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Patent # Description
2017/0012117 TRANSITION METAL DICHALCOGENIDE SEMICONDUCTOR ASSEMBLIES
Embodiments of semiconductor assemblies, and related integrated circuit devices and techniques, are disclosed herein. In some embodiments, a semiconductor...
2017/0012116 GERMANIUM-BASED QUANTUM WELL DEVICES
A quantum well transistor has a germanium quantum well channel region. A silicon-containing etch stop layer provides easy placement of a gate dielectric close...
2017/0012115 ENERGY-FILTERED COLD ELECTRON DEVICES AND METHODS
Energy-filtered cold electron devices use electron energy filtering through discrete energy levels of quantum wells or quantum dots that are formed through...
2017/0012114 FinFET Having Isolation Structure and Method of Forming the Same
A transistor includes a substrate having an upper surface, a fin structure protruding from the upper surface of the substrate, an isolation structure over the...
2017/0012113 METHOD FOR PREPARING SUBSTRATE USING GERMANIUM CONDENSATION PROCESS AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
The present invention suggests a substrate manufacturing method and a manufacturing method of a semiconductor device comprising: providing a SOI structure...
2017/0012112 METHOD OF MANUFACTURING THIN-FILM TRANSISTOR SUBSTRATE
Provided is a method of manufacturing a thin-film transistor substrate, the method includes forming a semiconductor pattern layer on a substrate. A first...
2017/0012111 TRENCH MOSFET WITH DEPLETED GATE SHIELD AND METHOD OF MANUFACTURE
A semiconductor device, method of manufacture of a semiconductor device, and electronic system are disclosed. For example, the semiconductor device includes at...
2017/0012110 Method for Filling a Trench and Semiconductor Device
A method includes forming a first trench in a semiconductor body between two semiconductor fins, filling the first trench with a first filling material,...
2017/0012109 METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
A method for manufacturing a SiC semiconductor device includes: forming recesses to be separated from each other on a cross section in parallel to a surface of...
2017/0012108 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
In a method for manufacturing a semiconductor device, when a second conductive type impurity layer is formed to provide a deep layer having a second conductive...
2017/0012107 METHODS FOR PRODUCING INTEGRATED CIRCUITS USING LONG AND SHORT REGIONS AND INTEGRATED CIRCUITS PRODUCED FROM...
Integrated circuits and methods for producing the same are provided. In an exemplary embodiment, a method for producing an integrated circuit includes forming...
2017/0012106 METHOD OF FORMING VIAS IN SILICON CARBIDE AND RESULTING DEVICES AND CIRCUITS
A method of fabricating an integrated circuit on a silicon carbide substrate is disclosed that eliminates wire bonding that can otherwise cause undesired...
2017/0012105 PROCESS FOR INTEGRATED CIRCUIT FABRICATION INCLUDING A UNIFORM DEPTH TUNGSTEN RECESS TECHNIQUE
Dummy gates are removed from a pre-metal layer to produce a first opening (with a first length) and a second opening (with a second length longer than the...
2017/0012104 METHOD FOR PRODUCING A HIGH-VOLTAGE TRANSISTOR WITH REDUCED FOOTPRINT, AND CORRESPONDING INTEGRATED CIRCUIT
An integrated MOS transistor is formed in a substrate. The transistor includes a gate region buried in a trench of the substrate. The gate region is surrounded...
2017/0012103 VACUUM TRANSISTOR STRUCTURE USING GRAPHENE EDGE FIELD EMITTER AND SCREEN ELECTRODE
A device having: a substrate having a dielectric surface; a gate electrode; a drain electrode; a source electrode having a conductive contact and a...
2017/0012102 Method for Reducing Bipolar Degradation in an SIC Semiconductor Device and Semiconductor Device
Disclosed is a method for forming a semiconductor device and a semiconductor device. The method includes: in a SiC semiconductor body, forming crystal...
2017/0012101 INTEGRATION OF SEMICONDUCTOR EPILAYERS ON NON-NATIVE SUBSTRATES
An article includes a support substrate bonded to heterostructure epitaxial layers that include one or more electronic devices. The support substrate has a...
2017/0012100 LOCALIZED AND SELF-ALIGNED PUNCH THROUGH STOPPER DOPING FOR FINFET
A method for doping punch through stoppers (PTSs) includes forming fins in a monocrystalline substrate, forming a dielectric layer at a base portion between...
2017/0012099 METHODS AND APPARATUS RELATED TO TERMINATION REGIONS OF A SEMICONDUCTOR DEVICE
In one general aspect, an apparatus can include a semiconductor region having an active region, and an end trench defined within a termination region of the...
2017/0012098 METHODS OF FORMING AN ISOLATION STRUCTURE AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THE SAME
A method of forming an isolation structure, wherein a hard mask is formed on a first region and a second region of a substrate; the substrate is etched using...
2017/0012097 ORGANIC LIGHT EMITTING DISPLAY DEVICE
Discussed is an organic light emitting display device that may include a first pixel on a substrate; a switching transistor with a first active layer provided...
2017/0012096 DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
Provided is a display device, including: a substrate; signal lines including a gate line, a data line, and a driving voltage line that collectively define an...
2017/0012095 Displays with Reduced Driver Circuit Ledges
An electronic device display may have a color filter layer, a thin-film-transistor layer, and a layer of liquid crystal material. The display may have a...
2017/0012094 THIN FILM TRANSISTOR ARRAY SUBSTRATE AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE INCLUDING THE SAME
A thin film transistor array substrate having a pixel arrangement structure includes a first sub-pixel for displaying a first color and a second sub-pixel for...
2017/0012093 IMAGE DISPLAY APPARATUS
An image display apparatus includes: a first pixel circuit including a driving transistor that drives a light emitting element and includes a gate electrode on...
