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Patent # Description
2017/0287765 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Provided is a method of manufacturing a semiconductor device with improved manufacturing efficiency for the semiconductor device. The method of manufacturing a...
2017/0287764 ELECTROSTATIC CHUCK DEVICE
The present invention provides an electrostatic chuck device capable of increasing the electrostatic adsorptive force for a focus ring and uniformly cooling...
2017/0287763 WAFER ALIGNING DEVICE AND METHOD FOR ALIGNING A WAFER INTO A SPECIFIED ROTATIONAL ANGULAR POSITION
The invention relates to wafer aligning device (1) and a corresponding method for aligning a wafer (2) into a specified rotational angular position (a.sub.s),...
2017/0287762 PLATING APPARATUS AND PLATING METHOD
A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed...
2017/0287761 PLATING APPARATUS AND PLATING METHOD
A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed...
2017/0287760 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes a carrier holding unit which holds a carrier that contains substrates, a plurality of processing units, each of which...
2017/0287759 HAND UNIT AND TRANSFER METHOD
A hand unit of a robot arm includes a U-shaped placement portion on which a semiconductor wafer is placed. The hand unit includes, on one end side of the...
2017/0287758 SUBSTRATE STORING CONTAINER
A substrate storing container includes a container main body, a lid body, and a lateral substrate support portion. The lateral substrate support portion of the...
2017/0287757 DAMAGE MONITOR
Devices and methods are shown that use sensors to detect physical characteristics of an IC circuit or other device over time. The physical characteristics and...
2017/0287756 TIMING/POWER RISK OPTIMIZED SELECTIVE VOLTAGE BINNING USING NON-LINEAR VOLTAGE SLOPE
Systems and methods for optimizing timing/power risk SVB using a customer-supplied, non-linear voltage slope. Chips are manufactured according to an integrated...
2017/0287755 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PRESENCE OR ABSENCE CHECKING METHOD AND PROGRAM
A substrate processing apparatus includes transport mechanisms 121a to 127a, a sensor 40 for detecting whether a wafer W is held by the transport mechanisms...
2017/0287754 Systems and Methods for Automated Multi-Zone Detection and Modeling
A semiconductor tool includes an illumination source to generate an illumination beam, one or more illumination optical elements to direct a portion of the...
2017/0287753 SYSTEMS AND METHODS FOR ALIGNING MEASUREMENT DEVICE IN SUBSTRATE PROCESSING SYSTEMS
A substrate support in a substrate processing system includes an inner portion arranged to support a substrate, an edge ring surrounding the inner portion, and...
2017/0287752 INTEGRATED METROLOGY AND PROCESS TOOL TO ENABLE LOCAL STRESS/OVERLAY CORRECTION
Embodiments of the disclosure provide an integrated system for performing a measurement process and a lithographic overlay error correction process on a...
2017/0287751 Semiconductor Metrology With Information From Multiple Processing Steps
Methods and systems for measuring process induced errors in a multiple patterning semiconductor fabrication process based on measurements of a specimen and...
2017/0287750 MANAGEMENT METHOD OF SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
A measurement processing process S103 of measuring a cut width of a film based on an image obtained by imaging, with an imaging unit 270, a peripheral portion...
2017/0287749 SUBSTRATE TREATMENT METHOD, COMPUTER STORAGE MEDIUM AND SUBSTRATE TREATMENT SYSTEM
A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist...
2017/0287748 APPARATUSES FOR BONDING SEMICONDUCTOR CHIPS
An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates...
2017/0287747 Substrate Heating Device And Substrate Heating Method
A substrate heating device and substrate heating method is disclosed. The device comprises: a heating layer for transferring heat; a transfer pipe for...
2017/0287746 SUBSTRATE TRANSFER METHOD AND PROCESSING SYSTEM
Provided is a substrate transfer method for sequentially transferring a substrate between a heat treatment chamber and another chamber different from the heat...
2017/0287745 HEATER ELEMENTS WITH ENHANCED COOLING
A heater assembly with enhanced cooling pursuant to various embodiments described herein makes use of fluidic flow in the insulation or in the space used for...
2017/0287744 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
According to one embodiment, a substrate processing apparatus includes a tank that stores a treatment liquid; a liquid level pipe connected to the tank such...
2017/0287743 SUBSTRATE TREATING DEVICE AND SUBSTRATE TREATING METHOD
According to the embodiment, a substrate treating device 1 that rotates and washes a substrate, the device includes a spinning holding mechanism for holding a...
2017/0287742 SUBSTRATE PROCESSING APPARATUS
Provided is a substrate processing apparatus including a liquid processing unit that performs a liquid processing on a substrate; a drying processing unit that...
2017/0287741 SUBSTRATE PROCESSING APPARATUS
A guard that receives a processing liquid removed off a substrate, is disposed so as to surround a substrate holding unit and a facing member in plan view. The...
