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Patent # Description
2016/0380207 TRIPHENYLENE-BASED FUSED BISCARBAZOLE DERIVATIVE AND USE THEREOF
The present invention discloses an triphenylene-based fused biscarbazole derivative is represented by the following formula(1) or formula(2), the organic EL...
2016/0380206 COMPOUND FOR ORGANIC ELECTRONIC ELEMENT, ORGANIC ELECTRONIC ELEMENT USING THE SAME, AND AN ELECTRONIC DEVICE...
A compound represented by Formula 1 is disclosed. An organic electric element includes a first electrode, a second electrode, and an organic material layer...
2016/0380205 LIGHT-EMITTING MATERIAL, ORGANIC LIGHT-EMITTING DEVICE, AND COMPOUND
A compound represented by the general formula (1) is useful as a light-emitting material. In the general formula (1), from 0 to 1 of R.sup.3 to R.sup.5...
2016/0380204 HOLE TRANSPORT LAYER COMPOSITION FOR SOLAR CELL, PREPARATION METHOD THEREOF AND SOLAR CELL COMPRISING THE SAME
A hole transport layer composition is for a solar cell, a preparation method is thereof, and there is a solar cell comprising the same. More precisely, a hole...
2016/0380203 DIBENZOSUBERANE-BASED ELECTRON-TRANSPORT MATERIALS
Novel dibenzosuberane-based compounds, compositions containing such compounds, and electronic devices containing such compounds as electron transport materials...
2016/0380202 Mask Plate, Method for Packaging OLED Device and OLED Device
A mask plate, a method for packaging an OLED device and an OLED device are disclosed, the mask plate includes at least one opening for forming a pattern of a...
2016/0380201 THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF, ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
A thin film transistor and manufacturing method thereof, an array substrate, a display panel and a display device are provided. The method includes a step of...
2016/0380200 ORGANIC THIN FILM TRANSISTOR AND METHOD FOR PREPARING THE SAME, ARRAY SUBSTRATE AND DISPLAY DEVICE
Disclosed are an organic thin film transistor and a method for preparing the same, an array substrate and a display device. An organic semiconductor layer of...
2016/0380199 ORGANIC-ELECTROLUMINESCENT-ELEMENT MATERIAL AND ORGANIC ELECTROLUMINESCENT ELEMENTS USING SAME
Disclosed are an organic electroluminescent device that is improved in luminous efficiency, sufficiently secures driving stability, and has a simple...
2016/0380198 AROMATIC AMINE DERIVATIVE, AND ORGANIC ELECTROLUMINESCENT ELEMENT COMPRISING THE SAME
An aromatic amine derivative represented by the following formula (1) wherein at least one of Ar.sub.1 to Ar.sub.4 is a heterocyclic group represented by the...
2016/0380197 ORGANIC ELECTROLUMINESCENT DEVICE
An organic electroluminescent device having improved emission efficiency includes an anode, an emission layer, an anode-side hole transport layer between the...
2016/0380196 BROADBAND PHOTORESISTOR
A photoresistor comprising: a semiconductor substrate selected from Gallium-Nitride, Gallium-Arsenic, Gallium Phosphide, and Aluminum Gallium Nitride, or any...
2016/0380195 Method of forming controllably conductive oxide
In fabricating a memory device, a first electrode is provided. An oxide layer is provided on the first electrode. A second electrode is provided on the oxide...
2016/0380194 THERMAL MANAGEMENT STRUCTURE FOR LOW-POWER NONVOLATILE FILAMENTARY SWITCH
Heat-trapping bulk layers or thermal-boundary film stacks are formed between a heat-assisted active layer and an associated electrode to confine such transient...
2016/0380193 TOP ELECTRODE FOR DEVICE STRUCTURES IN INTERCONNECT
Some embodiments relate to an integrated circuit device. The integrated circuit device includes a resistive random access memory (RRAM) cell, which includes a...
