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Patent # Description
2017/0154920 LIGHT-EMITTING DEVICE
A light-emitting device includes a mounting board, a first wiring, a plurality of light-emitting elements, a first light-transmissive member, and a second...
2017/0154919 MANUFACTURING METHOD OF DISPLAY WITH LIGHTING DEVICES
A manufacturing method of display with lighting devices is disclosed, including providing a tank containing a liquid; disposing a carrying plate with several...
2017/0154918 Back Side Illuminated Image Sensor with Reduced Sidewall-Induced Leakage
Provided is a method of fabricating an image sensor device. An exemplary includes forming a plurality of radiation-sensing regions in a substrate. The...
2017/0154917 METHOD OF FORMING DEEP TRENCH ISOLATION IN RADIATION SENSING SUBSTRATE AND IMAGE SENSOR DEVICE
A method of forming a deep trench isolation in a radiation sensing substrate includes: forming a trench in the radiation sensing substrate; forming a corrosion...
2017/0154916 IMAGING PANEL AND X-RAY IMAGING SYSTEM PROVIDED WITH SAID IMAGING PANEL
An aim of the present invention is to make it possible to achieve stable operation of thin film transistors in an imaging panel of an X-ray imaging system that...
2017/0154915 IMAGING PANEL AND X-RAY IMAGING DEVICE
The present invention aims at inhibiting the occurrence of thinning or disconnecting of the bias wiring line in an imaging panel and X-ray imaging device,...
2017/0154914 IMAGING PANEL AND X-RAY IMAGING DEVICE PROVIDED THEREWITH
An aim of the present invention is to provide a technology that increases the aperture ratio of an imaging panel. The imaging panel captures scintillation...
2017/0154913 SEMICONDUCTOR PACKAGE
A semiconductor package device includes a first semiconductor package including a first package substrate and a semiconductor chip stacked on the first package...
2017/0154912 SOLID-STATE IMAGING APPARATUS
A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member...
2017/0154911 IMAGE SENSOR AND ELECTRONIC DEVICE INCLUDING THE SAME
An image sensor includes a semiconductor substrate including a plurality of photo-sensing devices, a photoelectric conversion device disposed on the...
2017/0154910 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
Disclosed is a solid-state imaging device including: a solid-state imaging element which outputs an image signal according to an amount of light sensed on a...
2017/0154909 SIGNAL PROCESSING CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING THE SIGNAL PROCESSING CIRCUIT
Provided is a semiconductor device that can operate stably. All transistors included in the semiconductor device are transistors each of which contains an...
2017/0154908 PHOTOELECTRIC CONVERSION DEVICE AND IMAGING SYSTEM
A photoelectric conversion device includes a photoelectric conversion unit including a first and second electrodes, a photoelectric conversion layer between...
2017/0154907 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
A solid-state imaging device includes pixels each having a photoelectric conversion element for converting incident light to an electric signal, color filters...
2017/0154906 OPTICAL SENSOR HAVING TWO TAPS FOR PHOTON-GENERATED ELECTRONS OF VISIBLE AND IR LIGHT
An optical sensor in which photo currents generated by light in the visible and infrared wavelength ranges are to be tapped separately at pn junctions of...
2017/0154905 THIN FILM TRANSISTOR AND PREPARATION METHOD THEREOF, ARRAY SUBSTRATE, AND DISPLAY PANEL
This disclosure provides a thin film transistor and the preparation method thereof, an array substrate, and a display panel, so as to solve the problem that...
2017/0154904 MANUFACTURING METHOD OF DISPLAY PANEL
A manufacturing method of a display panel disclosed by the invention includes: providing a substrate, the substrate having a first metal layer disposed...
2017/0154903 METHOD OF FABRICATING CRYSTALLINE ISLAND ON SUBSTRATE
Certain electronic applications, such as OLED display back panels, require small islands of high-quality semiconductor material distributed over a large area....
2017/0154902 PEELING APPARATUS AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
To eliminate electric discharge when an element formation layer including a semiconductor element is peeled from a substrate used for manufacturing the...
2017/0154901 Thin Film Transistor and Display Panel
The thin film transistor includes: a gate electrode formed on a surface of a substrate; a polysilicon layer formed on an upper side of the gate electrode; an...
2017/0154900 INTEGRATED TENSILE STRAINED SILICON NFET AND COMPRESSIVE STRAINED SILICON-GERMANIUM PFET IMPLEMENTED IN FINFET...
A tensile strained silicon layer is patterned to form a first group of fins in a first substrate area and a second group of fins in a second substrate area....
2017/0154899 ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE SAME
An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or...
2017/0154898 Display Device
A disclosed display device includes a first oxide semiconductor layer and an oxide semiconductor connection wire both formed from an oxide semiconductor...
2017/0154897 THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF
A thin film transistor array panel includes: a gate wiring layer disposed on a substrate; an oxide semiconductor layer disposed on the gate wiring layer; and a...
