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Patent # Description
2017/0025664 BATTERY MODULE
A battery module includes a cell assembly comprising a plurality of cells; a module housing including an upper housing having a closed inner space...
2017/0025661 SENSOR LEAD SECURING ASSEMBLY AND METHOD
An exemplary electrified vehicle assembly includes a sensor lead, and a busbar having a protrusion that secures the sensor lead to electrically connect the...
2017/0025658 MEMBRANES, SEPARATORS, BATTERIES, AND METHODS
In accordance with at least selected embodiments, novel or improved porous membranes or substrates, separator membranes, separators, composites,...
2017/0025647 PACKAGING MATERIAL FOR ELECTRICAL STORAGE DEVICES, ELECTRICAL STORAGE DEVICE, AND METHOD FOR PRODUCING EMBOSSED...
A packaging material for electrical storage devices which includes a base layer, a metal foil layer arranged on the base layer, and a sealant layer arranged on...
2017/0025646 SINGLE POUCH BATTERY CELLS AND METHODS OF MANUFACTURE
Apparatus, systems, and methods described herein relate to the manufacture and use of single pouch battery cells. In some embodiments, an electrochemical cell...
2017/0025644 FILM FORMING APPARATUS, SUBSTRATE PROCESSING APPARATUS AND DEVICE MANUFACTURING METHOD
A film forming apparatus, a substrate processing apparatus, and a device manufacturing method are provided, which improve the film thickness uniformity of a...
2017/0025636 LAMINATED SHEET FOR SEALING ELECTRONIC ELEMENTS AND PRODUCTION METHOD FOR ELECTRONIC DEVICES
A laminated sheet for sealing electronic elements is configured to comprise: a first long release sheet; a plurality of sealing materials that are laminated on...
2017/0025635 MIXED METAL-SILICON-OXIDE BARRIERS
A method of forming a thin barrier film of a mixed metal-silicon-oxide is disclosed. For example, a method of forming an aluminum-silicon-oxide mixture having...
2017/0025626 Metal Complexes Comprising Diazabenzmidazolocarbene Ligands and the Use Thereof in OLEDS
The present invention relates to metal-carbene complexes comprising a central atom selected from iridium and platinum, and diazabenzimidazolocarbene ligands,...
2017/0025624 Metal Complex and Organic Light-Emitting Component
A metal complex and an organic light-emitting component are disclosed. In an embodiment the metal complex includes the following structural formula I: ...
2017/0025618 Organic Electroluminescent Materials and Devices
Compounds containing indolocarbazole and terphenyl building blocks are disclosed in this application. These compounds are useful for application in organic...
2017/0025616 ANTHRACENE COMPOUND, LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC APPLIANCE, AND LIGHTING DEVICE
An organic compound having a high T.sub.1 level is provided. An element emitting phosphorescence in the blue and green regions is provided. An organic compound...
2017/0025608 PHOTOACTIVE COMPOSITION
There is disclosed a photoactive composition; and there is also disclosed an organic electronic device comprising a first electrical contact, a second...
2017/0025598 ELECTRONIC DEVICE
This technology provides an electronic device. An electronic device in accordance with an implementation of this document includes a semiconductor memory, and...
2017/0025584 COLOR-CONVERTING SUBSTRATE FOR LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING SAME
The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a...
2017/0025576 CONTROL OF P-CONTACT RESISTANCE IN A SEMICONDUCTOR LIGHT EMITTING DEVICE
A device according to embodiments of the invention includes a semiconductor structure including a light emitting layer disposed between an n-type region and a...
2017/0025575 Light Emitting Diode Chip and Fabrication Method
A light emitting diode chip includes an epitaxial layer with a plurality of recess portions and protrusion portions over the top layer; a light transmission...
2017/0025573 SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE USING SAME
A semiconductor light emitting device may include a substrate including: a first region having a first pattern; and a second region having a second pattern...
2017/0025567 LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
A light-emitting device comprises a carrier; and a first semiconductor element comprising a first semiconductor structure and a second semiconductor structure,...
2017/0025550 BRIDGE DIODE AND METHOD FOR MANUFACTURING THE SAME
Provided is a bridge diode according to an embodiment of the inventive concept. The bridge diode includes a first structure including a first lower nitride...
2017/0025542 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A highly reliable semiconductor device and a method for manufacturing the semiconductor device are provided. The semiconductor device is manufactured with a...
2017/0025539 DUAL-MATERIAL MANDREL FOR EPITAXIAL CRYSTAL GROWTH ON SILICON
In one example, a method for fabricating a semiconductor device includes etching a layer of silicon to form a plurality of fins and growing layers of a...
2017/0025524 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes an N-type silicon carbide layer, a P-type region, an N-type source region, a P-type contact region, a gate insulating film, a...
2017/0025521 SEMICONDUCTOR DEVICE
The semiconductor device includes: a plurality of interlayer insulation films, each interlayer insulation film covering a front surface of a corresponding one...
2017/0025509 STRAINED SILICON GERMANIUM FIN WITH CONTROLLED JUNCTION FOR FINFET DEVICES
FinFET structures are formed on silicon germanium fins. Both the sides and the top surfaces of the source/drain regions of the fins are etched, thereby...
