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Patent # Description
2017/0053957 IMAGING ELEMENT AND IMAGING APPARATUS
An imaging element comprises a photoelectric conversion unit formed in a pixel region and configured to convert light into electrical charge. Further, the...
2017/0053942 STRAINED FINFET DEVICE FABRICATION
A method for forming a fin on a substrate comprises patterning and etching a layer of a first semiconductor material to define a strained fin, depositing a...
2017/0053939 THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME, ARRAY SUBSTRATE AND DISPLAY PANEL
Embodiments of the present application provide a thin film transistor and a method of manufacturing the same, an array substrate and a display panel. The thin...
2017/0053922 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
In a semiconductor device, a memory cell is formed of a control gate electrode and a memory gate electrode adjacent to each other, a gate insulating film...
2017/0053914 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
A semiconductor device includes a semiconductor substrate, a stress generation source that is provided on the semiconductor substrate and generates stress in...
2017/0053912 FINFET WITH SOURCE/DRAIN STRUCTURE AND METHOD OF FABRICATION THEREOF
A method of semiconductor fabrication that includes providing a plurality of fins extending from a substrate is described. Each of the plurality of fins has a...
2017/0053909 FIELD EFFECT TRANSISTOR HAVING TWO-DIMENSIONALLY DISTRIBUTED FIELD EFFECT TRANSISTOR CELLS
A Field Effect Transistor (FET) having: a plurality of FET cells having a plurality of source pads, a plurality of drain pads, and a plurality of gate...
2017/0053900 SEMICONDUCTOR DEVICE
A semiconductor device includes a first semiconductor chip including plural circuit blocks provided on a semiconductor substrate, and plural through-silicon...
2017/0053882 ELECTRONIC DEVICE HAVING A REDISTRIBUTION AREA
An electronic device includes an upper insulating layer on a substrate. An upper redistribution structure is embedded in the upper insulating layer. The upper...
2017/0053869 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, the stacked body includes a plurality of metal films, a plurality of silicon oxide films, and a plurality of intermediate films....
2017/0053867 MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
Provided is a memory device including a plurality of first conductive line layers, a plurality of support structures, and a charge storage layer. Each of the...
2017/0053864 Method of Forming Metal Interconnection
A method of fabricating a semiconductor device is disclosed. The method includes forming a dielectric layer over a substrate, forming a trench in the...
2017/0053863 Structure and Method for Interconnection
The present disclosure provides a method of fabricating an integrated circuit in accordance with some embodiments. The method includes providing a substrate...
2017/0053861 POWER SEMICONDUCTOR MODULE AND POWER UNIT
A power semiconductor module includes: a plurality of semiconductor element substrates disposed on the same plane, each of which includes an insulating...
2017/0053859 ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
A method for fabricating an electronic package is provided, including the steps of: providing an interposer having a plurality of conductive vias and at least...
2017/0053856 SEMICONDUCTOR DIE ATTACHMENT WITH EMBEDDED STUD BUMPS IN ATTACHMENT MATERIAL
The embodiments of the present disclosure relate to a semiconductor device and a manufacturing method therefor. The semiconductor device comprises: a die...
2017/0053854 Packaged Device with Additive Substrate Surface Modification
A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a...
2017/0053852 POWER-MODULE SUBSTRATE UNIT AND POWER MODULE
A power-module substrate unit having at least one power-module substrate including one ceramic substrate, a circuit layer formed on one surface of the ceramic...
2017/0053849 Thermal Dissipation Through Seal Rings in 3DIC Structure
A die includes a semiconductor substrate, a through-via penetrating through the semiconductor substrate, a seal ring overlying and connected to the...
2017/0053846 SEMICONDUCTOR DEVICE
A semiconductor device includes a memory component, which is a semiconductor component (a semiconductor chip or a semiconductor package), to be mounted over an...
2017/0053842 Method And Apparatus For Analysis Of Processing Of A Semiconductor Wafer
An apparatus and a method for analysis of processing of a semiconductor wafer is disclosed which comprises gathering a plurality of items of processing data,...
2017/0053834 FINFET DEVICES HAVING GATE DIELECTRIC STRUCTURES WITH DIFFERENT THICKNESSES ON SAME SEMICONDUCTOR STRUCTURE
FinFET devices are formed on the same semiconductor structure wherein at least one finFET device has a gate dielectric structure that is different in thickness...
2017/0053824 ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
An electronic device is disclosed, which comprises: a first substrate; an adhesion layer disposed on the first substrate and comprising a condensation product...
2017/0053814 Packaged Semiconductor Device Having Leadframe Features Preventing Delamination
A semiconductor device has a leadframe with a first (401a) and a parallel second surface, and an assembly pad (410) bordered by two opposing sides, which...
2017/0053813 METHODS OF FABRICATING PACKAGE SUBSTRATES HAVING EMBEDDED CIRCUIT PATTERNS
There is provided a method of fabricating a package substrate. The method may include forming an isolation trench in a conductive layer, and forming a first...
2017/0053808 SELF LIMITING LATERAL ATOMIC LAYER ETCH
Methods of and apparatuses for laterally etching semiconductor substrates using an atomic layer etch process involving exposing an oxidized surface of a...
2017/0053797 SELECTIVE ATOMIC LAYER DEPOSITION PROCESS UTILIZING PATTERNED SELF ASSEMBLED MONOLAYERS FOR 3D STRUCTURE...
