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Patent # Description
2016/0372354 IC CARTRIDGE
An IC cartridge is provided, which includes: a cartridge body provided with hollowed-out parts, and an ejection mechanism including a substrate and projected...
2016/0372353 Overlay and Semiconductor Process Control Using a Wafer Geometry Metric
The present invention may include acquiring a wafer shape value at a plurality of points of a wafer surface at a first and second process level, generating a...
2016/0372352 AUTO-CORRECTION OF ELECTROSTATIC CHUCK TEMPERATURE NON-UNIFORMITY
A system for controlling a temperature of a wafer processing substrate includes memory that stores first data indicative of first temperature responses of at...
2016/0372351 METHOD AND APPARATUS FOR MICROWAVE ASSISTED CHALCOGEN RADICALS GENERATION FOR 2-D MATERIALS
Embodiments described herein provide a remote plasma system utilizing a microwave source. Additionally, generation and deposition techniques for 2D transition...
2016/0372350 CURING APPARATUS AND METHOD USING THE SAME
A UV curing apparatus includes a processing chamber, a UV light source disposed above the processing chamber, a window disposed between the processing chamber...
2016/0372349 LASER DICING DEVICE AND DICING METHOD
A laser dicing device includes a laser light source, an AF light source, a light path of the processing laser light and a light path of the AF laser light...
2016/0372348 GAS SUPPLY SYSTEM, GAS SUPPLY CONTROL METHOD AND GAS REPLACEMENT METHOD
Throughput of the processing can be improved. A gas supply system includes a plurality of element devices which constitute the gas supply system and a base 212...
2016/0372347 SUBSTRATE PROCESSING APPARATUS
Provided are a substrate processing apparatus capable of performing a semiconductor process using a plasma and a method of forming a semiconductor device using...
2016/0372346 SUBSTRATE TREATMENT SYSTEM, SUBSTRATE TRANSFER METHOD AND COMPUTER STORAGE MEDIUM
An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is...
2016/0372345 SUBSTRATE TREATMENT SYSTEM, SUBSTRATE TRANSFER METHOD AND COMPUTER STORAGE MEDIUM
An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is...
2016/0372344 WAFER DRYING APPARATUS AND WAFER DRYING METHOD
A wafer drying apparatus capable of preventing formation of a watermark is disclosed. The wafer drying apparatus includes: a conveying mechanism configured to...
2016/0372343 SUBSTRATE SUPPORT DEVICE, SUBSTRATE SUPPORT METHOD AND VACUUM DRYING EQUIPMENT
The embodiments of the invention disclose a substrate support device, a support method and a vacuum drying equipment. The substrate support device comprises a...
2016/0372342 PROCESS FOR MANUFACTURING A PLURALITY OF STRUCTURES
A process comprises the following steps: a) provision of a chamber suitable for receiving the plurality of structures, b) circulation of a gas stream in the...
2016/0372341 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
The temperature of a chemical liquid supplied to a pot is detected while allowing a processing liquid discharge port to discharge the chemical liquid toward...
2016/0372340 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a substrate holder, a rotating mechanism, a processing liquid discharge unit, and a gas discharge unit. The...
2016/0372339 SEMICONDUCITIVE CATECHOL GROUP ENCAPSULANT ADHESION PROMOTER FOR A PACKAGED ELECTRONIC DEVICE
A packaged electronic device includes a package substrate, an electronic component die mounted to the package substrate, and an encapsulant bonded to a portion...
2016/0372338 ETCHING-BEFORE-PACKAGING HORIZONTAL CHIP 3D SYSTEM-LEVEL METAL CIRCUIT BOARD STRUCTURE AND TECHNIQUE THEREOF
Provided is an etching-before-packaging horizontal chip three-dimensional system level metal circuit board structure comprising a metal substrate frame; the...
2016/0372337 INTERPOSER WITH LATTICE CONSTRUCTION AND EMBEDDED CONDUCTIVE METAL STRUCTURES
A lattice structure is formed in a non-silicon interposer substrate to create large cells that are multiples of through hole pitches to act as islands for...
2016/0372336 Method for Manufacturing a Semiconductor Device by Hydrogen Treatment
A method of manufacturing a semiconductor device includes: forming a porous area at a surface of a semiconductor body; forming a semiconductor layer on the...
2016/0372335 HIGH-PURITY 1-FLUOROBUTANE AND PLASMA ETCHING METHOD
The present invention provides: 1-fluorobutane having a purity of 99.9% by volume or more and a total butene content of 1,000 ppm by volume or less; use of the...
2016/0372334 SiARC REMOVAL WITH PLASMA ETCH AND FLUORINATED WET CHEMICAL SOLUTION COMBINATION
A method that allows effective removal of a silicon-containing antireflective coating (SiARC) layer in a block mask after defining an unblock area in a...
2016/0372333 DEVICE SUBSTRATE, METHOD OF MANUFACTURING DEVICE SUBSTRATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
According to one embodiment, a device substrate includes a multilayer film that includes a film constituting a device element and is disposed on a substrate. A...
2016/0372332 DUAL LINER SILICIDE
A method for fabricating a dual silicide device includes growing source and drain (S/D) regions for an N-type device, forming a protection layer over a gate...
2016/0372331 METHOD FOR FORMING SPACERS FOR A TRANSISTOR GATE
A method for forming spacers of a gate of a transistor is provided, including forming a protective layer covering the gate; after the forming the protective...
2016/0372330 PVD DEPOSITION AND ANNEAL OF MULTI-LAYER METAL-DIELECTRIC FILM
The present disclosure provides a film stack structure formed on a substrate and methods for forming the film stack structure on the substrate. In one...
