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Patent # Description
2017/0077241 SEMICONDUCTOR DEVICE
According to embodiments, a semiconductor device includes a first laminated nitride semiconductor layer in which first nitride semiconductor layers and second...
2017/0077236 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor layer having a first surface and a second surface, a first electrode on the first surface, a second electrode...
2017/0077209 ORGANIC LIGHT-EMITTING DIODE DISPLAY AND METHOD OF MANUFACTURING THE SAME
An organic light-emitting diode (OLED) display and a method of manufacturing the same are disclosed. In one aspect, the OLED display includes a pixel disposed...
2017/0077206 ORGANIC LIGHT-EMITTING COMPONENT AND METHOD FOR PRODUCING AN ORGANIC LIGHT-EMITTING COMPONENT
In various embodiments, an organic light-emitting organic is provided. The organic light-emitting component may include a first electrode layer, an organic...
2017/0077200 OLED Display Panel And Manufacturing Method Thereof
The disclosure relates to the field of OLED display technology, more particularly, to an OLED display panel and a manufacturing method thereof, during the...
2017/0077193 AMOLED DEVICE AND FEBRICATING METHOD THEREOF, AND DISPLAY APPARATUS
The embodiments of the present disclosure relate to an AMOLED device and a fabricating method thereof, and a display apparatus. The AMOLED device comprises: a...
2017/0077192 ORGANIC LIGHT-EMITTING DISPLAY APPARATUS
An organic light-emitting display apparatus includes a first substrate corresponding to a display area and a periphery area, a second substrate facing the...
2017/0077178 NONVOLATILE STORAGE DEVICE, SEMICONDUCTOR ELEMENT, AND CAPACITOR
A nonvolatile storage device of an embodiment includes a first wiring layer extending in a first direction, a second wiring layer extending in a second...
2017/0077170 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A method for manufacturing semiconductor devices includes following steps. A substrate having a pixel region and a periphery region defined thereon is...
2017/0077164 SOLID-STATE IMAGE SENSOR AND IMAGE PICKUP APPARATUS
A solid-state image sensor comprising a plurality of pixels including photoelectric conversion elements arranged in matrix and an microlens array in which a...
2017/0077146 DUAL-MATERIAL MANDREL FOR EPITAXIAL CRYSTAL GROWTH ON SILICON
In one example, a method for fabricating a semiconductor device includes etching a layer of silicon to form a plurality of fins and growing layers of a...
2017/0077134 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor memory device according to an embodiment includes a laminated body. The laminated body is disposed above a semiconductor substrate. The...
2017/0077133 SEMICONDUCTOR DEVICE
According to one embodiment, a semiconductor device includes a substrate; a first structure; a second structure; a step; an insulating layer; a first pillar; a...
2017/0077106 FinFET Memory Device
A FinFET system comprises a first inverter comprising a first p-type pull-up transistor (PU) and a first n-type pull-down transistor (PD connected in series...
2017/0077093 BACKSIDE COUPLED SYMMETRIC VARACTOR STRUCTURE
A symmetric varactor structure may include a first varactor component. The first varactor component may include a gate operating as a second plate, a gate...
2017/0077086 Electrostatic Discharge Protection Element
An electrostatic discharge protection element is provided, which leads out the electrostatic discharge current between an internal circuit and an input/output...
2017/0077084 SEMICONDUCTOR DEVICE
A semiconductor device for driving a load includes: a protection circuit configured to be connected to the load, the protection circuit including a protection...
2017/0077083 ELECTROSTATIC DISCHARGE (ESD) ROBUST TRANSISTORS AND RELATED METHODS
An electrostatic discharge robust semiconductor transistor (transistor) includes a semiconductor substrate of a first conductivity type, a substrate contact...
2017/0077081 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A diffusion diode including a p.sup.+ diffusion region, a p-type diffusion region, and an n.sup.+ diffusion region is formed in the front surface of a...
2017/0077075 Laser Marking in Packages
A package includes a device die, a first plurality of redistribution lines underlying the device die, a second plurality of redistribution lines overlying the...
2017/0077069 SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
An improvement is achieved in the reliability of a semiconductor device. Over a die pad, first and second semiconductor chips are mounted. The first and second...
2017/0077065 SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor storage device of the present embodiments includes a substrate, a first semiconductor chip and a sealer. The substrate has wirings. The first...
2017/0077064 DISPLAY DEVICE
A display device comprises: control circuit substrates disposed in a rear surface of a display panel, a control circuit that generates a control signal in...
2017/0077063 WIRE CONNECTING METHOD AND TERMINAL
A method of connecting a wire with a terminal including a plurality of conductors is provided. The method includes: positioning the terminal by holding a part...
2017/0077058 SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCING STRESS
A semiconductor device includes a semiconductor chip, wiring that is included in the semiconductor chip and has a coupling part between parts with different...
2017/0077048 SEMICONDUCTOR DEVICE, INVERTER CIRCUIT, AND DRIVE DEVICE
A semiconductor device of an embodiment includes a first electrode, a second electrode facing the first electrode, an alternating-current electrode, a first...
