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Patent # Description
2017/0012017 ASSEMBLY COMPRISING TWO ELEMENTS OF DIFFERENT THERMAL EXPANSION COEFFICIENTS AND A SINTERED JOINT OF...
An assembly comprises a first element having a first thermal expansion coefficient, a second element having a second thermal expansion coefficient and at least...
2017/0012016 Systems of Bonded Substrates and Methods for Bonding Substrates with Bonding Layers
A first substrate may be bonded to a second substrate in a method that may include providing the first substrate, providing a second substrate, providing a...
2017/0012015 ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
A first anisotropic conductive film 1A or a second anisotropic conductive film 1B has a first insulating resin layer 2 and a second insulating resin layer 3....
2017/0012014 Anisotropic Conductive Film And Production Method of the Same
An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin...
2017/0012013 ELECTRONIC APPARATUS AND METHOD FOR FABRICATING THE SAME
An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal,...
2017/0012012 SEMICONDUCTOR DEVICES HAVING METAL BUMPS WITH FLANGE
A semiconductor device having a terminal site (100) including a flat pad (110) of a first metal covered by a layer (130) of dielectric material, the layer over...
2017/0012011 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the...
2017/0012010 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the...
2017/0012009 SEMICONDUCTOR DEVICE PROCESSING METHOD FOR MATERIAL REMOVAL
A method of removing at least a portion of a layer of material from over a semiconductor substrate that can include dispensing an etching solution over the...
2017/0012008 HIGH-FREQUENCY PACKAGE
A high-frequency package has: a resin substrate; a high-frequency device mounted on a side of a first surface of the resin substrate; a ground surface...
2017/0012007 SEMICONDUCTOR PACKAGES WITH THERMAL-ENHANCED CONFORMAL SHIELDING AND RELATED METHODS
The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least...
2017/0012006 SEMICONDUCTOR INTEGRATED CIRCUIT
A high-resistance region is formed right under a seal ring by irradiating a semiconductor substrate with hydrogen ions or helium ions. The high-resistance...
2017/0012005 GUARD RING METHOD FOR SEMICONDUCTOR DEVICES
A customized seal ring for a semiconductor device is formed of multiple seal ring cells that are selected and arranged to produce a seal ring design. The cells...
2017/0012004 SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the...
2017/0012003 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate having a ground electrode...
2017/0012002 Methods of Manufacturing a Semiconductor Device by Forming a Separation Trench
A method of manufacturing a semiconductor device includes forming a separation trench into a first main surface of a semiconductor substrate and removing...
2017/0012001 SELF-ALIGNED BARRIER AND CAPPING LAYERS FOR INTERCONNECTS
An interconnect structure for integrated circuits for copper wires in integrated circuits and methods for making the same are provided. Mn, Cr, or V containing...
2017/0012000 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device and a method of fabricating the same, the semiconductor device including a fin structure, a first liner, a first insulating layer and a...
2017/0011999 SEMICONDUCTOR INTEGRATED CIRCUIT AND ELECTRONIC SYSTEM INCLUDING THE SAME
A semiconductor integrated circuit comprising: a first macro cell including a first power line in a first wiring layer; a second macro cell adjacent to the...
2017/0011998 SEMICONDUCTOR INTERCONNECT STRUCTURES
Techniques are disclosed that enable improved shorting margin between unlanded conductive interconnect features and neighboring conductive features. In some...
2017/0011997 Thickened Stress Relief and Power Distribution Layer
An embodiment includes a semiconductor structure comprising: a frontend portion including a device layer; a backend portion including a bottom metal layer, a...
2017/0011996 SEMICONDUCTOR DEVICE HAVING INTERCONNECTION STRUCTURE
A semiconductor device includes a semiconductor pattern on a semiconductor substrate, a three-dimensional memory array on the semiconductor pattern, and a...
2017/0011995 MEMORY DEVICE AND METHOD OF FORMING THE SAME
Provided is a memory device including a plurality of bit line layers and a plurality of supporting structures. Each bit line layer extends in a plane defined...
2017/0011994 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film...
2017/0011993 Thin Recon Interposer Package Without TSV for Fine Input/Output Pitch Fan-Out
Semiconductor devices and manufacturing methods are provided for using a Recon interposer that provides a high density interface between the active...
2017/0011992 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A substrate structure may include a base substrate, a plurality of unit substrate regions arranged on the base substrate in one or more rows and one or more...
2017/0011991 Assembly comprising an element that is capable of transmitting heat, a film of a polymer that is a good thermal...
An assembly comprises: at least one element that is capable of transmitting heat; at least one electrically insulating substrate comprising at least one film...
2017/0011990 SEMICONDUCTOR DEVICE WITH LEAD TERMINALS HAVING PORTIONS THEREOF EXTENDING OBLIQUELY
A semiconductor device includes a semiconductor chip and a plurality of leads. The leads include a first lead including a supporting portion for mounting the...
