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Patent # Description
2017/0018471 Physical Quantity Sensor
To provide a physical quantity sensor in which the influence of deformation of a package substrate on the measuring accuracy of a sensor element can be...
2017/0018470 SEMICONDUCTOR DEVICE
A technique is provided that can prevent cracking of a protective film in the uppermost layer of a semiconductor device and improve the reliability of the...
2017/0018469 APPARATUS, METHOD AND NONTRANSITORY COMPUTER READABLE MEDIUM FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE
According to one embodiment, a manufacturing apparatus for an integrated circuit device includes an etching treatment unit, a sensor, and a control unit. The...
2017/0018468 METHODS FOR PRODUCING INTEGRATED CIRCUITS WITH INTERPOSERS AND INTEGRATED CIRCUITS PRODUCED FROM SUCH METHODS
Methods of producing integrated circuits with interposers and integrated circuits produced from such methods are provided. In an exemplary embodiment, a method...
2017/0018467 X-RAY INSPECTION APPARATUS FOR INSPECTING SEMICONDUCTOR WAFERS
An x-ray inspection system including an x-ray source, a sample support for supporting a sample to be inspected, an x-ray detector, a sample positioning...
2017/0018466 SILICON-GERMANIUM FINFET DEVICE WITH CONTROLLED JUNCTION
Embodiments of the invention include a method for <something> and the resulting structure. A semiconductor device including a substrate, a ...
2017/0018465 SILICON GERMANIUM AND SILICON FINS ON OXIDE FROM BULK WAFER
A method for forming fins includes growing a SiGe layer and a silicon layer over a surface of a bulk Si substrate, patterning fin structures from the silicon...
2017/0018463 Dipole-Based Contact Structure to Reduce Metal-Semiconductor Contact Resistance in MOSFETs
A transistor device includes a substrate; a source region and a drain region formed over the substrate; and a source/drain contact formed in contact with at...
2017/0018462 SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
A semiconductor device is provided. A substrate includes a first region and a second region. A first wire pattern, extending in a first direction, is formed at...
2017/0018461 Semiconductor Device Including at Least One Lateral IGFET and at Least One Vertical IGFET and Corresponding...
A semiconductor device includes a semiconductor body having a first surface and a second surface opposite to the first surface, first trenches and second...
2017/0018460 SEMICONDUCTOR STRUCTURE WITH SELF-ALIGNED SPACERS AND METHOD OF FABRICATING THE SAME
A method of fabricating a semiconductor with self-aligned spacer includes providing a substrate. At least two gate structures are disposed on the substrate....
2017/0018459 INTERCONNECT STRUCTURE INCLUDING MIDDLE OF LINE (MOL) METAL LAYER LOCAL INTERCONNECT ON ETCH STOP LAYER
An interconnect structure includes an insulator stack on an upper surface of a semiconductor substrate. The insulator stack includes a first insulator layer...
2017/0018458 METHOD FOR CLEANING VIA OF INTERCONNECT STRUCTURE OF SEMICONDUCTOR DEVICE STRUCTURE
A method for forming the semiconductor device structure is provided. The method includes forming a metal layer in a first dielectric layer over a substrate and...
2017/0018457 Semiconductor Device Comprising an Oxygen Diffusion Barrier and Manufacturing Method
An embodiment of a method of manufacturing a semiconductor device includes forming an oxygen diffusion barrier on a first surface of a Czochralski or magnetic...
2017/0018456 Layered Benzocyclobutene Interconnected Circuit and Method of Manufacturing Same
An integrated circuit includes stacked benzocyclobutene layers and a circuit geometry comprising conductive electric traces and interconnects on and/or...
2017/0018455 UV-ASSISTED MATERIAL INJECTION INTO POROUS FILMS
Methods are described for reducing shrinkage experienced by porous films on a patterned substrate. The film may be a silicon-and-hydrogen-containing layer...