2016/0380192 Sidewall-Type Memory Cell
A sidewall-type memory cell (e.g., a CBRAM, ReRAM, or PCM cell) may include a bottom electrode, a top electrode layer defining a sidewall, and an electrolyte...
2016/0380191 Techniques for Filament Localization, Edge Effect Reduction, and Forming/Switching Voltage Reduction in RRAM...
The present disclosure provides a system and method for forming a resistive random access memory (RRAM) device. A RRAM device consistent with the present...
2016/0380190 PHASE-CHANGE MEMORY CELL HAVING A COMPACT STRUCTURE
A memory cell includes a selection transistor having a control gate and a first conduction terminal connected to a variable-resistance element. The memory cell...
2016/0380189 MANUFACTURING METHOD OF MAGNETORESISTIVE EFFECT ELEMENT AND MANUFACTURING APPARATUS OF MAGNETORESISTIVE EFFECT...
According to one embodiment, a manufacturing method of a magnetoresistive effect element includes forming a laminated structure on a substrate, the laminated...
2016/0380188 PERPENDICULAR MAGNETIC ANISOTROPY FREE LAYERS WITH IRON INSERTION AND OXIDE INTERFACES FOR SPIN TRANSFER TORQUE...
A method of making a spin-torque transfer magnetic random access memory device (STT MRAM) device includes forming a tunnel barrier layer on a reference layer;...
2016/0380187 MAGNETORESISTANCE EFFECT ELEMENT
A magnetoresistance effect element of the present invention includes: a barrier layer; a reference layer formed on one surface of the barrier layer; a free...
2016/0380186 MAGNETORESISTIVE ELEMENT AND MAGNETIC MEMORY
A magnetoresistive element according to an embodiment includes a stack structure, the stack structure including: a first magnetic layer containing Mn and at...
2016/0380185 MAGNETORESISTIVE ELEMENT AND MAGNETIC MEMORY
A magnetoresistive element according to an embodiment includes: a first magnetic layer; a second magnetic layer; a first nonmagnetic layer disposed between the...
2016/0380184 MAGNETORESISTIVE ELEMENT AND MAGNETIC MEMORY
A magnetoresistive element according to an embodiment includes: a first magnetic layer; a second magnetic layer; a first nonmagnetic layer disposed between the...
2016/0380183 TECHNIQUES FOR MRAM MTJ TOP ELECTRODE CONNECTION
Some embodiments relate to an integrated circuit including a magnetoresistive random-access memory (MRAM) cell. The integrated circuit includes a semiconductor...
2016/0380182 MAGNETORESISTIVE ELEMENT
According to one embodiment, there is provided a magnetoresistive element, including a first magnetic layer, a nonmagnetic layer on the first magnetic layer,...
2016/0380181 Semiconductor Package with Integrated Magnetic Field Sensor
A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as...
2016/0380180 POLYMERIC PIEZOELECTRIC MATERIAL, AND PROCESS FOR PRODUCING THE SAME
Provided is a process for producing a polymeric piezoelectric material including a first step of heating a sheet in an amorphous state containing the helical...
2016/0380179 PIEZOELECTRIC COMPOSITION, METHODS AND APPLICATIONS THEREOF
The present disclosure relates to piezoelectric compositions of Formula I comprising Lead Zirconate--Lead Titanate solid solution. The disclosure further...
2016/0380178 VIBRATION ACTUATOR
To provide a vibration actuator capable of both rotation and linear drive and providing a stable driving force. A vibration actuator whose output shaft is moved by...
2016/0380177 PIEZOELECTRIC/ELECTROSTRICTIVE ACTUATOR
A piezoelectric/electrostrictive ("PE") actuator includes a PE element including a laminated object having a PE layer and a pair of electrodes arranged...
2016/0380176 ACOUSTIC WAVE ELEMENT, DUPLEXER AND COMMUNICATION DEVICE
An elastic wave element has a piezoelectric substrate; an excitation electrode which is located on an upper surface of the piezoelectric substrate and...
