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Patent # Description
2017/0103910 METHOD OF USING A WAFER CASSETTE TO CHARGE AN ELECTROSTATIC CARRIER
A method comprising placing a wafer assembly in a wafer cassette, wherein the wafer assembly includes a wafer and an electrostatic carrier attached to the...
2017/0103909 SUBSTRATE ANGLE ALIGNMENT DEVICE, SUBSTRATE ANGLE ALIGNMENT METHOD, AND SUBSTRATE TRANSFER METHOD
A substrate angle alignment device includes a plurality of holding sections which hold a plurality of substrates, respectively in such a manner that the...
2017/0103908 SUBSTRATE CARRIER FOR ACTIVE/PASSIVE BONDING AND DE-BONDING OF A SUBSTRATE
Embodiments of substrate carriers which enable active/passive bonding and de-bonding of a substrate are provided herein. In some embodiments, a substrate...
2017/0103907 DIODE LASER FOR WAFER HEATING FOR EPI PROCESSES
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber....
2017/0103906 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
A method of manufacturing a semiconductor package includes preparing a package substrate including a semiconductor chip mounting region. A semiconductor chip...
2017/0103905 METHOD FOR PACKAGING AN INTEGRATED CIRCUIT DEVICE WITH STRESS BUFFER
A method of fabricating a plurality of semiconductor devices includes attaching a plurality of integrated circuit (IC) die to a substrate including forming...
2017/0103904 INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY
An integrated circuit ("IC") package mold includes an upper mold platen that defines an upper mold cavity for receiving an upper substrate having a die attach...
2017/0103903 METHOD OF MANUFACTURING BONDED BODY
Provided is a method of manufacturing a bonded body having a structure where a substrate and an electronic part are bonded to each other with a metal particle...
2017/0103902 Laser-Induced Forming and Transfer of Shaped Metallic Interconnects
A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using...
2017/0103901 CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING
Replacement chemistries for the cC.sub.4F.sub.8 passivation gas in the Bosch etch process and processes for using the same are disclosed. These chemistries...
2017/0103900 METHOD FOR FORMING WAFER
This invention provides a method for forming a wafer comprising forming a silicon substrate, and then performing rapid thermal annealing to the substrate to...
2017/0103899 SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
The present invention relates to a semiconductor structure and a method for forming the same. The method comprises steps of providing a substrate having a...
2017/0103898 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming a first nitride semiconductor layer, forming thereover a second nitride semiconductor layer...
2017/0103897 DEVICES WITH MULTIPLE THRESHOLD VOLTAGES FORMED ON A SINGLE WAFER USING STRAIN IN THE HIGH-K LAYER
A method for adjusting a threshold voltage includes depositing a strained liner on a gate structure to strain a gate dielectric. A threshold voltage of a...
2017/0103896 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A method for fabricating semiconductor device is disclosed. The method includes the steps of : providing a substrate; forming a first gate structure on the...
2017/0103895 LASER IRRADIATION APPARATUS AND LASER IRRADIATION METHOD
A laser irradiation apparatus may include a plasma generator, a laser unit configured to output a pulsed laser light beam, and a controller. The plasma...
2017/0103894 Method of Manufacturing a Silicon Carbide Semiconductor Device by Removing Amorphized Portions
A trench is formed that extends from a main surface into a crystalline silicon carbide semiconductor layer. A mask is formed that includes a mask opening...
2017/0103893 ULTRA-HIGH MODULUS AND ETCH SELECTIVITY BORON-CARBON HARDMASK FILMS
Implementations of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein...
2017/0103892 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
A method for fabricating a semiconductor device includes forming a first mask pattern on a first film to extend in a first direction, forming a first spacer on...
2017/0103891 METHODS OF FORMING PATTERNS OF A SEMICONDUCTOR DEVICES
A method of forming fine patterns of semiconductor devices is disclosed. The method comprises forming a hard mask layer on an etch target, which includes first...
2017/0103890 POLYCRYSTALLINE SEMICONDUCTOR LAYER AND FABRICATING METHOD THEREOF
The present application discloses a method of fabricating a polycrystalline semiconductor layer, comprising forming a heat storage layer; forming a buffer...
2017/0103889 Method for Producing a Pillar Structure in a Semiconductor Layer
A method for producing a pillar structure in a semiconductor layer, the method including providing a structure including, on a main surface, a semiconductor...
2017/0103888 AMINE CATALYSTS FOR LOW TEMPERATURE ALD/CVD SiO2 DEPOSITION USING HEXACHLORODISILANE/H2O
A precursor composition is described, useful for low temperature (<150.degree. C.) vapor deposition of silicon dioxide. The precursor composition includes...
2017/0103887 METHOD FOR FORMING EPITAXIAL LAYER
This invention provides a method for forming an epitaxial layer comprising, during formation of the epitaxial layer by vapor phase deposition, introducing a...
2017/0103886 Method for Producing a Semiconductor Using a Vacuum Furnace
A method of manufacturing a semiconductor includes providing a mold defining a planar capillary space; placing a measure of precursor in fluid communication...
2017/0103885 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE-PROCESSING APPARATUS, AND RECORDING MEDIUM
There is provided a method for manufacturing a semiconductor device, including: providing a substrate with an oxide film formed on a surface thereof;...
2017/0103884 Deposited Material and Method of Formation
A system and method for manufacturing a semiconductor device is provided. An embodiment comprises forming a deposited layer using an atomic layer deposition...
