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Patent # Description
2017/0213860 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor layer having a front surface on which a transistor is provided and a back surface opposite to the front...
2017/0213859 SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM
A semiconductor device is provided. The device generates a signal based on both a first carrier generated in a first photodiode and a second carrier generated...
2017/0213858 LOW TEMPERATURE POLY-SILICON (LTPS) THIN FILM TRANSISTORS (TFT) UNITS AND THE MANUFACTURING METHOD THEREOF
The present disclosure relates to a LTPS TFT unit for liquid crystal modules and the manufacturing method thereof. The manufacturing method includes: forming a...
2017/0213855 OXIDE SEMICONDUCTOR, THIN FILM TRANSISTOR, AND DISPLAY DEVICE
An object is to control composition and a defect of an oxide semiconductor, another object is to increase a field effect mobility of a thin film transistor and...
2017/0213852 ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, DISPLAY PANEL AND DISPLAY DEVICE
A method for manufacturing an array substrate includes: forming a first conductive pattern and a second conductive pattern on a base substrate; forming a via...
2017/0213846 SEMICONDUCTOR DEVICE
The semiconductor device according to the embodiments of the present disclosure may include a contact line connecting a pair of channel pillars with a silt...
2017/0213844 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
In an embodiment, the semiconductor device may include interlayer insulating layers, conductive patterns, a channel layer, cell blocking insulating layers,...
2017/0213840 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
According to one embodiment, a method for manufacturing a semiconductor device is disclosed. The method includes forming a stacked body alternately stacked...
2017/0213838 NON-VOLATILE MEMORY AND FABRICATING METHOD THEREOF
A non-volatile memory including a substrate, a charge storage structure, two metal gate structures, a first dielectric layer, a second dielectric layer, a...
2017/0213833 SEMICONDUCTOR DEVICE AND MEMORY DEVICE
To provide a semiconductor device with large storage capacity and low power consumption. The semiconductor device includes an oxide semiconductor, a first...
2017/0213831 OPERATIONAL AMPLIFIER CIRCUIT
In an output amplifier stage of an operational amplifier circuit, the first p-well of the first nMOSFET and the second p-well of the second nMOSFET are...
2017/0213826 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
A semiconductor device including a substrate includes a first region and a second region and first and second transistors in the first and second regions,...
2017/0213823 SEMICONDUCTOR DEVICE AND A FABRICATING METHOD THEREOF
A semiconductor device including: a fin-type pattern protruding from a substrate and including a first side surface and a second side surface opposite each...
2017/0213815 OPTIMIZED CONFIGURATIONS TO INTEGRATE STEERING DIODES IN LOW CAPACITANCE TRANSIENT VOLTAGE SUPPRESSOR (TVS)
A transient-voltage suppressing (TVS) device disposed on a semiconductor substrate including a low-side steering diode, a high-side steering diode integrated...
2017/0213812 SEMICONDUCTOR DEVICE
A semiconductor device includes a light emitting element comprising a substrate having a first and a second surface and an outer edge connecting the first and...
2017/0213811 HIGH PERFORMANCE POWER MODULE
The present disclosure relates to a power module that has a housing with an interior chamber and a plurality of switch modules interconnected to facilitate...
2017/0213804 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
The present disclosure provides a semiconductor package, including a semiconductor die and a substrate having a first surface electrically coupled to the...
2017/0213803 Methods for Surface Attachment of Flipped Active Components
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a...
2017/0213796 Electronic chip inspection by backside illumination
An apparatus for inspecting a plurality of electronic chips singularized from a wafer, wherein the apparatus comprises an electromagnetic radiation source...
2017/0213793 NOVEL EMBEDDED PACKAGES
A structure consisting of at least one die embedded in a polymer matrix and surrounded by the matrix, and further consisting of at least one through via...
2017/0213792 FABRICATION OF IC STRUCTURE WITH METAL PLUG
Aspects of the present disclosure include integrated circuit (IC) structures with metal plugs therein, and methods of forming the same. An IC fabrication...
2017/0213787 INTERPOSER WITH BEYOND RETICLE FIELD CONDUCTOR PADS
Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, an apparatus is provided that includes an interposer that has a...
2017/0213784 LEADFRAME STRIP WITH VERTICALLY OFFSET DIE ATTACH PADS BETWEEN ADJACENT VERTICAL LEADFRAME COLUMNS
A leadframe strip for use in making leaded integrated circuit packages includes a plurality of integrally connected leadframes that each have a die attach pad...
2017/0213780 METAL GATE TRANSISTOR, INTEGRATED CIRCUITS, SYSTEMS, AND FABRICATION METHODS THEREOF
An integrated circuit includes a substrate, a first inter-layer dielectric (ILD) layer over the substrate, and a gate strip having a first width formed in the...
2017/0213776 SEMICONDUCTOR DEVICE
A semiconductor device includes first and second semiconductor components mounted on an interposer mounted on a wiring substrate, and electrically connected to...
2017/0213774 PACKAGE WAFER PROCESSING METHOD
A package wafer processing method includes a processing step of processing a package wafer along planned dividing lines by a laser beam irradiation unit and...
