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Patent # Description
2017/0033571 BATTERY BALANCING APPARATUS AND BATTERY BALANCING METHOD THEREOF
A battery balancing apparatus configured to perform a battery balancing for a battery pack is provided. The battery balancing apparatus includes n energy...
2017/0033565 MOTOR CONTROL APPARATUS IN WHICH POWER REGENERATION ARE ADJUSTED, CONTROLLER FOR CONVERTER, MACHINE LEARNING...
A machine learning apparatus includes a state observation unit which observes a state variable including at least one of data associated with the value of a DC...
2017/0033544 RE-ENTERABLE ENCLOSURE
An enclosure (20, 220) includes a housing (22, 222) and a sealing unit (48, 42a, 232) that mounts within a sealing unit opening (28, 230) of the housing. The...
2017/0033517 CONNECTOR STRUCTURE, JACK, PLUG, AND ELECTRONIC DEVICE
A connector structure includes a jack including a receiver, and a plug connectable to the jack. The jack includes a wall located around the receiver and...
2017/0033513 CONNECTING DEVICE AND METHOD FOR RECOGNIZING DEVICE
A connecting device is provided that connects first and second external electronic devices with different types of interfaces. The connecting device includes a...
2017/0033486 TERMINAL PAIR AND CONNECTOR PAIR INCLUDING TERMINAL PAIR
A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first...
2017/0033485 CONTACT CONNECTION STRUCTURE
A contact connection structure includes: a first contact portion including an indent portion spherically protruding, the first contact portion including a...
2017/0033476 ELECTRICAL CONNECTOR
An electrical connector for electrically connecting to a chip module. The chip module includes a base plate and a protruding portion projecting upward from the...
2017/0033471 Antenna System
An antenna system includes a system ground plane, a first antenna array, and a second antenna array. The first antenna array includes a first antenna element,...
2017/0033448 ANTENNA FOR APPENDAGE-WORN MINIATURE COMMUNICATIONS DEVICE
Antennas, antenna systems, and communications devices are described that provide an antenna utilizing a fractal and/or self-similar conductive element that is...
2017/0033422 METAL AIR BATTERY AND CATHODE CURRENT COLLECTOR INCLUDED THEREIN
A metal air battery includes: at least one gas diffusion layer including a first surface and a second surface facing the first surface; at least one cathode...
2017/0033386 PROTON CONDUCTOR, METHOD FOR PRODUCING PROTON CONDUCTOR, AND FUEL CELL
A proton conductor includes a coordination polymer having stoichiometrically metal ions, oxoanions, and proton coordinating molecules capable of undergoing...
2017/0033383 AQUEOUS ALL-COPPER REDOX FLOW BATTERY
The present disclosure relates to aqueous all-copper redox flow batteries. This battery comprises at least one first and second half-cell compartments...
2017/0033359 SECONDARY BATTERY
A secondary battery in which the difference between the voltage at the time of discharging and the voltage at the time of charging is small, ensuring good...
2017/0033336 ENERGY STORAGE APPARATUS
An energy storage apparatus includes: prismatic energy storage devices that are arranged in a row in a first direction and a holder; the holder holds the...
2017/0033323 MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE, MODULE, AND ELECTRONIC DEVICE
A highly reliable light-emitting device is provided. A yield in a manufacturing process of a light-emitting device is increased. A light-emitting device is...
2017/0033316 ORGANIC LIGHT EMITTING DIODE ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
The present invention relates to the field of display, and discloses an organic light emitting diode array substrate, a manufacturing method thereof, and a...
2017/0033315 METHOD OF MANUFACTURING DISPLAY DEVICE
A method of manufacturing a display device includes forming an electrode layer including a first metallic element on a substrate; sequentially forming an...
2017/0033296 MATERIALS FOR ORGANIC ELECTROLUMINESCENT DEVICES
The invention relates to compounds of the formula (1) which are suitable for use in electronic devices, in particular organic electroluminescent devices.
2017/0033289 MATERIAL FOR ORGANIC ELECTROLUMINESCENT DEVICE AND ORGANIC ELECTROLUMINESCENT DEVICE INCLUDING THE SAME
A material for an organic electroluminescent device, represented by Formula 1, and an organic electroluminescent device including the same. The material for an...
2017/0033281 Systems and Methods for Implementing Magnetoelectric Junctions Including Integrated Magnetization Components
Systems and methods in accordance with embodiments of the invention implement magnetoelectric junctions that include integrated magnetization components. In...
2017/0033279 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
An electronic device may include a semiconductor memory. The semiconductor memory may include a substrate including a first region and a second region; buried...
2017/0033268 LIGHT-EMITTING DIODE (LED) PACKAGE
A light-emitting diode (LED) package includes a light-emitting structure including a first conductive-type semiconductor layer, an active layer, and a second...
2017/0033267 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
A light emitting device is provided. The light emitting device includes a light emitting element, a wavelength converting member, a light transmissive member,...
2017/0033256 ULTRAVIOLET PHOTODETECTORS AND METHODS OF MAKING ULTRAVIOLET PHOTODETECTORS
A method of making an ultraviolet sensor includes applying a metal-containing solution to a substrate using a spin coating technique to form a metal-containing...
