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Patent # Description
2017/0133259 System and Method for Peeling a Semiconductor Chip From a Tape Using a Multistage Ejector
A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural...
2017/0133258 ELECTROSTATIC CHUCK
An electrostatic chuck includes an anisotropic heat conductor which is disposed between an attraction substrate and a first heater member, and has an upper...
2017/0133257 METHOD OF TRANSFERRING MICRO-DEVICE
A method of transferring micro-devices is provided. A carrying unit including a carrying substrate, a plurality of electrodes, a dielectric layer covering the...
2017/0133256 INTERCONNECTION STRUCTURE, FABRICATING METHOD THEREOF, AND EXPOSURE ALIGNMENT SYSTEM
In some embodiments, an interconnection structure, an exposure alignment system, and a fabricating method thereof are provided. The method comprises: providing...
2017/0133255 STACKED WAFER CASSETTE LOADING SYSTEM
A substrate cassette loading system for docking substrate cassettes to a substrate processing system is provided. A plurality of ports passes substrates into...
2017/0133254 PURGE DEVICE, PURGE SYSTEM, PURGE METHOD, AND CONTROL METHOD IN PURGE SYSTEM
A purge device configured to purge the inside of a storage container storing a product with purge gas includes a plurality of placing units, each configured to...
2017/0133253 Method and Apparatus for Use in Wafer Processing
A method and an apparatus for use in processing a wafer are disclosed. In an embodiment the method includes providing a wafer on a receptacle, shining a light...
2017/0133252 TECHNIQUES FOR COMBINING CMP PROCESS TRACKING DATA WITH 3D PRINTED CMP CONSUMABLES
Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads,...
2017/0133250 PRINTING TRANSFERABLE COMPONENTS USING MICROSTRUCTURED ELASTOMERIC SURFACES WITH PRESSURE MODULATED REVERSIBLE...
In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface...
2017/0133249 APPARATUS FOR LAMINATING A TAPE FILM ON A SUBSTRATE AND A SYSTEM OF FABRICATING A SEMICONDUCTOR DEVICE USING...
A tape film lamination apparatus may include a housing, a substrate holder disposed in the housing and positioned to receive a substrate, a film holder...
2017/0133248 PRINTING TRANSFERABLE COMPONENTS USING MICROSTRUCTURED ELASTOMERIC SURFACES WITH PRESSURE MODULATED REVERSIBLE...
In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface...
2017/0133247 HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD FOR HEATING SUBSTRATE BY IRRADIATING SUBSTRATE WITH FLASH OF...
A flash heating part in a heat treatment apparatus includes 30 built-in flash lamps, and irradiates a semiconductor wafer held by a holder in a chamber with a...
2017/0133246 METHOD AND APPARATUS FOR FORMING A TRANSPARENT CONDUCTIVE OXIDE USING HYDROGEN
A method and apparatus for forming a crystalline cadmium stannate layer of a photovoltaic device by heating an amorphous layer in the presence of hydrogen gas.
2017/0133245 SUBSTRATE MOUNTING MECHANISM AND SUBSTRATE PROCESSING APPARATUS
A substrate mounting mechanism, for heating and cooling a substrate mounted thereon, includes a heating member having a heating unit configured to heat a...
2017/0133244 COOLING BASE WITH SPIRAL CHANNELS FOR ESC
Implementations described herein provide a cooling base and a substrate support assembly having the same. In one example, a cooling base is provided that...
2017/0133243 SAMPLE HOLDER, DEVICE AND METHOD FOR DETACHING OF A FIRST SUBSTRATE
A method and device for detaching a first substrate, which is connected to a second substrate by an interconnect layer, from the second substrate by...
2017/0133242 METHOD OF PRIMING AND DRYING SUBSTRATES
A method of priming and drying substrates having high-aspect ratio trenches. In one aspect, the method comprises: a) supporting at least one substrate having...
2017/0133241 DRY SEPARATION APPARATUS, NOZZLE FOR GENERATING HIGH-SPEED PARTICLE BEAM FOR DRY SEPARATION
A dry separation method is a dry separation method for ashing a photoresist, including a spraying and separating step of spraying sublimation particles on the...
2017/0133240 Silicon Heat-Dissipation Package For Compact Electronic Devices
Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover...
2017/0133239 SEMICONDUCTOR DEVICE WITH HIGH THERMAL CONDUCTIVITY SUBSTRATE AND PROCESS FOR MAKING THE SAME
The present disclosure relates to a process of forming a high thermal conductivity substrate for an Aluminum/Gallium/Indium (III)-Nitride semiconductor device....
2017/0133237 POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE POLISHING LIQUID
Provided is a polishing liquid including cerium oxide particles, an organic acid A, a polymer compound B having a carboxyl acid group or a carboxylate group,...
2017/0133236 Composite Abrasive Particles For Chemical Mechanical Planarization Composition And Method Of Use Thereof
Polishing compositions comprising ceria coated silica particles offer minimal topography, reduced oxide and nitride losses, while providing high oxide polish...
2017/0133235 SUBSTRATE TREATMENT METHOD, COMPUTER READABLE STORAGE MEDIUM AND SUBSTRATE TREATMENT SYSTEM
A substrate treatment method includes: forming a plurality of circular patterns of a resist film on a substrate; thereafter applying a first block copolymer;...
2017/0133233 METHOD FOR PROCESSING OBJECT TO BE PROCESSED
In a method according to one embodiment, a first processing gas is supplied into a processing container of a plasma processing apparatus, and a plasma of the...
