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Patent # Description
2017/0069859 DOPING-INDUCED CARRIER DENSITY MODULATION IN POLYMER FIELD-EFFECT TRANSISTORS
A method of fabricating an organic field effect transistor (OFET), including forming a source contact, a drain contact, and a gate connection to a channel...
2017/0069858 METHODS AND SYSTEMS FOR SCAFFOLDS COMPRISING NANOELECTRONIC COMPONENTS
The present invention generally relates to nanoscale wires and tissue engineering. Systems and methods are provided in various embodiments for preparing cell...
2017/0069857 Organic Electroluminescent Materials and Devices
This invention discloses oligosilane compounds. These compounds can be used in OLEDs.
2017/0069856 COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME
A compound having a high glass transition temperature, high electric stability, and/or high luminescent efficiency, and an organic light-emitting device...
2017/0069854 FUSED POLYCYCLIC HETEROAROMATIC COMPOUND, ORGANIC THIN FILM INCLUDING COMPOUND AND ELECTRONIC DEVICE INCLUDING...
A low-molecular-weight fused polycyclic heteroaromatic compound includes a compound represented by Chemical Formula 1A, a compound represented by Chemical...
2017/0069849 COMPOUND AND ORGANIC LIGHT-EMITTING DEVICE INCLUDING THE SAME
An organic light-emitting device includes: a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode...
2017/0069843 DEPOSITION MASK AND METHOD OF FABRICATING THE SAME
A method of fabricating a deposition mask, the method including forming a photoresist pattern on a base member, the photoresist pattern having a plurality of...
2017/0069842 ORGANIC LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME USING THIN FILM FABRICATING APPARATUS
A thin film fabricating apparatus includes an electrode part which sprays a thin film material as electrified spray particles, a substrate holder disposed...
2017/0069809 LIGHT-EMITTING DIODE PACKAGE
A light-emitting diode package is provided. The light-emitting diode package includes a lead-frame, a reflective cup and a die. The lead-frame is made of a...
2017/0069802 LIGHT EMITTING DEVICE INCLUDING QUANTUM DOTS
A light emitting device including a light emitting element having a light emitting surface and an optical component comprising an optical material comprising...
2017/0069798 PRINTED CIRCUIT BOARD AND LIGHT-EMITTING DEVICE INCLUDING SAME
The present invention relates to a printed circuit board having an improved heat radiation performance, and a light-emitting device including the same. A...
2017/0069765 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Provided are a transistor which has electrical characteristics requisite for its purpose and uses an oxide semiconductor layer and a semiconductor device...
2017/0069762 MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
A memory device and a method for fabricating the same are provided. A memory device includes a tunneling dielectric layer located on a substrate. The floating...
2017/0069759 THREE-DIMENSIONAL FINFET TRANSISTOR WITH PORTION(S) OF THE FIN CHANNEL REMOVED IN GATE-LAST FLOW
A three-dimensional transistor includes a channel with a center portion (forked channel) or side portions (narrow channel) removed, or fins without shaping,...
2017/0069753 INTEGRATED CIRCUITS HAVING TUNNEL TRANSISTORS AND METHODS FOR FABRICATING THE SAME
Integrated circuits including tunnel transistors and methods for fabricating such integrated circuits are provided. An exemplary method for fabricating an...
2017/0069740 TOPSIDE STRUCTURES FOR AN INSULATED GATE BIPOLAR TRANSISTOR (IGBT) DEVICE TO ACHIEVE IMPROVED DEVICE PERFOREMANCES
This invention discloses an insulated gate bipolar transistor (IGBT) device formed in a semiconductor substrate. The IGBT device has a split-shielded trench...
2017/0069709 Coplanar Metal-Insulator-Metal Capacitive Structure
A method of fabricating a metal-insulator-metal (MIM) capacitor structure on a substrate includes forming a patterned metal layer over the substrate; forming...
2017/0069707 INDUCTOR DEVICE
A semiconductor device includes an inductor disposed on a surface of an intermetallic dielectric layer at a location below which no virtual interconnect...
2017/0069699 DISPLAY SUBSTRATES, METHODS OF MANUFACTURING THE SAME AND DISPLAY DEVICES INCLUDING THE SAME
A display substrate includes a base substrate, a switching device on the base substrate and an alignment pattern. The switching device includes an active...
2017/0069693 OLED PIXEL STRUCTURE, DISPLAY SUBSTRATE AND DISPLAY DEVICE
An OLED pixel structure is provided, it includes a plurality of pixel units arranged in a matrix form. Each pixel unit includes at least two subpixels arranged...
2017/0069692 ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
An organic light emitting display device realizes slimness, having flexibility, and effectively reducing or preventing visibility of reflected external light,...
2017/0069691 DISPERSION LIQUID, TRANSPARENT CONDUCTIVE FILM, INPUT DEVICE, AND ORGANIC ELECTROLUMINESCENT LIGHTING DEVICE
Provided is a dispersion liquid that enables formation of a transparent conductive film in which diffuse reflection of light by the surfaces of metal nanowires...