2017/0103883 Method for Forming Aluminum-Containing Dielectric Layer
The present disclosure provides a method of forming an aluminum-containing layer. The method includes providing a substrate in an atomic layer deposition (ALD)...
2017/0103882 Method of Manufacturing Semiconductor Wafers and Method of Manufacturing a Semiconductor Device
An embodiment of a method of manufacturing semiconductor wafers comprises determining at least one material characteristic for at least two positions of a...
2017/0103881 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Disclosed is a substrate processing method including a first surface cleaning step of supplying a first cleaning liquid containing water to a first surface of...
2017/0103880 SYSTEMS FOR SEPARATING IONS AND NEUTRALS AND METHODS OF OPERATING THE SAME
A mass spectrometer system includes a sample injection device defining a sample injection aperture. The system also includes an ion trap defining an ion outlet...
2017/0103879 SAMPLE ANALYSIS SYSTEMS AND METHODS OF USE THEREOF
The invention generally relates to sample analysis systems and methods of use thereof. In certain aspects, the invention provides a system for analyzing a...
2017/0103878 Coupling device for mass spectrometry apparatus
An object of the present invention is to provide a technology that enables highly sensitive atmospheric-pressure real-time mass spectrometry of a volatile...
2017/0103877 PLASMA ETCHING METHOD
Disclosed is a plasma etching method which is performed using a plasma processing apparatus that is a capacitively coupled plasma processing apparatus, and...
2017/0103876 PLASMA GENERATOR, ANNEALING DEVICE, DEPOSITION CRYSTALLIZATION APPARATUS AND ANNEALING PROCESS
A plasma generator, a plasma annealing device, a deposition crystallization apparatus and a plasma annealing process are disclosed. The plasma generator...
2017/0103875 Temperature Control in RF Chamber with Heater and Air Amplifier
Systems, methods, and computer programs are presented for controlling the temperature of a window in a semiconductor manufacturing chamber. One apparatus...
2017/0103874 PLASMA PROCESSING APPARATUS
Detection accuracy of a power of a progressive wave and detection accuracy of a power of a reflection wave can be improved. In a plasma processing apparatus, a...
2017/0103873 RF PULSE REFLECTION REDUCTION FOR PROCESSING SUBSTRATES
Methods and systems for RF pulse reflection reduction in process chambers are provided herein. In some embodiments, a method includes (a) providing a plurality...
2017/0103872 SYSTEMS AND METHODS FOR TUNING AN IMPEDANCE MATCHING NETWORK IN A STEP-WISE FASHION FOR MULTIPLE STATES OF AN...
Systems and methods for tuning an impedance matching network in a step-wise fashion for each state are described. By tuning the impedance matching network in a...
2017/0103871 APPARATUS FOR MONITORING PULSED HIGH-FREQUENCY POWER AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
Disclosed are an apparatus for monitoring pulsed high-frequency power and a substrate processing apparatus including the same. The apparatus includes an...
2017/0103870 UNIFORMITY CONTROL CIRCUIT FOR USE WITHIN AN IMPEDANCE MATCHING CIRCUIT
An impedance matching circuit (IMC) is described. The IMC includes a first circuit that includes a first plurality of tuning elements defined along a path. The...
2017/0103869 MULTI CHARGED PARTICLE BEAM WRITING METHOD, AND MULTI CHARGED PARTICLE BEAM WRITING APPARATUS
A multi charged particle beam writing method includes calculating an offset dose to irradiate all the small regions by multiplying one beam dose equivalent to...
2017/0103868 INVESTIGATION OF HIGH-TEMPERATURE SPECIMENS IN A CHARGED PARTICLE MICROSCOPE
A method of examining a specimen in a Charged Particle Microscope, comprising the following steps: Providing a specimen on a specimen holder; Heating the...
2017/0103867 VACUUM TUBE
A vacuum tube includes a filament and two pairs of a grid and an anode. The filament is tensioned linearly and emits thermoelectrons. Both of the anodes are...
2017/0103866 HIGH VOLTAGE COMPACT FUSE ASSEMBLY WITH MAGNETIC ARC DEFLECTION
Fuse assemblies in the form of fuse blocks and fuse holders include embedded permanent magnet arc suppression features that facilitate higher voltage operation...
2017/0103865 Automatic Transfer Switch
A system and method for an automatic transfer switch comprising a fixed contact (26), a first oscillating rod (16) communicatively and operatively connected to...
2017/0103864 REDUCED HEIGHT RELAY BLOCK FOR VEHICLE POWER DISTRIBUTION DEVICE
A reduced height relay block for use within a power distribution device for a vehicle electrical system. In one embodiment, there is provided a power...
2017/0103863 HEAT-REACTIVE SWITCH
A heat-reactive switch includes an airtight container with a housing and a lid plate, two conductive terminal pins fixed in through-holes in the lid plate, a...
2017/0103862 PRODUCT PACKAGING HAVING CONDUCTIVE STRIPS FOR ACTIVATING A PRODUCT WITHIN A PACKAGE
A first conductive strip connected to a package that interacts with and creates a circuit with a second conductive strip connected to a battery-operated...
2017/0103861 TRIP INDICATION USING ADJACENT CIRCUIT BREAKERS
An indicator system for an electronic miniature circuit breaker that has tripped and therefore has no power to provide its own trip indication comprises a...
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