2017/0011989 LEAD FRAME INCLUDING U-NOTCH
A lead frame includes a die paddle, a first lead, and a U-notch coupling the die paddle to the first lead. The U-notch extends from the die paddle and the...
2017/0011988 Semiconductor Device Having Backside Interconnect Structure on Through Substrate Via and Method of Forming the Same
A semiconductor device includes a through-substrate via extending from a frontside to a backside of a semiconductor substrate. The through-substrate via...
2017/0011987 THROUGH-BODY VIA FORMATION TECHNIQUES
Techniques are disclosed for forming a through-body-via (TBV) in a semiconductor die. In accordance with some embodiments, a TBV provided using the disclosed...
2017/0011986 THERMALLY CONDUCTIVE SHEET AND SEMICONDUCTOR DEVICE
A thermally conductive sheet of the present invention includes a thermosetting resin (A) and an inorganic filler material (B) that is dispersed in the...
2017/0011985 Power electronics module with load connection elements
A power electronics module having a base plate, a circuit carrier arranged on the base plate and a plurality of conductor tracks which are electrically...
2017/0011984 ELECTRONIC DEVICE
A semiconductor integrated circuit, a radiation detection unit and a cooling unit are provided. Here, a radiation detection unit is provided near the...
2017/0011983 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
A semiconductor package including an insulating layer, a chip, a thermal interface material, a heat-dissipating cover and a re-distribution layer is provided....
2017/0011982 Insulated die
An insulated chip comprising a semiconductor chip comprising at least one chip pad and an electrically insulating layer surrounding at least part of the...
2017/0011981 SEMICONDUCTOR PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
A method of manufacturing a semiconductor device including providing a die, forming a pad on the die, disposing a first polymer over the die, patterning the...
2017/0011980 SEMICONDUCTOR PACKAGE
Disclosed is a semiconductor package including a lead frame with a chip pad and a lead, a semiconductor chip may be disposed on the lead frame, and an...
2017/0011979 Chip Scale Package
A novel semiconductor chip scale package encapsulates semiconductor chip on the device side, the non-device side, and the four edges with a mold compound. One...
2017/0011978 SEMICONDUCTOR DEVICE
The semiconductor device includes a semiconductor element, a main lead and a resin package. The semiconductor element includes an obverse surface and a reverse...
2017/0011977 WAFER LEVEL PACKAGE SOLDER BARRIER USED AS VACUUM GETTER
An electronic device and methods of manufacture thereof. One or more methods may include providing a lid wafer having a cavity and a surface surrounding the...
2017/0011976 SEMICONDUCTOR CHIP INCLUDING CHIP PAD, REDISTRIBUTION WIRING TEST PAD, AND REDISTRIBUTION WIRING CONNECTION PAD
A semiconductor chip is disclosed that includes a chip pad disposed in a first region of a chip body, a redistribution wiring test pad disposed in the first...
2017/0011975 HEATED STAGE WITH VARIABLE THERMAL EMISSIVITY METHOD AND APPARATUS
Embodiments include a method for controlled cooling of a heated stage. The method includes setting a stage coupling to a maximum value and heating the stage to...
2017/0011974 SUBSTRATE PROCESSING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
A substrate processing apparatus includes a substrate heating part, a power supply part and a control device. The control device measures a temperature of the...
2017/0011973 X-RAY INSPECTION APPARATUS FOR INSPECTING SEMICONDUCTOR WAFERS
An x-ray inspection system includes a cabinet including an x-ray source, a sample support supporting a sample to be inspected, and an x-ray detector. The...
2017/0011972 METHOD AND STRUCTURE OF THREE DIMENSIONAL CMOS TRANSISTORS WITH HYBRID CRYSTAL ORIENTATIONS
A method for fabricating a three-dimensional integrated circuit device includes providing a first substrate having a first crystal orientation, forming at...
2017/0011971 METHODS AND DEVICES FOR ENHANCING MOBILITY OF CHARGE CARRIERS
Methods and devices for enhancing mobility of charge carriers. An integrated circuit may include semiconductor devices of two types. The first type of device...
2017/0011970 SEMICONDUCTOR DEVICES WITH SIDEWALL SPACERS OF EQUAL THICKNESS
Semiconductor structures with different devices each having spacers of equal thickness and methods of manufacture are disclosed. The method includes forming a...
2017/0011969 CMOS FIN INTEGRATION ON SOI SUBSTRATE
A method for complementary metal oxide semiconductor (CMOS) fin integration includes recessing a fin structure buried in a dielectric fill to form a trench in...
2017/0011968 METHOD FOR SEMICONDUCTOR DEVICE FABRICATION
A method of forming a semiconductor device includes receiving a substrate with a gate structure and forming a spacer layer over the substrate and the gate...
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