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Patent # Description
2017/0104163 COMPOSITION FOR ORGANIC OPTOELECTRIC DIODE, ORGANIC OPTOELECTRIC DIODE, AND DISPLAY DEVICE
The present invention relates to: a composition for an organic optoelectric diode, containing a first host compound represented by Chemical Formula I and a...
2017/0104162 PERYLENE-BASED MATERIALS FOR ORGANIC PHOTOELECTRIC CONVERSION LAYERS
The present disclosure relates to perylene-based molecules and their use in photoelectric conversion layer(s) and/or an organic or hybrid image sensor. The...
2017/0104161 CHARGE-TRANSPORTING VARNISH
A charge-transporting thin film, which enables the achievement of an organic EL element having excellent durability in cases where the charge-transporting thin...
2017/0104160 ORGANIC SEMICONDUCTING COMPOUNDS AND RELATED OPTOELECTRONIC DEVICES
The present teachings relate to new organic semiconducting compounds and their use as active materials in organic and hybrid optical, optoelectronic, and/or...
2017/0104159 Apparatus and Method to Deliver Organic Material via Organic Vapor-Jet Printing (OVJP)
Systems and arrangements of OVJP deposition devices are provided, in which one or more organic material crucibles are directly attached to an injection block...
2017/0104158 VAPOR DEPOSITION METHOD AND VAPOR DEPOSITION APPARATUS
A vapor deposition apparatus includes: a vapor deposition source having a plurality of vapor deposition source apertures that emit vapor deposition particles;...
2017/0104157 FLUORENE DERIVATIVE, LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE
An object is to provide a new fluorene derivative as a good light-emitting material for organic EL elements. A fluorene derivative represented by General...
2017/0104156 METHODS OF FORMING MEMORY DEVICES HAVING ELECTRODES COMPRISING NANOWIRES
Memory devices having memory cells comprising variable resistance material include an electrode comprising a single nanowire. Various methods may be used to...
2017/0104155 Transistors and Methods of Forming Transistors
Some embodiments include a transistor having a drain region and a source region. A conductive gate is between the source and drain regions. First channel...
2017/0104154 VARIABLE RESISTIVE MEMORY DEVICE HAVING A PHASE CHANGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A variable resistive memory device may include a phase change region, a phase change layer, a gap-filling layer and an upper electrode. The phase change region...
2017/0104153 MAGNETIC TUNNEL JUNCTION (MTJ) DEVICE ARRAY
A semiconductor device includes a first magnetic tunnel junction (MTJ) device, a second MTJ device, and a top electrode. The first MTJ device includes a...
2017/0104152 Method of Inspecting By-Products and Method of Manufacturing Semiconductor Device Using the Same
Provided is a method of manufacturing a semiconductor device. The method of manufacturing the semiconductor device includes forming magneto tunnel layers,...
2017/0104151 TRANSISTOR THAT EMPLOYS COLLECTIVE MAGNETIC EFFECTS THEREBY PROVIDING IMPROVED ENERGY EFFICIENCY
A device or class of devices that provides a mechanism for controlling charge current flow in transistors that employs collective magnetic effects to overcome...
2017/0104150 Spin Current Devices and Methods of Fabrication Thereof
Pure spin current devices are provided. The devices include sandwich structures of metal/magnetic insulator/metal. A first current injected in a first metal...
2017/0104149 PACKAGES FOR INTEGRATED CIRCUITS AND METHODS OF PACKAGING INTEGRATED CIRCUITS
An integrated circuit package including an integrated circuit die including a first side and a second side opposite the first side, the first side including at...
2017/0104148 ULTRASOUND TRANSDUCER AND PROCESSING METHODS THEREOF
An ultrasonic transducer includes a backing element, an active element overlying the backing layer, and a matching element overlying the active element, the...
2017/0104147 PZT THIN FILM LAMINATE AND MANUFACTURING METHOD THEREOF
The present invention provides a technology for preventing the generation of a pyrochlore phase, which is an impurity phase, in forming a PZT thin film by...
2017/0104146 ALLOY SYSTEM WITH ENHANCED SEEBECK COEFFICIENT AND PROCESS FOR MAKING SAME
Provided herein are alloy systems with enhanced Seebeck coefficient and processes for making the same. An alloy system and process for improving the Seebeck...
2017/0104145 THERMOELECTRIC CONVERSION ELEMENT AND METHOD FOR PRODUCING THE SAME
A thermoelectric conversion element includes a p-type film having a perovskite structure, the p-type film including Co; an n-type film having a perovskite...
2017/0104144 THERMOELECTRIC CONVERSION ELEMENT, METHOD FOR PRODUCING THERMOELECTRIC CONVERSION ELEMENT AND THERMOELECTRIC...
A thermoelectric conversion element includes: a first film including a perovskite structure; a second film and a third film, including a perovskite structure,...
2017/0104143 FLEXIBLE LED ASSEMBLY WITH UV PROTECTION
Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304,...
2017/0104142 LIGHT EMITTING DEVICE PACKAGE AND LIGHT UNIT HAVING THE SAME
A light emitting device package including a package body including a recess which is provided with a bottom face and a plurality of inner walls surrounding the...
2017/0104141 SEMICONDUCTOR LIGHT EMITTING DEVICE
Disclosed is a semiconductor light emitting device, including: a body, which has a bottom part with at least one hole formed therein, a side wall, and a cavity...
2017/0104140 Ultraviolet Device Encapsulant
A composite material, which can be used as an encapsulant for an ultraviolet device, is provided. The composite material includes a matrix material and at...