2017/0025488 ORGANIC LIGHT EMITTING DIODE ARRAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND DISPLAY DEVICE
An organic light emitting diode array substrate, a method for manufacturing the same and a display device are provided. The organic light emitting diode array...
2017/0025484 Devices Combining Thin Film Inorganic LEDs with Organic LEDs and Fabrication Thereof
Devices including organic and inorganic LEDs are provided. Techniques for fabricating the devices include fabricating an inorganic LED on a parent substrate...
2017/0025467 PROCESS MODULE FOR INCREASING THE RESPONSE OF BACKSIDE ILLUMINATED PHOTOSENSITIVE IMAGERS AND ASSOCIATED METHODS
Backside illuminated photosensitive devices and associated methods are provided. In one aspect, for example, a backside-illuminated photosensitive imager...
2017/0025461 IMAGE SENSOR HAVING SHIELDING STRUCTURE
An image sensor is provided. The image sensor includes a substrate, a first interlayer insulating layer, a first metal line, and a shielding structure. The...
2017/0025457 Buried Channel Deeply Depleted Channel Transistor
Semiconductor devices and methods of fabricating such devices are provided. The devices include source and drain regions on one conductivity type separated by...
2017/0025455 IMAGING DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING IMAGING DEVICE
An imaging device includes: a photodiode configured to perform photoelectric conversion and to generate electric charge in accordance with an amount of...
2017/0025439 PIXEL STRUCTURE
An active device of a pixel structure includes a semiconductor layer, an insulation layer covering the semiconductor layer, a gate electrode disposed on the...
2017/0025431 THREE-DIMENSIONAL MEMORY DEVICE WITH METAL AND SILICIDE CONTROL GATES
An alternating stack of insulating layers and sacrificial material layers is formed on a substrate. Separator insulator structures can be optionally formed...
2017/0025425 Select Gates with Central Open Areas
A NAND flash memory array includes a select line having a first edge region containing a first portion of floating gate material and a second edge region...
2017/0025424 Self-Aligned Source For Split-Gate Non-volatile Memory Cell
A memory device having a pair of conductive floating gates with inner sidewalls facing each other, and disposed over and insulated from a substrate of first...
2017/0025419 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES...
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the...
2017/0025415 SEMICONDUCTOR DEVICE
A semiconductor device for efficiently compressing a large volume of image data is provided. The semiconductor device includes a memory cell array, an analog...
2017/0025412 TECHNIQUES FOR FORMING VERTICAL TRANSISTOR ARCHITECTURES
Techniques are disclosed for forming vertical transistor architectures. In accordance with some embodiments, a semiconductor layer is disposed over a lower...
2017/0025410 SEMICONDUCTOR DEVICE
A semiconductor device includes: an IGBT section including a vertical IGBT; and a diode section arranged along the IGBT section and including a diode. The...
2017/0025407 CASCODE CONFIGURED SEMICONDUCTOR COMPONENT
In accordance with an embodiment, semiconductor component includes a compound semiconductor material based semiconductor device coupled to a silicon based...
2017/0025401 Conductive Line Patterning
A conductive line structure includes two conductive lines in a layout. The two cut lines are over at least a part of the two conductive lines in the layout....
2017/0025400 SYSTEM-IN-PACKAGE LOGIC AND METHOD TO CONTROL AN EXTERNAL PACKAGED MEMORY DEVICE
Techniques and mechanisms for a SIP to control access to a non-volatile memory of another packaged device. In an embodiment, the SIP includes interface a...
2017/0025399 DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
A display apparatus and a method of manufacturing the same are disclosed. The display apparatus includes: a first substrate including a light emitting diode...
2017/0025389 Three-Dimensional Mask-Programmed Read-Only Memory With Reserved Space
The present invention discloses a 3D-MPROM with reserved level (3D-MPROM.sub.RL). Versions of the 3D-MPROM.sub.RL, including an original 3D-MPROM.sub.RL and at...
2017/0025386 SEMICONDUCTOR DEVICE
A semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip in a stacking direction. The...
2017/0025385 SOLID STATE DRIVE PACKAGE AND DATA STORAGE SYSTEM INCLUDING THE SAME
A solid state drive (SSD) package type has a lower package including a lower package substrate, a controller chip mounted on the lower package substrate, and a...
2017/0025381 HYBRID BOND USING A COPPER ALLOY FOR YIELD IMPROVEMENT
An integrated circuit (IC) using a copper-alloy based hybrid bond is provided. The IC comprises a pair of semiconductor structures vertically stacked upon one...
2017/0025373 Method for Positioning a Semiconductor Chip on a Carrier and Method for Material-Fit Bonding of a Semiconductor...
A semiconductor chip includes a semiconductor body having a bottom side and a top side opposite the bottom side, and passivation arranged on the top side. The...
2017/0025371 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing semiconductor devices is provided. In the method, a conductive pad and a metal protrusion pattern are formed in a metallization...
2017/0025368 CONDUCTIVE SEAL RING FOR POWER BUS DISTRIBUTION
A multi-block semiconductor device includes a first block and a second block operating in different power regimes from each other. A seal ring is around a...
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