2017/0069681 LIGHT EMITTING DEVICE PACKAGE
A light emitting device package and a method of manufacturing the light emitting device package are provided. The light emitting package includes a light...
2017/0069678 CMOS IMAGE SENSOR STRUCTURE WITH CROSSTALK IMPROVEMENT
A semiconductor device includes a substrate, a device layer, a composite grid structure, a passivation layer and color filters. The device layer overlies the...
2017/0069676 SOLID-STATE IMAGING DEVICE, SOLID-STATE IMAGING DEVICE MANUFACTURING METHOD, ELECTRONIC DEVICE, AND LENS ARRAY
A solid-state imaging device includes: multiple micro lenses, which are disposed in each of a first direction and a second direction orthogonal to the first...
2017/0069674 IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING IMAGE PICKUP DEVICE, AND ELECTRONIC APPARATUS
An image pickup device includes: a photodiode provided in a silicon substrate, and configured to generate electric charge corresponding to an amount of...
2017/0069666 TRANSISTOR SUBSTRATE AND DISPLAY DEVICE
In a transistor substrate of a display device, a plurality of signal lines to which any one of drive signals of a gate signal and a video signal is supplied...
2017/0069660 CELL STRUCTURE IN INTERGRATED CIRCUITS FOR ECO AT UPPER METAL LAYER AND METHOD FOR FORMING SPARE CELL STRUCTURE
An integrated circuit includes a functional cell, and a spare gate cell configured to change or add a function of the functional cell in response to an...
2017/0069649 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a semiconductor memory device includes a substrate, a first semiconductor region, a second semiconductor region, an insulating...
2017/0069635 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to one embodiment, a semiconductor device includes a stacked body, a semiconductor body of a first conductivity type, a memory film, and a first...
2017/0069624 SEMICONDUCTOR DEVICE
According to one embodiment, the insulating film is provided between the anode region and the cathode region in the surface of the second semiconductor region....
2017/0069623 SEMICONDUCTOR DEVICE
A semiconductor device includes a first nitride semiconductor layer having a first region, a second nitride semiconductor layer that is on the first nitride...
2017/0069615 SEMICONDUCTOR DEVICE
There is provided a semiconductor device capable of suppressing generation of leakage current of a diode, by applying a voltage to a gate of a gated junction...
2017/0069609 SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME
A semiconductor apparatus includes a driver circuit wafer including a plurality of driver circuits arranged in an array, a bonding metal layer formed over the...
2017/0069605 Package-on-Package Structure with Through Molding Via
Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the...
2017/0069604 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
There is provided a semiconductor device and an electronic apparatus that comprises a semiconductor device, the semiconductor device including a first chip, a...
2017/0069602 INTERCONNECT SUBSTRATE HAVING CAVITY FOR STACKABLE SEMICONDUCOTR ASSEMBLY, MANUFACTURING METHOD THEREOF AND...
An interconnect substrate having vertical connection channels around a cavity is characterized in that contact pads are exposed from the cavity and the...
2017/0069593 Air Trench in Packages Incorporating Hybrid Bonding
A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second...
2017/0069587 CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURING SAME
A bump structure includes a contact element formed on a substrate and a passivation layer overlying the substrate. The passivation layer includes a passivation...
2017/0069579 SEMICONDUCTOR PACKAGES HAVING RESIDUAL STRESS LAYERS AND METHODS OF FABRICATING THE SAME
A semiconductor package is provided. The semiconductor includes a lower package and an upper package stacked on the lower package. The lower package includes a...
2017/0069564 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Disclosed herein is a wire-bonding type semiconductor package in which a fan out metal pattern is formed and a method of manufacturing the same. The...
2017/0069558 SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD
A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame...
2017/0069552 ELECTRICAL COMPONENT TESTING IN STACKED SEMICONDUCTOR ARRANGEMENT
A stacked semiconductor arrangement is provided. The stacked semiconductor arrangement includes a dynamic pattern generator layer having an electrical...
2017/0069551 METHOD AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS...
A method for manufacturing a semiconductor device including a plurality of semiconductor chips includes steps of placing, on a first semiconductor chip, a...
2017/0069536 PLASMA TREATMENT METHOD AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
Provided is a plasma treatment method including: placing a substrate carrier holding a substrate on a stage; adjusting a distance between a cover and the stage...
2017/0069532 SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor package includes: providing a package substrate having a first surface and a second surface opposite the first...
2017/0069519 ELECTROSTATIC CHUCK DEVICE
An electrostatic chuck device includes a base plate, an electrostatic chuck plate coupled to an upper surface of the base plate and including a mount region on...
2017/0069498 SURFACE DOPING OF NANOSTRUCTURES
This disclosure provides systems, methods, and apparatus related to surface doping of nanostructures. In one aspect a plurality of nanostructures is fabricated...
2017/0069473 METHOD OF PROCESSING WORKPIECE
A method includes performing an etching process in a first process module, moving a workpiece formed by the etching process from the first process module to a...
2017/0069469 CYCLICAL PLASMA ETCHING
There is provided an apparatus for cyclical plasma etching of a substrate, the apparatus comprising: a process chamber; a support within the process chamber...
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