements are...
LIGHT EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREOF
An LED display is provided in considering of both the human eye perception and inconsistent luminous efficiencies of LEDs in a red, blue, and green sub-pixels....
SOLID STATE TRANSDUCER DEVICES, INCLUDING DEVICES HAVING INTEGRATED
ELECTROSTATIC DISCHARGE PROTECTION, AND...
Solid state transducer devices having integrated electrostatic discharge protection and associated systems and methods are disclosed herein. In one embodiment,...
METHOD FOR FORMING PAD OF WAFER
The present invention relates to a technology for simply performing a process of forming a pad on the rear surface of a via hole in a packing process in a...
SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS, AND METHOD OF DRIVING THE
SOLID-STATE IMAGING DEVICE
A solid-state imaging device including a semiconductor substrate; plural photoelectric conversion units formed side by side on the semiconductor substrate to...
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
An electronic component includes a semiconductor layer having a first surface coated with a first insulating layer and a second surface coated with an...
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
A semiconductor device includes a plurality of wirings (WR11) which are formed in the same layer above a semiconductor substrate, and a plurality of wirings...
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD OF THE SAME, AND
The present disclosure relates to a solid-state imaging device and a manufacturing method of the same, and an electronic apparatus, capable of more reliably...
VIRTUAL HIGH DYNAMIC RANGE LARGE-SMALL PIXEL IMAGE SENSOR
An image sensor includes photodiodes arranged in semiconductor material. Each of the photodiodes is identically sized and is fabricated in the semiconductor...
SOLID IMAGE-PICKUP DEVICE WITH FLEXIBLE CIRCUIT SUBSTRATE
A solid image-pickup device has a semiconductor substrate, which includes an image-pickup area having a plurality of light sensors arranged thereon. A...
ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE SAME AND
METHOD OF FORMING THE SAME
An elevated photosensor for image sensors and methods of forming the photosensor. The photosensor may have light sensors having indentation features including,...