2017/0104139 WAFER-LEVEL LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME
Exemplary embodiments of the present invention provide a wafer-level light emitting diode (LED) package and a method of fabricating the same. The LED package...
2017/0104138 Packaging for Ultraviolet Optoelectronic Device
A solution for packaging an optoelectronic device using an ultraviolet transparent polymer is provided. The ultraviolet transparent polymer material can be...
2017/0104137 METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE
A method is provided for making optical semiconductor devices collectively. LED chips are arranged on a material substrate, and the substrate is sandwiched by...
2017/0104136 LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME
Embodiments of a light emitting device and a method for fabricating the same are provided. The light emitting device comprises a cavity and one or more light...
2017/0104135 Light Emitting Diode Mounting Structure
A mounting structure for mounting a set of optoelectronic devices is provided. A mounting structure for a set of optoelectronic devices can include: a body...
2017/0104133 LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE
A light emitting device includes a semiconductor light emitting element including a semiconductor stacked-layer body and an electrode disposed on a first...
2017/0104132 Epitaxy Technique for Growing Semiconductor Compounds
A solution for fabricating a semiconductor structure is provided. The semiconductor structure includes a plurality of semiconductor layers grown over a...
2017/0104131 Device Including Transparent Layer with Profiled Surface for Improved Extraction
A profiled surface for improving the propagation of radiation through an interface is provided. The profiled surface includes a set of large roughness...
2017/0104130 LIGHT-EMITTING DEVICE WITH PATTERNED SUBSTRATE
A lighting device according to embodiments of the invention includes a substrate with a plurality of holes that extend from a surface of the substrate. A...
2017/0104129 Patterned Layer Design for Group III Nitride Layer Growth
A device having a layer with a patterned surface for improving the growth of semiconductor layers, such as group III nitride-based semiconductor layers with a...
2017/0104128 III-Nitride Semiconductor Light Emitting Device Having Amber-to-Red Light Emission (>600 nm) and a Method...
A III-nitride semiconductor light emitting device incorporating n-type III-nitride cladding layers, indium containing III-nitride light emitting region, and...
2017/0104127 ZnO-CONTAINING SEMICONDUCTOR STRUCTURE AND MANUFACTURE THEREOF
A method of manufacturing ZnO-containing semiconductor structure includes steps of: (a) forming a subsidiary lamination, including alternately laminating at...
2017/0104126 LIGHT EMITTING DEVICES WITH BUILT-IN CHROMATICITY CONVERSION AND METHODS OF MANUFACTURING
Various embodiments of light emitting devices with built-in chromaticity conversion and associated methods of manufacturing are described herein. In one...
2017/0104125 METHOD FOR FORMING N-TYPE ZnS LAYER AND SOLAR CELL
Disclosed is a solar cell including a substrate, an electrode layer disposed on the substrate, a p-type light-absorption layer disposed on the electrode layer,...
2017/0104124 APPARATUS AND METHOD FOR ATTACHING INTERCONNECTOR OF SOLAR CELL PANEL
Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a flux layer by spraying flux over the interconnector...
2017/0104123 METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT PHOTOTRANSISTORS BASED ON SINGLE-CRYSTALLINE SEMICONDUCTOR THIN FILMS
MOSFET phototransistors, methods of operating the MOSFET phototransistors and methods of making the MOSFET phototransistors are provided. The phototransistors...
2017/0104122 ION IMPLANTATION AND ANNEALING FOR THIN-FILM CRYSTALLINE SOLAR CELLS
A back contact back junction thin-film solar cell is formed on a thin-film semiconductor solar cell. Preferably the thin film semiconductor material comprises...
2017/0104121 LIGHT REDIRECTING FILM USEFUL WITH SOLAR MODULES
A light redirecting film defining a longitudinal axis, and including a base layer, an ordered arrangement of a plurality of microstructures, and a reflective...
2017/0104120 METHOD FOR FABRICATING A SOLAR MODULE OF REAR CONTACT SOLAR CELLS USING LINEAR RIBBON-TYPE CONNECTOR STRIPS AND...
A solar module and a method for fabricating a solar module comprising a plurality of rear contact solar cells are described. Rear contact solar cells (1) are...
2017/0104119 SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME
A solar cell module is discussed. The solar cell module includes a plurality of solar cells each including a semiconductor substrate and a plurality of first...
2017/0104118 Method and Apparatus for Forming and Mounting a Photovoltaic Array
A PV module framing and coupling system which enables the attachment of PV modules to a roof or other mounting surface without requiring the use of separate...
2017/0104117 APPARATUS AND METHOD FOR PHOTOVOLTAIC MODULE WITH TAPERED EDGE SEAL
A photovoltaic module generates electrical power when installed on a roof. The module is constructed as a laminated sandwich having a transparent protective...
2017/0104116 GERMANIUM METAL-CONTACT-FREE NEAR-IR PHOTODETECTOR
A Ge-on-Si photodetector constructed without doping or contacting Germanium by metal is described. Despite the simplified fabrication process, the device has...
2017/0104115 BACK-CONTACT SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME
A method for manufacturing a back-contact solar cell, comprising the steps of: (i) preparing a semiconductor substrate comprising an n-layer and a p-layer at...
2017/0104114 SOLAR CELL MODULE
A solar cell module includes a plurality of solar cells each including a semiconductor substrate and first electrodes and second electrodes extended on a back...
2017/0104113 LIFTOFF PROCESS FOR EXFOLIATION OF THIN FILM PHOTOVOLTAIC DEVICES AND BACK CONTACT FORMATION
A method for forming a back contact on an absorber layer in a photovoltaic device includes forming a two dimensional material on a first substrate. An absorber...
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