2017/0012092 METHOD OF FORMING THIN FILM TRANSISTOR ARRAY SUBSTRATE
A method of forming an organic light emitting diode (OLED) display device is discussed. The method according to an embodiment includes forming a first bank...
2017/0012091 LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND CELLULAR PHONE
The invention relates to: a light-emitting device which includes a first flexible substrate having a first electrode, a light-emitting layer over the first...
2017/0012090 LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND CELLULAR PHONE
The invention relates to: a light-emitting device which includes a first flexible substrate having a first electrode, a light-emitting layer over the first...
2017/0012089 ELECTRODE, METHOD FOR MANUFACTURING THE SAME, AND ORGANIC LIGHT EMITTING DIODE DISPLAY INCLUDING THE SAME
An electrode includes: a polymer layer including a non-conductive material; a conductive nanomaterial embedded in a top surface of the polymer layer; and a...
2017/0012088 ORGANIC ELECTROLUMINESCENCE MODULE AND INFORMATION DEVICE
An object of the invention is to provide an organic electroluminescence module having light-emitting units capable of keeping power consumption low and to...
2017/0012087 ORGANIC LIGHT-EMITTING DISPLAY APPARATUS
An organic light-emitting display apparatus includes a display area including first and second pixels. A plurality of photo sensors is arranged in an outer...
2017/0012086 ORGANIC LIGHT-EMITTING DIODE DISPLAY APPARATUS INCLUDING A PHOTO SENSOR
An organic light-emitting diode display apparatus includes a substrate. An organic light-emitting device is disposed on the substrate and includes a first...
2017/0012085 OLED DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME, DISPLAY APPARATUS
The present invention relates to an OLED display panel including: two substrates opposite to each other; a plurality of pixel regions disposed between inner...
2017/0012084 METHOD OF MANUFACTURING ORGANIC EL DEVICE, ORGANIC EL DEVICE AND ELECTRONIC APPARATUS
An organic EL device according to the present application includes a substrate, a plurality of organic EL elements arranged on the substrate, the plurality of...
2017/0012083 RESISTIVE RANDOM-ACCESS MEMORY WITH IMPLANTED AND RADIATED CHANNELS
Resistive RAM (RRAM) devices having increased uniformity and related manufacturing methods are described. Greater uniformity of performance across an entire...
2017/0012082 PHOTOELECTRIC CONVERSION DEVICE AND METHOD FOR PRODUCING PHOTOELECTRIC CONVERSION DEVICE
A photoelectric conversion device according to the present invention has a plurality of photoreceiving portions provided in a substrate, an interlayer film...
2017/0012081 CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
A manufacturing method of a chip package includes the following steps. A patterned solder paste layer is printed on a patterned conductive layer of a wafer....
2017/0012080 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
A method of fabricating a semiconductor device includes the following steps. A substrate including an isolation region and a device region is provided. An...
2017/0012079 BACKSIDE ILLUMINATION (BSI) IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
A method for manufacturing a BSI image sensor includes following steps: A substrate is provided. The substrate includes a front side and a back side opposite...
2017/0012078 METHOD OF MANUFACTURING IMAGE SENSOR INCLUDING NANOSTRUCTURE COLOR FILTER
A method of manufacturing an image senor includes: preparing a sensor substrate including: a sensor layer including a photosensitive cell; and a signal line...
2017/0012077 PHOTODETECTOR FOR IMAGING SYSTEM
There is disclosed a substrate including at least one photodetector, the photodetector having a first active area on a first surface of the substrate and a...
2017/0012076 PHOTODETECTORS BASED ON INTERBAND TRANSITION IN QUANTUM WELLS
The present application relates to a photodetector based on interband transition in quantum wells. The photodetector may include a first semiconductor layer...
2017/0012075 SEMICONDUCTOR DEVICE, SOLID-STATE IMAGE SENSOR AND CAMERA SYSTEM
The present invention relates to a semiconductor device, a solid-state image sensor and a camera system capable of reducing the influence of noise at a...
2017/0012074 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes a first semiconductor substrate, a second semiconductor substrate, a first main surface side of the first semiconductor...
2017/0012073 SOLID STATE IMAGING APPARATUS AND METHOD OF PRODUCING THE SAME
There is provided a solid state imaging apparatus, including: an optical film layer on which a solid state image sensor is mounted; a multifunctional chip...
2017/0012072 INFRARED SENSOR, NEAR-INFRARED ABSORBING COMPOSITION, CURED FILM, NEAR-INFRARED ABSORBING FILTER, IMAGE SENSOR,...
Provided are an infrared sensor, a near-infrared absorbing composition, a cured film, a near-infrared absorbing filter, an image sensor, a camera module, and a...
2017/0012071 IMAGE SENSOR PIXELS WITH LIGHT GUIDES AND LIGHT SHIELD STRUCTURES
A front-side illuminated image sensor with an array of image sensor pixels is provided. Each image pixel may include a photodiode, transistor gate structures,...
2017/0012070 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device including a substrate, at least one sensor, a dielectric layer, at least one light pipe structure, at least one pad, a shielding layer,...
2017/0012069 OPTICAL MODULES INCLUDING CUSTOMIZABLE SPACERS FOR FOCAL LENGTH ADJUSTMENT AND/OR REDUCTION OF TILT, AND...
Optical modules are made using customizable spacers to reduce variations in the focal lengths of the optical channels, to reduce the occurrence of tilt of the...
2017/0012068 SOLID-STATE IMAGE PICKUP DEVICE
A solid-state image pickup device 1 according to the present invention includes a semiconductor substrate 2 on which a pixel 20 composed of a photodiode 3 and...
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