Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2017/0011967 METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming a first gate structure on a substrate, the first gate structure including a gate insulation...
2017/0011966 INTERCONNECT STRUCTURES AND FABRICATION METHOD THEREOF
An interconnect structure is provided. The interconnect structure includes a substrate; and at least a first interconnect component having a first contact...
2017/0011965 WAFER PROCESSING METHOD
There is provided a wafer processing method including a modified layer forming step. In the wafer processing method, the power of a pulse laser beam set in the...
2017/0011964 REUSABLE SEMICONDUCTOR SUBSTRATES
In example implementations, a plurality of material layers and a plurality of etch stop layers are grown on a first substrate. Ions are implanted through at...
2017/0011963 METHOD FOR USE IN MANUFACTURING A SEMICONDUCTOR DEVICE DIE
In one embodiment, a wafer includes a number of die areas each including a semiconductor device and dedicated to become a separate die. The die areas are...
2017/0011962 BACKSIDE CONTACT TO A FINAL SUBSTRATE
Device structures and fabrication methods for a backside contact to a final substrate. An electrically-conducting connection is formed that extends through a...
2017/0011961 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
The disclosure provides a semiconductor package structure, including a substrate having a front side and a back side, a first insulating layer disposed on the...
2017/0011960 CONDUCTIVE PLUG AND METHOD OF FORMING THE SAME
A method of forming a conductive plug is disclosed. A material layer having at least one opening is provided on a substrate. A first conductive layer is...
2017/0011959 CONNECTIBLE NANOTUBE CIRCUIT
Carbon nanotube template arrays may be edited to form connections between proximate nanotubes and/or to delete undesired nanotubes or nanotube junctions.
2017/0011958 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device may include: (a) loading a substrate into a process chamber, the substrate having: a process surface provided...
2017/0011957 SILICON-ON-INSULATOR DEVICE AND INTERMETALLIC DIELECTRIC LAYER STRUCTURE THEREOF AND MANUFACTURING METHOD
Provided is an intermetallic dielectric layer structure of a silicon-on-insulator device, comprising a silicon-rich oxide layer (54) covering a metal...
2017/0011956 Method for Producing an Integrated Circuit Device with Enhanced Mechanical Properties
Devices and methods for producing an integrated circuit device, comprising a front-end-of-line (FEOL) portion and a back-end-of-line (BEOL) portion, are...
2017/0011955 GRAPHENE LAYER TRANSFER
A method to transfer a layer of graphene from one substrate to another substrate is provided. The method includes providing a first layered structure...
2017/0011954 Method of Forming a Flexible Semiconductor Layer and Devices on a Flexible Carrier
A method for fabricating a semiconductor device comprises providing a preformed spalled structure comprising a stressor layer stack on a first surface of a...
2017/0011953 Method of Forming a Flexible Semiconductor Layer and Devices on a Flexible Carrier
A method for fabricating a semiconductor device comprises providing a preformed spalled structure comprising a stressor layer stack on a first surface of a...
2017/0011952 INSULATED GATE TYPE SEMICONDUCTOR DEVICE
An insulating gate type semiconductor device being capable of easily depleting an outer periphery region is provided. The insulating gate type semiconductor...
2017/0011951 APPARATUS FOR DEPOSITING A LAYER ON A SUBSTRATE IN A PROCESSING GAS
Apparatus for depositing a layer on a substrate in a process gas includes a chuck containing a first surface for supporting the substrate, a clamp for securing...
2017/0011950 MAGNETIC SUSCEPTOR TO BASEPLATE SEAL
A reaction system for processing semiconductor substrates is disclosed. In particular, the invention discloses an arrangement of a susceptor and a baseplate...
2017/0011949 PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET AND WORK PRODUCT MANUFACTURING METHOD
A protective film forming film 1 is provided in which the product of the breaking stress (MPa) measured at a measurement temperature of 0.degree. C. and the...
2017/0011948 SEMICONDUCTOR STRUCTURES INCLUDING CARRIER WAFERS AND METHODS OF USING SUCH SEMICONDUCTOR STRUCTURES
A semiconductor structure comprising a carrier wafer and a device wafer. The carrier wafer comprises trenches sized and configured to receive conductive...
2017/0011947 Method of Forming a Flexible Semiconductor Layer and Devices on a Flexible Carrier
A method for fabricating a semiconductor device comprises providing a preformed spalled structure comprising a stressor layer stack on a first surface of a...
2017/0011946 Method of Forming a Flexible Semiconductor Layer and Devices on a Flexible Carrier
A method for fabricating a semiconductor device comprises providing a preformed spalled structure comprising a stressor layer stack on a first surface of a...
2017/0011945 Methods to Reduce Debonding Forces on Flexible Semiconductor Films Disposed on Vapor-Releasing Adhesives
A method comprises providing a handle substrate having a front surface and a back surface; providing a layer of flexible semiconductor material having a front...
2017/0011944 Methods to Reduce Debonding Forces on Flexible Semiconductor Films Disposed on Vapor-Releasing Adhesives
A method comprises providing a handle substrate having a front surface and a back surface; providing a layer of flexible semiconductor material having a front...
2017/0011943 ATTITUDE CHANGING APPARATUS, ALIGNING APPARATUS, ATTITUDE CHANGING METHOD AND ALIGNING METHOD
An attitude changing apparatus which can change an attitude of a component with certainty without damaging the component. The component has a rectangular...
2017/0011942 FUME-REMOVING DEVICE
The present invention relates to an apparatus for removing fume which includes, a wafer cassette for stacking wafers; and an exhaust for exhausting the fume of...