2016/0380175 FORMATION OF A DENSIFIED OBJECT FROM POWDERED PRECURSOR MATERIALS
A method for forming a densified solid object corresponding to a thermoelectric element from a mixture of uncompressed, powdered constituent materials. A...
2016/0380174 THERMOELECTRIC DEVICES AND POWER SYSTEMS
A thermoelectric device may include first and second insulating substrates. An array of electrically conductive first metallizations may be positioned on one...
2016/0380173 LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount
A light emitting device manufacturing method includes the following steps. A sub-mount, which has a plurality of electrical-conductive layers, is provided, and...
2016/0380172 COMPONENT ARRANGEMENT AND METHOD FOR PRODUCING A COMPONENT ARRANGEMENT
Various embodiments may relate to a component arrangement with at least two electrical components arranged next to one another in a product configuration. Each...
2016/0380171 LED PACKAGE STRUCTURE AND CHIP CARRIER
An LED package structure includes a chip carrier and an LED chip. The chip carrier includes a ceramic substrate, a circuit layer, a ceramic reflective plate...
2016/0380170 WHITE LED, BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY DEVICE
A white LED, which includes a substrate, at least one monochromatic LED chip disposed on the substrate, a reflector cup disposed on the substrate and...
2016/0380169 OPTICAL DEVICE AND LIGHT EMITTING DEVICE PACKAGE INCLUDING THE SAME
An optical device may include a first surface having a shape of a quadrangle; and a second surface disposed to be opposite to the first surface and comprising...
2016/0380168 CHIP SUBSTRATE COMPRISING A GROOVE PORTION AND CHIP PACKAGE USING THE CHIP SUBSTRATE
Disclosed is a chip substrate. The chip substrate includes: conductive portions laminated in one direction to constitute the chip substrate; insulation...
2016/0380167 PRE-CUT SUBSTRATE AND UNIT CHIP SUBSTRATE COMPRISING HEMISPHERICAL CAVITY
Disclosed are an uncut chip plate and a chip substrate. The uncut chip plate includes: conductive portions laminated in one direction to constitute the uncut...
2016/0380166 Method for Producing an LED Module and LED Module
Various embodiments may relate to a method for producing an LED module, including providing a housing implemented as a hollow body, having an opening on a...
2016/0380165 LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING SAME
A light-emitting device includes a substrate; a light-emitting element mounted on the substrate; a first light-transmissive member bonded to an upper surface...
2016/0380164 WAVELENGTH CONVERTERS AND METHODS FOR MAKING THE SAME
Disclosed herein are wavelength converters and methods for making the same. The wavelength converters include a single layer of a polymeric matrix material,...
2016/0380163 ILLUMINATION METHOD AND LIGHT-EMITTING DEVICE
To provide an illumination method and a light-emitting device which are capable of achieving, under an indoor illumination environment where illuminance is...
2016/0380162 Light Emitting Device And Manufacturing Method Thereof
A light emitting device includes a substrate; an LED chip, disposed on the substrate; and a fluorescent layer. The fluorescent layer is at least partially and...
2016/0380161 OPTICAL CONVERTER SYSTEM FOR (W)LEDS
An optical converter system for (W)LEDs, and a method for producing the optical converter system are provided. The optical converter system includes an...
2016/0380160 METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE WITH PHOSPHOR LAYER
A method for manufacturing a light emitting device, having mounting a light emitting element on a board, forming a phosphor layer that contains a phosphor by...
2016/0380159 CHIP SUBSTRATE COMPRISING A PLATED LAYER AND CHIP PACKAGE USING THE SAME
A chip substrate includes laminated conductive portions, and laminated insulation portions that electrically isolate the conductive portions, with a cavity in...
2016/0380158 LIGHT EMITTING DEVICE AND FLUIDIC MANUFACTURE THEREOF
Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate...
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