2017/0213761 Semiconductor Devices Including a Diode Structure Over a Conductive Strap and Methods of Forming Such...
Semiconductor devices including at least one diode over a conductive strap. The semiconductor device may include at least one conductive strap over an...
2017/0213752 SUBSTRATE STORAGE CONTAINER
To provide a substrate storage container that enables efficient replacement of the air inside the container main body with a substrate protecting gas. The...
2017/0213749 HIGH PRODUCTIVITY SOAK ANNEAL SYSTEM
Embodiments described herein relate to apparatus and methods for thermally processing substrates. In one embodiment, a processing system includes a factory...
2017/0213742 FINAL POLISHING METHOD OF SILICON WAFER AND SILICON WAFER
A final polishing method using a polishing agent that contains colloidal silica, ammonia, and hydroxyethyl cellulose in which the colloidal silica has a...
2017/0213739 Low Resistance Source Drain Contact Formation with Trench Metastable Alloys and Laser Annealing
Techniques for forming a metastable phosphorous P-doped silicon Si source drain contacts are provided. In one aspect, a method for forming n-type source and...
2017/0213735 SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
A method for manufacturing a semiconductor substrate may comprise irradiating a surface of a first semiconductor layer and a surface of a second semiconductor...
2017/0213734 MULTIFREQUENCY CAPACITIVELY COUPLED PLASMA ETCH CHAMBER
A plasma processing system for use with a gas. The plasma processing system comprises a first electrode, a second electrode, a gas input port, a power source...
2017/0213731 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming a feature layer on a substrate, forming a plurality of reference patterns, arranged at a...
2017/0213726 Acetylide-Based Silicon Precursors And Their Use As ALD/CVD Precursors
Provided are acetylide-based compounds and methods of making the same. Also provided are methods of using said compounds in film deposition processes to...
2017/0213725 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus comprises: a first solidifier and a second solidifier. The first solidifier solidifies a liquid to be solidified adhering to a...
2017/0213724 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes forming features of a first mold pattern on a substrate including a first region and a second...
2017/0213721 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
According to one embodiment, a substrate processing apparatus includes a nozzle and a control device. The nozzle dispenses a chemical solution onto a...
2017/0213715 DETECTION OF COMPOUNDS THROUGH DOPANT-ASSISTED PHOTOIONIZATION
The present disclosure is directed to the ability to use dopant-assisted photoionization to detect substances of interest. Various dopants can be used through...
2017/0213713 Multipath Duty Cycle Enhancement
A mass spectrometer is disclosed comprising a first device, a second device and a switch arranged and adapted: (i) to direct ions at a first time T1 to the...
2017/0213712 Backing Plate Obtained by Diffusion-Bonding Anticorrosive Metal and Mo or Mo Alloy, and Sputtering...
Provided is a backing plate obtaining by bonding an anticorrosive metal and Mo or a Mo alloy, wherein the backing plate comprises, on a surface of the Mo or Mo...
2017/0213709 METHODS FOR IN-SITU CHAMBER CLEAN IN PLASMA ETCHING PROCESSING CHAMBER
Embodiments of the disclosure include methods for in-situ chamber cleaning a plasma processing chamber utilized for photomask plasma fabrication process. In...
2017/0213708 METHOD AND APPARATUS FOR SAVING ENERGY WHILE INCREASING THE CONVEYING SPEED IN VACUUM COATING PLANTS
Disclosed are an apparatus and a method for saving energy while increasing the conveying speed in vacuum coating plants consisting of a series of sputtering...
2017/0213707 SUBSTRATE PROCESSING APPARATUS
Provided is a substrate processing apparatus including a chamber; a placing table provided inside the chamber and configured to place a processing target...
2017/0213705 SLIT VALVE GATE COATING AND METHODS FOR CLEANING SLIT VALVE GATES
Slit valve gates and methods for cleaning are provided. Slit valves include: a slit valve gate configured to seal an opening of a process chamber, the slit...
2017/0213703 PLASMA PROCESSING APPARATUS AND CONTROL METHOD
The plasma processing apparatus includes a first electrode to which high frequency power is applied, a second electrode that functions as a counter electrode...
2017/0213701 Symmetric Plasma Source To Generate Pie Shaped Treatment
Plasma source assemblies comprising a housing with an RF hot electrode having a body and a plurality of source electrodes extending vertically from the RF hot...
2017/0213700 Plasma Treatment Method to Meet Line Edge Roughness and Other Integration Objectives
Provided is a method of patterning a layer on a substrate using an integration scheme, the method comprising: disposing a substrate having a structure pattern...
2017/0213699 GAS SPLITTING BY TIME AVERAGE INJECTION INTO DIFFERENT ZONES BY FAST GAS VALVES
Techniques are disclosed for methods and apparatuses for delivering process gas for processing a substrate. In one embodiment, the method begins by injecting...
2017/0213697 MULTI MODE SYSTEM WITH A DISPERSION X-RAY DETECTOR
A method for evaluating a specimen, the method can include positioning an energy dispersive X-ray (EDX) detector at a first position; scanning a flat surface...
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