2017/0154896 ARRAY SUBSTRATE AND DISPLAY DEVICE
An array substrate and a display device, which relates to the field of display technology. The array substrate comprises a base substrate, a plurality of first...
2017/0154895 Three-Dimensional Semiconductor Device and Manufacturing Method Therefor
A three-dimensional semiconductor device, comprising a plurality of memory cell transistors and a plurality of select transistors at least partially overlapped...
2017/0154894 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
According to one embodiment, a method of manufacturing a semiconductor device includes: forming a first film including a conductive material above a...
2017/0154893 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
An improvement is achieved in the performance of a semiconductor device having a nonvolatile memory. A memory cell of the nonvolatile memory includes a control...
2017/0154892 ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
Provided is an electronic device including a semiconductor memory, The semiconductor memory may include: a first channel layer formed over a substrate and...
2017/0154891 METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
The present disclosure provides a method of fabricating a semiconductor structure, and the method includes following steps. A gate structure is formed on a...
2017/0154890 ONE TIME PROGRAMMABLE MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME
A one time programmable (OTP) memory device, a method of manufacturing the same, and an electronic device including the same, which lower a programming voltage...
2017/0154889 INTEGRATED CIRCUIT HAVING MIM CAPACITOR WITH REFRACTORY METAL SILICIDED STRAP AND METHOD TO FABRICATE SAME
A method includes forming a trench in a Silicon substrate; depositing metal on sidewalls and a bottom of the trench; annealing to react the metal with...
2017/0154888 Compact Semiconductor Memory Device Having Reduced Number of Contacts, Methods of Operating and Methods of Making
An integrated circuit including a link or string of semiconductor memory cells, wherein each memory cell includes a floating body region for storing data. The...
2017/0154887 SEMICONDUCTOR TRANSISTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor transistor device includes an oxide semiconductor layer having an active surface, a source electrode, a drain electrode, a gate electrode and a...
2017/0154886 CRITICAL DIMENSION CONTROL FOR DOUBLE PATTERNING PROCESS
In a method for manufacturing a semiconductor device, a dummy gate layer and a hard mask layer are sequentially formed on a substrate. A first doped portion is...
2017/0154885 NITRIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A nitride semiconductor device includes a conductive substrate and a nitride semiconductor layer. The nitride semiconductor layer is disposed on the conductive...
2017/0154884 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
The improvement of the reliability of a semiconductor device having a split gate type MONOS memory is implemented. An ONO film and a second polysilicon film...
2017/0154883 SEMICONDUCTOR DEVICE INCLUDING FINFET AND FIN VARACTOR
A semiconductor device includes a semiconductor substrate having a fin-type field effect transistor (finFET) on a first region and a fin varactor on a second...
2017/0154882 SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
Some embodiments of the present disclosure provide a semiconductor device. The semiconductor device includes a first transistor configured to include a first...
2017/0154881 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
The present disclosure relates to a semiconductor device and method of manufacturing the same. The method for manufacturing a semiconductor device includes:...
2017/0154880 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE
A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member...
2017/0154879 METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE
A method of manufacturing a light-emitting device incudes providing a supporting member having a recess; disposing a light-emitting element at a bottom surface...
2017/0154878 STACK PACKAGE AND METHOD OF MANUFACTURING THE STACK PACKAGE
In a method of manufacturing a stack package, a first semiconductor chip is formed on a first package substrate. A second semiconductor chip is formed on a...
2017/0154877 HALF-BRIDGE POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
A module (1) includes an insulating substrate (15), a power semiconductor device (13HT), a power semiconductor device (13LT), a bridge terminal (14B), a...
2017/0154876 3D IC WITH SERIAL GATE MOS DEVICE, AND METHOD OF MAKING THE 3D IC
A die stack comprises a first integrated circuit (IC) die having at least a first device comprising a first source, a first drain and a first gate electrode...
2017/0154875 Multiple bond via arrays of different wire heights on a same substrate
Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires ("first wires") extend from a surface of the...
2017/0154874 STACKABLE MOLDED MICROELECTRONIC PACKAGES
A microelectronic package has a microelectronic element overlying or mounted to a first surface of a substrate and substantially rigid conductive posts...
2017/0154873 Semiconductor Devices Including Stacked Semiconductor Chips
A semiconductor device includes a chip stack structure including a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor...
2017/0154872 SEMICONDUCTOR PACKAGES INCLUDING MOLDED STACKED DIE WITH TERRACE-LIKE EDGES
A semiconductor package may include a first semiconductor die, external connectors, second semiconductor dies, a mold layer, an outer packaging part, and a...
2017/0154871 PRINTED WIRING BOARD
A printed wiring board includes a lowermost resin insulating layer, a first conductor layer formed on a first surface of the lowermost resin insulating layer,...
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