2017/0033253 DOPED MULTIPLIER AVALANCHE PHOTODIODE
An epitaxial grown avalanche photodiode (APD), the avalanche photodiode comprising an anode, a cathode, an absorber, and a doped multiplier. The absorber and...
2017/0033245 LAYER SYSTEM FOR THIN-FILM SOLAR CELLS
A layer system (1) for thin-film solar cells (100), comprising an absorber layer (4), which contains a chalcogenide compound semiconductor, and a buffer layer...
2017/0033225 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
A semiconductor device includes an isolation layer defining an active region formed in a semiconductor substrate. A first recessing process is performed on the...
2017/0033220 SEMICONDUCTOR DEVICE INCLUDING FIN STRUCTURES DISPOSED OVER BUFFER STRUCTURES AND MANUFACTURING METHOD THEREOF
A semiconductor FET device includes a buffer structure and a fin structure. The buffer structure has a fin shape, is disposed over a substrate and extends...
2017/0033219 SEMICONDUCTOR DEVICE INCLUDING FIN HAVING CONDENSED CHANNEL REGION
A finFET semiconductor device includes at least one semiconductor fin on an upper surface of a substrate. The semiconductor fin includes a channel region...
2017/0033211 FACILITATION OF INCREASED LOCKING RANGE TRANSISTORS
Transistors can be used for a variety of electronic-based applications. Therefore, transistor efficiency and performance is of importance. An apparatus is...
2017/0033183 Strained Group IV Channels
Disclosed herein is a semiconductor structure including: (i) a monocrystalline substrate having a top surface, (ii) a non-crystalline structure overlying the...
2017/0033177 LEAKAGE-FREE IMPLANTATION-FREE ETSOI TRANSISTORS
A semiconductor device includes an extremely thin semiconductor-on-insulator substrate (ETSOI) having a base substrate, a thin semiconductor layer and a buried...
2017/0033174 Electrode for a metal-insulator-metal structure, capacitor of metal-insulator-metal type, and method for...
The electrode for a structure of Metal-Insulator-Metal type is formed by a stack successively comprising a gold layer, a barrier layer made from electrically...
2017/0033164 COLOR FILM SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, OLED DISPLAY PANEL AND DISPLAY APPARATUS
Embodiments of the present invention disclose a color filter substrate including: a base plate, and a black matrix layer and a barrier pad layer disposed...
2017/0033157 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device including: a first member including a selection transistor on a front surface side of a first substrate; and a second member including a...
2017/0033147 IMAGE SENSOR DEVICE
An image sensor device includes a substrate having a pixel array region, isolation structures in the substrate separating pixel regions from one another in the...
2017/0033138 Crosstalk Improvement Through P on N Structure for Image Sensor
The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a semiconductor substrate having a first type of...
2017/0033123 DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE
The invention provides a display substrate and a manufacturing method thereof, and a display device. The display substrate comprises: a base, and gate lines...
2017/0033120 VERTICAL NEUROMORPHIC DEVICES STACKED STRUCTURE AND ARRAY OF THE STRUCTURE
Provided is a vertical neuromorphic devices stacked strticture comprising a main gate which is formed on a substrate and has a vertical pillar shape, a main...
2017/0033112 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
A semiconductor device structure is provided. The semiconductor device structure includes a substrate. The semiconductor device structure includes a conductive...
2017/0033107 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a substrate including at least one metal-oxide-semiconductor field-effect transistor (MOSFET) region defined by a device...
2017/0033090 SMD/IPD ON PACKAGE OR DEVICE STRUCTURE AND METHODS OF FORMING
Package structures and methods of forming them are described. In an embodiment, a package structure includes an integrated circuit die embedded in an...
2017/0033087 STACK SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A stack semiconductor package structure includes a substrate; a second chip comprising a plurality of conductive bumps formed on a surface thereof; and a first...
2017/0033076 PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
Provided is a production method for a semiconductor package making it possible to embed, in its irregularities, a thermosetting resin sheet satisfactorily. The...
2017/0033065 Methods of Forming Connector Pad Structures, Interconnect Structures, and Structures Thereof
Methods of forming connector pad structures, interconnect structures, and structures thereof are disclosed. In some embodiments, a method of forming a...
2017/0033048 SEMICONDUCTOR DEVICES
A semiconductor device includes a substrate with lower structures, an insulation layer covering the lower structures on the substrate, a contact hole through...
2017/0033030 INTERCONNECT ARRANGEMENT WITH STRESS-REDUCING STRUCTURE AND METHOD OF FABRICATING THE SAME
A semiconductor device structure and a method of fabricating the same are provided. The semiconductor device structure includes a gate structure embedded in a...
2017/0033029 METHOD OF MAKING A PLURALITY OF SEMICONDUCTOR DEVICES
A method of making a plurality of semiconductor devices comprising a chip scale packages. The method includes providing a semiconductor wafer having a major...
2017/0033012 METHOD FOR FABRICATING FIN OF FINFET OF SEMICONDUCTOR DEVICE
A method for fabricating a semiconductor device on a wafer includes: patterning a plurality of fins on the wafer; forming a shallow-trench isolation region to...
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