2017/0011941 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM
A substrate processing apparatus, including: a development part configured to develop a substrate on which an exposed resist film formed to form a pattern on a...
2017/0011940 SUBSTRATE CONVEYANCE METHOD
When an edge of a wafer passes above a right sensor and a left sensor disposed in a conveyance route of the wafer to a substrate processing chamber, four edge...
2017/0011939 ETCHING METHOD
A method for selectively etching a first region of silicon oxide with respect to a second region of silicon nitride, includes: preparing a target object...
2017/0011938 REACTION CHAMBER AND PLASMA PROCESSING APPARATUS
Embodiments of the invention relate to a reaction chamber and a plasma processing apparatus, which include a chamber body, a dielectric window and a power...
2017/0011937 An Inkjet Coating Device and Coating Method
An inkjet coating device comprises a support board and a sprinkler head. The support board is provided for placing the glass plate, the sprinkler head...
2017/0011936 Semiconductor Device and Method of Depositing Encapsulant Along Sides and Surface Edge of Semiconductor Die in...
A semiconductor device has a semiconductor wafer including a plurality of semiconductor die. An insulating layer is formed over the semiconductor wafer. A...
2017/0011935 SEMICONDUCTOR MODULE RADIATOR PLATE FABRICATION METHOD, RADIATOR PLATE, AND SEMICONDUCTOR MODULE USING THE SAME
A semiconductor module radiator plate fabrication method includes soldering a plurality of insulating substrates of different shapes to a flat radiator plate,...
2017/0011934 FABRICATING PROCESS FOR REDISTRIBUTION LAYER
A metal sputtering or metal evaporating process is adopted in an initial fabricating step to fabricate a plurality of metal pads without having substantial...
2017/0011933 Methods to Reduce Debonding Forces on Flexible Semiconductor Films Disposed on Vapor-Releasing Adhesives
A method comprises providing a handle substrate having a front surface and a back surface; providing a layer of flexible semiconductor material having a front...
2017/0011932 HIGH-PRESSURE ANNEAL
A method of treating a semiconductor device is provided including the steps of loading the semiconductor device in a processing chamber, pressurizing the...
2017/0011931 ADJUSTABLE REMOTE DISSOCIATION
Methods of selectively etching an exposed portion of a patterned substrate relative to a second exposed portion are described. The etching process is a gas...
2017/0011930 METHOD OF FORMING GRAPHENE NANOPATTERN, GRAPHENE-CONTAINING DEVICE, AND METHOD OF MANUFACTURING THE...
Methods of forming a graphene nanopattern, graphene-containing devices, and methods of manufacturing the graphene-containing devices are provided. A method of...
2017/0011929 VERTICAL CHANNEL TRANSISTORS FABRICATION PROCESS BY SELECTIVE SUBTRACTION OF A REGULAR GRID
A grid comprising a first set of grid lines and a second set of grid lines is formed on a substrate using a first lithography process. At least one of the...
2017/0011928 SELF-ALIGNED FLOATING GATE IN A VERTICAL MEMORY STRUCTURE
A memory device or electronic system may include a memory cell body extending from a substrate, a self-aligned floating gate separated from the memory cell...
2017/0011927 Controlling the Reflow Behaviour of BPSG Films and Devices Made Thereof
A method for depositing an insulating layer includes performing a primary deposition over a sidewall of a feature by depositing a layer of silicate glass using...
2017/0011926 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Provided is a method of manufacturing a semiconductor device, including: forming a stacked metal nitride film including a first metal nitride film and a second...
2017/0011925 SEMICONDUCTOR STRUCTURE WITH RESIST PROTECTIVE OXIDE ON ISOLATION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A semiconductor structure includes an isolation structure, a gate stack, a spacer and a patterned resist protective oxide. The isolation structure is formed in...
2017/0011924 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
A dopant is ion-injected to a semiconductor layer formed of a group III-V compound semiconductor containing nitrogen as a Group V element. A first activation...
2017/0011923 METHOD AND APPARATUS FOR LIGHT-IRRADIATION HEAT TREATMENT
Light is applied for preheating from a halogen lamp to a lower surface of a semiconductor wafer supported on a susceptor within a chamber. Thereafter, flash...
2017/0011922 APPARATUS AND METHOD FOR LIGHT-IRRADIATION HEAT TREATMENT
Light is applied for preheating from a halogen lamp to a lower surface of a semiconductor wafer supported on a susceptor within a chamber. Thereafter, flash...
2017/0011921 HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS FOR SEMICONDUCTOR SUBSTRATE
A heat treatment method for a semiconductor substrate is provided which improves the shapes of the sharp corners at the opening and the bottom of a trench...
2017/0011920 LOW DEFECT RELAXED SiGe/STRAINED Si STRUCTURES ON IMPLANT ANNEAL BUFFER/STRAIN RELAXED BUFFER LAYERS WITH...
A method provides a substrate having a top surface; forming a first semiconductor layer on the top surface, the first semiconductor layer having a first unit...
2017/0011919 NITRIDE SEMICONDUCTOR SUBSTRATE
The present invention provides a nitride semiconductor substrate having an initial nitride and a nitride semiconductor sequentially stacked on one principal...
2017/0011918 EPITAXIAL-SILICON-WAFER MANUFACTURING METHOD AND EPITAXIAL SILICON WAFER
A manufacturing method of an epitaxial silicon wafer including a silicon wafer doped with boron and having a resistivity of 100 m.OMEGA..cndot.cm or less and...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.