2017/0077046 PHYSICAL UNCLONABLE FUNCTIONS THROUGH LOCALLY ENHANCED DEFECTIVITY
A physical unclonable function (PUF) includes multiple logic gates and multiple random signal generation circuits connected to the logic gates, wherein, in at...
2017/0077039 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
The present disclosure provides a semiconductor package device and a method for manufacturing the same. In embodiments of the present disclosure, a...
2017/0077026 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
According to an embodiment, a semiconductor memory device includes a plurality of first conductive layers disposed above a substrate in a laminating direction....
2017/0077024 DRIVING CIRCUIT AND PIN OUTPUT ORDER ARRANGING METHOD
A driving circuit and a pin output order arranging method are disclosed. The driving circuit includes (M*N) pins and an arranging module. A first pin .about....
2017/0077023 SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor substrate includes: 1) a first dielectric structure having a first surface and a second surface opposite the first surface; 2) a second...
2017/0077021 THREE-DIMENSIONAL INTEGRATED CIRCUIT INTEGRATION BACKGROUND
Wiring structures, methods for providing a wiring structure, and methods for distributing currents with a wiring structure from one or more through-substrate...
2017/0077017 SEMICONDUCTOR DEVICE HAVING TERMINALS DIRECTLY ATTACHABLE TO CIRCUIT BOARD
Disclosed embodiments relate to a semiconductor device. A semiconductor device is fabricated by attachment of a first chip to a first surface of a pad of a...
2017/0077005 SEMICONDUCTOR DEVICE
For a purpose of raising the breakdown voltage of a semiconductor device, the creepage distance and clearance between an electrode terminal and another...
2017/0076992 FIN ISOLATION ON A BULK WAFER
A method for forming a semiconductor device includes etching first fins into a bulk semiconductor substrate and exposing a portion of the first fins through a...
2017/0076975 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
The present disclosure describes semiconductor devices and methods of fabricating the same. The method includes forming an interlayer insulating layer on a...
2017/0076968 SUBSTRATE CARRIER SYSTEM AND METHOD FOR USING THE SAME
A substrate carrier system is provided. The substrate carrier system includes a substrate carrier body, an electrode assembly, a support base, and a...
2017/0076963 BONDING DEVICE, BONDING METHOD AND PRESSURE APPLYING UNIT
Provided is a bonding device for bonding a substrate and an electronic part of an assembled body which is formed by mounting the electronic part on the...
2017/0076960 LID ATTACH PROCESSES FOR SEMICONDUCTOR PACKAGES
A lid attach process includes providing a substrate and a die attached to the substrate, providing a lid and dipping a periphery of the lid in a dipping tank...
2017/0076948 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes: forming a first major electrode on a first major surface of a semiconductor substrate; forming a...
2017/0076941 SPIN COATING METHOD AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
A spin coating method according to an embodiment includes forming a first material film on an underlying material. The underlying material is rotated while a...
2017/0076935 FLOATING WAFER TRACK WITH LATERAL STABILIZATION MECHANISM
An apparatus (100) comprising:--a process tunnel (102) including a lower tunnel wall (120), an upper tunnel wall (130), and two lateral tunnel walls (108),...
2017/0076912 MULTI CHARGED PARTICLE BEAM WRITING METHOD, AND MULTI CHARGED PARTICLE BEAM WRITING APPARATUS
A multi charged particle beam writing method includes assigning, for each unit irradiation region per beam of multi-beams, each divided shot obtained by...
2017/0076901 Techniques for Optimizing Nanotips Derived from Frozen Taylor Cones
Optimization techniques are disclosed for producing sharp and stable tips/nanotips relying on liquid Taylor cones created from electrically conductive...
2017/0076893 ELECTRONIC-DEVICE SEAL STRUCTURE AND ELECTROMAGNETIC RELAY USING SAID ELECTRONIC-DEVICE SEAL STRUCTURE
An electronic-device seal structure includes a base, a case which covers an upper surface of the base and has an opening at a surface thereof, and a pair of...
2017/0076891 Control Apparatus for Controlling a Switching Element
To avoid additional costs, in particular by replacing a switching element too early or by expensive monitoring measures thereof, a control apparatus for...
2017/0076885 FORCE FEEDBACK SURFACE FOR AN ELECTRONIC DEVICE
An accessory device having a first and second body is described. The second body may include a force feedback mechanism that responds to an input received at...
2017/0076881 KEYBOARD KEY STRUCTURE AND METHOD OF MANUFACTURING A KEYCAP OF A KEYBOARD KEY
A keyboard key structure includes a plurality of keycaps. Each keycap has a keycap body and an outward layer. The keycap body has an appearance with a first...
2017/0076858 ROLLED IRON CORE TRACTION TRANSFORMER
A rolled iron core traction transformer, comprising an iron core (1); the iron core (1) is formed by splicing two symmetrical annealed iron-core closed single...
2017/0076854 COIL DEVICE
A coil device of solenoid type includes a coil portion having a bobbin and a conductive wire wound around the bobbin, a housing for accommodating the coil...
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