2017/0018454 METHOD FOR PREPARING LOW-WARPAGE SEMICONDUCTOR SUBSTRATE
Disclosed is a method for preparing a low-warpage semiconductor substrate. The method includes: providing a first substrate and a second substrate, the first...
2017/0018453 METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING ISOLATION LAYERS
A method of manufacturing a semiconductor device comprising the steps of: forming a trench at an upper portion of a semiconductor substrate forming a...
2017/0018452 METHODS FOR FABRICATING INTEGRATED CIRCUITS USING FLOWABLE CHEMICAL VAPOR DEPOSITION TECHNIQUES WITH...
Methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes forming an isolation trench...
2017/0018451 WAFER CLAMPING APPARATUS
A wafer clamping apparatus, including a plurality of support pins under a wafer, the plurality of pins to support the wafer; and a side clamp at a lateral side...
2017/0018449 RELEASABLE CARRIER AND METHOD
Disclosed herein is a releasable carrier that includes a supporting carrier, a carrier conductive layer, and a releasable tape located between the supporting...
2017/0018448 SEMICONDUCTOR DEVICE AND METHOD
Disclosed herein is a semiconductor device that includes a substrate having a conductive circuit and a first mold material encapsulating the conductive...
2017/0018447 MISALIGNMENT/ALIGNMENT COMPENSATION METHOD, SEMICONDUCTOR LITHOGRAPHY SYSTEM, AND METHOD OF SEMICONDUCTOR...
A misalignment/alignment compensation method for a lithography process includes the steps of: obtaining misalignment data associated with an alignment mark...
2017/0018446 ON THE FLY AUTOMATIC WAFER CENTERING METHOD AND APPARATUS
Substrate processing apparatus including a wafer transport apparatus with a transport arm including an end effector, an arm pose deterministic feature integral...
2017/0018445 3D IC BUMP HEIGHT METROLOGY APC
The present disclosure relates to a method of bump metrology that relies upon advanced process control (APC) to provide substrate warpage parameters describing...
2017/0018444 SUBSTRATE TRANSFER APPARATUS, SUBSTRATE TRANSFER METHOD, AND NON-TRANSITORY STORAGE MEDIUM
A substrate transfer apparatus to transfer a circular substrate provided with a cutout at an edge portion thereof, includes: a sensor part including three...
2017/0018443 CLUSTER TOOL TECHNIQUES WITH IMPROVED EFFICIENCY
Some embodiments relate to a cluster tool for semiconductor manufacturing. The cluster tool comprises a first transfer chamber having a first transfer robot....
2017/0018442 UNIT FOR SUPPLYING TREATMENT LIQUID AND APPARATUS FOR TREATING SUBSTRATE
Disclosed is an apparatus for treating a substrate. The apparatus includes a support unit that supports the substrate, and a treatment liquid supply unit that...
2017/0018441 METHODS AND APPARATUS FOR SUBSTRATE EDGE CLEANING
A substrate cleaning apparatus may include a substrate support having a support surface to support a substrate to be cleaned, wherein the substrate support is...
2017/0018440 ROBUST MULTI-LAYER WIRING ELEMENTS AND ASSEMBLIES WITH EMBEDDED MICROELECTRONIC ELEMENTS
An interconnect element 130 can include a dielectric layer 116 having a top face 116b and a bottom face 116a remote from the top face, a first metal layer...
2017/0018439 METAL REMOVAL WITH REDUCED SURFACE ROUGHNESS
Methods are described for etching metal layers that are difficult to volatize, such as cobalt, nickel, and platinum to form an etched metal layer with reduced...
2017/0018438 PATTERN FORMING METHOD AND BAKE CONDITION DETERMINING METHOD
In a pattern forming method according to an embodiment, a work film to be processed is formed on a substrate, and a resist pattern is formed on the top of the...
2017/0018436 RESIST UNDERLAYER FILM COMPOSTION, PATTERNING PROCESS, AND COMPOUND
The present invention provides a resist underlayer film composition for lithography, containing a compound having an indenofluorene structure. This resist...