2017/0133232 METHODS FOR SELECTIVE ETCHING OF A SILICON MATERIAL
The present disclosure provides methods for etching features in a silicon material includes performing a remote plasma process formed from an etching gas...
2017/0133231 METHOD FOR DEPOSITING EXTREMELY LOW RESISTIVITY TUNGSTEN
Methods for depositing extremely low resistivity tungsten in semiconductor processing are disclosed herein. Methods involve annealing the substrate at various...
2017/0133230 SEMICONDUCTOR DEVICE HAVING VERTICAL SILICON PILLAR TRANSISTOR
A semiconductor device includes a transistor disposed on a substrate, a first insulation layer, a second insulation layer, an epitaxy and a conductive...
2017/0133229 Memory Devices and Method of Fabricating Same
A method comprises forming a control gate structure over a substrate, depositing a memory gate layer over the substrate, applying a first etching process to...
2017/0133228 SYSTEM AND METHOD FOR MITIGATING OXIDE GROWTH IN A GATE DIELECTRIC
Oxide growth of a gate dielectric layer that occurs between processes used in the fabrication of a gate dielectric structure can be reduced. The reduction in...
2017/0133227 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
To improve accuracy and shielding capabilities of impurity implantation, a method of manufacturing a semiconductor device is provided, the method including...
2017/0133226 DIAMOND SEMICONDUCTOR SYSTEM AND METHOD
Disclosed herein is a new and improved system and method for fabricating diamond semiconductors. The method may include the steps of selecting a diamond...
2017/0133225 Apparatus and Method for FinFETs
A method comprises performing a surface treatment on a plurality of recesses in a substrate to form a first cloak-shaped recess, a second cloak-shaped recess...
2017/0133224 INTEGRATED PROCESS AND STRUCTURE TO FORM III-V CHANNEL FOR SUB-7NM CMOS DEVICES
Embodiments described herein generally relate to methods and structures for forming precise fins comprising Group III-V elements on a silicon substrate. A...
2017/0133223 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
In accordance with an embodiment of the present disclosure, a method of manufacturing a semiconductor device may include forming an opening passing-through a...
2017/0133222 Fabrication and Structures of Crystalline Material
A surface of the first semiconductor crystalline material has a reduced roughness. A semiconductor device includes a low defect, strained second semiconductor...
2017/0133221 BUFFER STACK FOR GROUP IIIA-N DEVICES
A method of fabricating a multi-layer epitaxial buffer layer stack for transistors includes depositing a buffer stack on a substrate. A first voided Group...
2017/0133220 METHOD OF MATERIAL DEPOSITION
A method and apparatus for material deposition onto a sample to form a protective layer composed of at least two materials that have been formulated and...
2017/0133219 MATERIAL LAYERS, SEMICONDUCTOR DEVICES INCLUDING THE SAME, AND METHODS OF FABRICATING MATERIAL LAYERS AND...
A material layer, a semiconductor device including the material layer, and methods of forming the material layer and the semiconductor device are provided...
2017/0133218 APPARATUS AND METHOD FOR WAFER CLEANING
A wafer cleaning apparatus includes a polishing unit used in chemical mechanical polishing (CMP) of a wafer and a cleaning dispensing unit arranged to direct...
2017/0133217 SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE
A semiconductor substrate including: substrate; buffer layer provided on substrate; high-resistance layer provided on buffer layer, high-resistance layer being...
2017/0133216 Si PRECURSORS FOR DEPOSITION OF SiN AT LOW TEMPERATURES
Methods and precursors for depositing silicon nitride films by atomic layer deposition (ALD) are provided. In some embodiments the silicon precursors comprise...
2017/0133214 MASS SPECTROMETERS HAVING REAL TIME ION ISOLATION SIGNAL GENERATORS
Apparatuses, systems, and methods for performing mass analysis are disclosed. One such apparatus may include an ion trap device for use in a mass analysis...
2017/0133213 Method of Transmitting Ions Through an Aperture
A mass spectrometer is disclosed comprising: an ion source; an aperture; a flight region arranged between the ion source and aperture for separating ions...
2017/0133212 PORTABLE ELECTRONIC DEVICE FOR THE ANALYSIS OF A GASEOUS COMPOSITION
An electronic device 1 for analyzing a gas composition, which is present in an environment A at an environment pressure Pa, is described. The device 1 is...
2017/0133211 Time Shift for Improved Ion Mobility Spectrometry or Separation Digitisation
A method of analysing ions is disclosed comprising: (i) separating ions according to a physico-chemical property in a separator; (ii) transmitting ions which...
2017/0133210 Laminated Ultra-High Vacuum Forming Device
Provided is an ultra-high vacuum forming device containing an ion pump having a compact size in the central axis direction. The ultra-high vacuum forming...
2017/0133209 SPUTTERING TARGET
A target, in particular a sputtering target, includes a target plate of a brittle material and a back plate. The back plate is connected to the target plate...
2017/0133208 HALL EFFECT ENHANCED CAPACITIVELY COUPLED PLASMA SOURCE, AN ABATEMENT SYSTEM, AND VACUUM PROCESSING SYSTEM
Embodiments disclosed herein include a method for abating compounds produced in semiconductor processes. The method includes energizing an abating agent,...
2017/0133207 RARE-EARTH OXIDE BASED COATINGS BASED ON ION ASSISTED DEPOSITION
A component for a semiconductor processing chamber includes a ceramic body having at least one surface with a first average surface roughness of approximately...
2017/0133206 METHOD OF PROCESSING WORKPIECE
Provided is a method of processing a wafer, which is performed in a processing container of a plasma processing apparatus. This method is a plasma etching...
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