2016/0372329 Methods for Forming a Semiconductor Device and a Semiconductor Device
A method for forming a semiconductor device includes implanting a predefined dose of protons into a semiconductor substrate. Further, the method comprises...
2016/0372328 METHOD OF MANUFACTURING A SILICON CARBIDE SEMICONDUCTOR DEVICE
A method of manufacturing a silicon carbide semiconductor device includes ion implanting an impurity into a surface of a semiconductor substrate comprised of...
2016/0372327 Method for Using Heated Substrates for Process Chemistry Control
A method of controlling doping of a substrate, the method comprising: providing the substrate in a process chamber of a doping system; performing a doping...
2016/0372326 SUPERPLANARIZING SPIN-ON CARBON MATERIALS
Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating...
2016/0372325 METHOD FOR FORMING PATTERNS BY IMPLANTING
A method of etching a layer including at least one pattern that has flanks is provided, including at least one step of modifying the layer by putting the layer...
2016/0372324 Deposition Methods For Uniform And Conformal Hybrid Titanium Oxide Films
Methods for depositing titanium oxide films by atomic layer deposition are disclosed. Titanium oxide films may include a titanium nitride cap, an oxygen rich...
2016/0372323 METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCTOR DIE
In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation...
2016/0372322 METHODS OF FORMING STAIRCASE-SHAPED CONNECTION STRUCTURES OF THREE-DIMENSIONAL SEMICONDUCTOR DEVICES
Provided is a staircase-shaped connection structure of a three-dimensional semiconductor device. The device includes an electrode structure on a substrate, the...
2016/0372321 Self-Centering Wafer Carrier System For Chemical Vapor Deposition
A self-centering wafer carrier system for a chemical vapor deposition (CVD) reactor includes a wafer carrier comprising an edge. The wafer carrier at least...
2016/0372320 SUBSTRATE PROCESSING METHOD
A substrate processing method includes a replacement step of replacing a rinse liquid adhered to the front surface of a substrate with a low surface tension...
2016/0372319 METHODS FOR DEPOSITING DIELECTRIC FILMS VIA PHYSICAL VAPOR DEPOSITION PROCESSES
In some embodiments a method of processing a substrate disposed atop a substrate support in a physical vapor deposition process chamber includes: (a)...
2016/0372318 SYSTEMS AND METHODS FOR REDUCING BACKSIDE DEPOSITION AND MITIGATING THICKNESS CHANGES AT SUBSTRATE EDGES
A substrate processing system for depositing film on a substrate includes a processing chamber defining a reaction volume and including a substrate support for...
2016/0372317 DEVICE AND METHOD FOR CLEANING BACKSIDE OR EDGE OF WAFER
A wafer back surface cleaning apparatus for removing foreign substance on a back surface of a wafer with a pulse-wave laser beam is disclosed. The wafer back...
2016/0372316 STRUCTURE AND METHOD FOR TUNABLE MEMORY CELLS INCLUDING FIN FIELD EFFECT TRANSISTORS
In a particular aspect, an integrated circuit includes a first gate structure coupled to a first fin field effect transistor (FinFET) device. The integrated...
2016/0372315 ION GUIDE OR FILTERS WITH SELECTED GAS CONDUCTANCE
Certain embodiments described herein are directed to rod assemblies such as, for example, quadrupole, hexapole and octupole rod assemblies. In some instances,...
2016/0372314 ION TRAPPING WITH INTEGRATED ELECTROMAGNETS
Devices, systems, and methods for ion trapping with integrated electromagnets are described herein. One device includes a plurality of electrodes configured to...
2016/0372313 Sample Introduction System for Spectrometers
A method of mass or ion mobility spectrometry is disclosed that uses the Leidenfrost effect to cause a liquid to be repelled away from a heated surface so as...
2016/0372312 Systems and Methods for Using Variable Mass Selection Window Widths in Tandem Mass Spectrometry
Systems and methods are used to analyze a sample using variable mass selection window widths. A tandem mass spectrometer is instructed to perform at least two...
2016/0372311 ION ANALYZER
A cloud of ions captured in an ion trap (2) is irradiated with a stream of hydrogen radicals cast through a radical particle introduction hole (26) bored in a...
2016/0372310 METHOD FOR MASS SPECTROMETRIC EXAMINATION OF GAS MIXTURES AND MASS SPECTROMETER THEREFOR
A method includes parallel or serial ionization of a gas mixture by activating at least two ionization devices operating using different ionization procedures,...
2016/0372309 OPTICAL DETECTORS AND METHODS OF USING THEM
Certain embodiments described herein are directed to optical detector and optical systems. In some examples, the optical detector can include a plurality of...
2016/0372308 PLASMA PROCESSING METHOD
Disclosed is a plasma processing method. The method includes forming a protective film on an inner wall surface of a processing container of a plasma...
2016/0372307 MULTIPLE ELECTRODE SUBSTRATE SUPPORT ASSEMBLY AND PHASE CONTROL SYSTEM
Implementations described herein provide a substrate support assembly which enables tuning of a plasma within a plasma chamber. In one embodiment, a method for...
2016/0372306 Method for Controlling Plasma Uniformity in Plasma Processing Systems
Techniques herein include a method for generating uniform plasma within an inductively-coupled plasma reactor. Techniques herein include providing a...
2016/0372305 PLASMA PROCESSING APPARATUS
A plasma processing apparatus has a vacuum container having a processing chamber in which a wafer is processed by plasma and at least one member constituting...
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