2017/0018435 Semiconductor Device and Method of Manufacture
A semiconductor device and method of manufacturing are presented in which features of reduced size are formed using an irradiated mask material. In an...
2017/0018434 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Protons are injected from a back surface side of a semiconductor substrate to repair both defects within the semiconductor substrate and also defects in a...
2017/0018433 METHODS FOR DEPOSITING NICKEL FILMS AND FOR MAKING NICKEL SILICIDE AND NICKEL GERMANIDE
In one aspect, methods of silicidation and germanidation are provided. In some embodiments, methods for forming metal silicide can include forming a non-oxide...
2017/0018432 MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
A manufacturing method of a semiconductor structure having an array area and a periphery area is provided. The manufacturing method includes the following...
2017/0018431 SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A semiconductor manufacturing apparatus according to an embodiment includes a container that stores a processing liquid for plating processing of a substrate....
2017/0018430 SEMICONDUCTOR STRUCTURE AND MANUFACTURE METHOD THEREOF
A method of making a semiconductor structure can include: (i) forming a plurality of oxide layers on a semiconductor substrate; (ii) forming a plurality of...
2017/0018429 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
There are prepared a semiconductor substrate having a first main surface and a second main surface, and an adhesive tape having a third main surface and a...
2017/0018428 LITHOGRAPHY PROCESS FOR THE ENCAPSULATION OF PATTERNED THIN FILM COATINGS
A single lithography process for multi-layer metal/dielectric coatings using a series of developing, baking, and lifting steps to coat two or more thin films...
2017/0018427 METHOD OF SELECTIVE EPITAXY
Embodiments of the present disclosure generally relate to methods for trench filling of high quality epitaxial silicon-containing material without losing...
2017/0018426 SEMICONDUCTOR SUBSTRATES AND METHODS FOR PROCESSING SEMICONDUCTOR SUBSTRATES
Semiconductor substrates and methods for fabricating integrated circuits are provided. A method for fabricating an integrated circuit includes providing a...
2017/0018425 HETEROLEPTIC DIAZADIENYL GROUP 4 TRANSITION METAL-CONTAINING COMPOUNDS FOR VAPOR DEPOSITION OF GROUP 4...
Disclosed are Group 4 transition metal-containing thin film forming precursors. Also disclosed are vapor deposition methods using the disclosed precursors to...
2017/0018424 METHOD FOR CLEANING LANTHANUM GALLIUM SILICATE WAFER
The present disclosure provides a method for cleaning a lanthanum gallium silicate wafer which comprises the following steps: at a step of 1, a cleaning...
2017/0018423 Apparatus and Method for Processing the Surface of a Workpiece Comprised of Sensitive Materials with an Ozone...
An process including supplying a mixture of a treatment liquid, ozone, carbon dioxide and optional agents for treatment of a non-diced or diced workpiece...
2017/0018421 STRESS RELAXED BUFFER LAYER ON TEXTURED SILICON SURFACE
A method of forming a stress relaxed buffer layer (SRB) on a textured or grooved silicon (Si) surface and the resulting device are provided. Embodiments...
2017/0018420 METHOD FOR PROTECTING LAYER BY FORMING HYDROCARBON-BASED EXTEMELY THIN FILM
A method for protecting a layer includes: providing a substrate having a target layer; depositing a protective layer on the target layer, which protective...
2017/0018419 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM
A method of manufacturing: a semiconductor device includes fanning an oxide film containing a metal element on a substrate by performing a cycle a...
2017/0018418 AN ELECTROSTATIC ION TRAP MASS SPECTROMETER UTILIZING AUTORESONANT ION EXCITATION AND METHODS OF USING THE SAME
Methods of operation of electrostatic ion trap mass spectrometers in which ions are autoresonantly driven at selected higher integer (>2) multiples of ion...
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