Methods for forming fin structure with desired materials formed on different locations of the fin structure using a selective deposition process for three...
2017/0053787 COUPLING DEVICES AND SOURCE ASSEMBLIES INCLUDING THEM
Certain embodiments described herein are directed to couplers that can be used to provide a seal between a source assembly and a vacuum chamber. In certain...
2017/0053785 Mass Spectrometer With Reduced Potential Drop
A method of mass spectrometry is disclosed comprising providing a first device and a second device disposed downstream of the first device. The method further...
2017/0053780 TARGET SUPPLY DEVICE, TARGET MATERIAL REFINING METHOD, RECORDING MEDIUM HAVING TARGET MATERIAL REFINING PROGRAM...
A target supply device may be provided with a tank configured to contain a metal as a target material, a nozzle having a nozzle hole through which the target...
2017/0053761 Polar Relay
A polar relay is provided including: an insulation housing, an armature assembly, and a coil assembly. The armature assembly is pivotably mounted within the...
2017/0053758 ELECTRICAL CIRCUIT BREAKER
This electrical circuit breaker includes at least one first fixed land, a support assembly equipped with at least one second land rotationally mobile, about a...
2017/0053754 INFORMATION PROCESSING DEVICE
An electronic device includes: a case; a switch:, an operation button; a press portion that projects out from a length direction central portion of a button...
2017/0053749 Method of manufacturing graphene composite including ultrasonic-wave pulverization post-treatment process and...
Disclosed is a method of manufacturing a graphene composite including an ultrasonic-wave pulverization post-treatment process. The method includes radiating a...
2017/0053738 CIRCUIT DEVICE
A circuit device, includes a semiconductor substrate, and a first inductor provided over said semiconductor substrate, and a first interconnect provided over...
2017/0053730 Transformer Component with Setting of an Inductance
A transformer component for setting an inductance and method for manufacturing a transformer component are disclosed. In an embodiment, the transformer...
2017/0053727 LAMINATED COIL COMPONENT AND MANUFACTURING METHOD FOR THE SAME
In a laminated coil component include coil conductors are respectively included on magnetic layers and a carbon paste is included on a magnetic layer. The coil...
2017/0053726 COIL COMPONENT, ITS MANUFACTURING METHOD, AND CIRCUIT SUBSTRATE PROVIDED WITH THE COIL COMPONENT
Disclosed herein is a coil component that includes a drum-shaped core having a flange portion and a winding core around which a wire is wound. The flange...
2017/0053724 PERMANENT MAGNET COMPRISING A STACK OF FERROMAGNETIC AND ANTIFERROMAGNETIC LAYERS
A permanent magnet includes at least two antiferromagnetic layers and at least two first ferromagnetic layers. A magnetization direction of each first...
2017/0053719 CATALYST FOR ACTIVE HYDROGEN RECOMBINER AND PROCESS FOR MAKING THE CATALYST
A process of producing a catalyst entails providing an alumina substrate and adhering a noble metal consisting of either platinum or palladium to an outer...
2017/0053711 MULTI-CHANNEL TESTING
Apparatus and methods can include an interface chip that can include a test channel to couple to a memory tester, a memory channel controller to couple with a...
2017/0053702 HIGH VOLTAGE REGULATOR
Disclosed herein is a regulator for a non-volatile memory is provided. The regulator comprises an operational amplifier for receiving a reference voltage and a...
2017/0053696 SEMICONDUCTOR MEMORY DEVICE
Provided is a semiconductor memory device. The semiconductor memory device includes: a memory cell; a sensing circuit connected to the memory cell via a first...
2017/0053684 NONVOLATILE MEMORY DEVICE FOR PERFORMING DUTY CORRECTION OPERATION, MEMORY SYSTEM, AND OPERATING METHOD THEREOF
A nonvolatile memory device suitable for sequentially performing a ZQ calibration operation and a read operation in response to a ZQ calibration enable signal...
2017/0053681 SEMICONDUCTOR MEMORY DEVICE WITH INPUT/OUTPUT LINE
Various embodiments relate to a semiconductor device. The semiconductor device may include a plurality of mats configured to input and output the data of...
2017/0053676 SYSTEM AND METHOD FOR STREAMING AND RECORDING VIDEO
Dynamic buffering of streaming temporal video is disclosed. In at least one embodiment, a non-transitory memory is provided for storing machine instructions...
2017/0053668 METHOD FOR MAKING A PERPENDICULAR MAGNETIC RECORDING WRITE HEAD WITH WRITE POLE HAVING THIN SIDE GAPS AND...
Ionized physical vapor deposition (IPVD) is used to form a magnetic recording disk drive write head main pole with thin side gap layers and a thicker leading...
2017/0053665 ASSESSING DISORDERS THROUGH SPEECH AND A COMPUTATION MODEL
In a system and method for assessing the condition of a subject, control parameters are derived from a neurophysiological computational model that operates on...
2017/0053660 SYSTEMS AND METHODS FOR IMPLEMENTING CROSS-FADING, INTERSTITIALS AND OTHER EFFECTS DOWNSTREAM
Systems and methods are presented for cross-fading (or other multiple clip processing) of information streams on a user or client device, such as a telephone,...
2017/0053658 HIGH-BAND TARGET SIGNAL CONTROL
A method for generating a high-band target signal includes receiving, at an encoder, an input signal having a low-band portion and a high-band portion. The...
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