2017/0287740 FUME REMOVAL APPARATUS FOR SEMICONDUCTOR MANUFACTURING CHAMBER
Disclosed is a fume removal apparatus for a semiconductor manufacturing chamber. The disclosed fume removal apparatus for a semiconductor manufacturing chamber...
2017/0287739 TREATMENT APPARATUS FOR TREATING A SURFACE OF A BODY
The invention relates to a treatment apparatus (1) for treating a surface (21) of a body (2) with a first treatment medium (31) and a second treatment medium...
2017/0287738 FAN-OUT WAFER LEVEL PACKAGING STRUCTURE
A semiconductor device includes a first die including a first pad and a first passivation layer, a second die including a second pad and a second passivation...
2017/0287737 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The reliability of a semiconductor device is improved. During resin injection in a molding step, in a plan view, a plurality of gates of a molding die are...
2017/0287736 COMPLEX CAVITY FORMATION IN MOLDED PACKAGING STRUCTURES
Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial...
2017/0287735 ELECTRONIC DEVICE PACKAGE
Electronic device package technology is disclosed. In one example, an electronic device package can include a substrate, an electronic component disposed on...
2017/0287734 SEMICONDUCTOR PACKAGES INCLUDING INTERPOSER AND METHODS OF MANUFACTURING THE SAME
A semiconductor package may include a semiconductor die mounted on a first surface of an interposer die so that a die connection portion of the semiconductor...
2017/0287733 PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
Apparatuses relating to a microelectronic package are disclosed. In one such apparatus, a substrate has first contacts on an upper surface thereof. A...
2017/0287732 WATER SOLUBLE FLUX WITH MODIFIED VISCOSITY
A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may...
2017/0287731 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes: (a) loading into a process chamber a substrate including: a wiring layer including a first...
2017/0287730 THERMOSONICALLY BONDED CONNECTION FOR FLIP CHIP PACKAGES
A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by...
2017/0287729 PROCESS FOR PACKAGING CIRCUIT COMPONENT HAVING COPPER CIRCUITS WITH SOLID ELECTRICAL AND THERMAL CONDUCTIVITIES...
A method for packaging a circuit component, comprising: forming a first protruding pad on a first copper substrate and a through-hole in the first protruding...
2017/0287728 METHODS FOR METALIZING VIAS WITHIN A SUBSTRATE
Methods of metalizing vias within a substrate are disclosed. In one embodiment, a method of metalizing vias includes disposing a substrate onto a growth...
2017/0287727 METAL HARD MASK AND METHOD OF MANUFACTURING SAME
A metal hard mask for etching an etching target film that is present on a target object to be processed is formed of an amorphous alloy film that is formed by...
2017/0287726 Process and Apparatus for Processing a Nitride Structure Without Silica Deposition
Techniques are provided to remove the growth of colloidal silica deposits on surfaces of high aspect ratio structures during silicon nitride etch steps. A high...
2017/0287725 Colloidal Silica Growth Inhibitor and Associated Method and System
A technique to inhibit the growth of colloidal silica deposits on surfaces treated in phosphoric acid is described. In one embodiment, the disclosed techniques...
2017/0287724 SELECTIVE SELF-ALIGNED PATTERNING OF SILICON GERMANIUM, GERMANIUM AND TYPE III/V MATERIALS USING A...
A method for patterning a substrate including multiple layers using a sulfur-based mask includes providing a substrate including a first layer and a second...
2017/0287723 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A method for fabricating semiconductor device includes the steps of: providing a substrate; forming a fin-shaped structure on the substrate; performing a first...
2017/0287722 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND MAINTENANCE METHOD OF DRY ETCHING EQUIPMENT
The manufacturing yield of a semiconductor product is attempted to improve by reducing a particle and stabilizing an etching characteristic after the...
2017/0287721 ANODIC ETCHING OF SUBSTRATES
A bi-directional bipolar junction transistor (BJT) structure, comprising: a base region of a first conductivity type, wherein said base region constitutes a...
2017/0287720 Methods to Prevent Whisker Growth in Metal Coatings
Whisker growth can be prevented in tin coatings by altering the tin film composition) or by modifying the tin/substrate interface.
2017/0287719 METHODS OF FORMING MEMORY CELLS WITH AIR GAPS AND OTHER LOW DIELECTRIC CONSTANT MATERIALS
Various embodiments include apparatuses and methods of forming the same. One such apparatus can include a first dielectric material and a second dielectric...
2017/0287718 Method of Fabricating a Tunnel Oxide Layer and a Tunnel Oxide Layer for a Semiconductor Device
A method of fabricating a tunnel oxide layer for a semiconductor memory device, the method comprising: fabricating on a substrate a first oxide layer by an...
2017/0287717 ENGINEERED ETCHED INTERFACES FOR HIGH PERFORMANCE JUNCTIONS
Various methods for fabricating a semiconductor device by selective in-situ cleaning of a target surface of a semiconductor substrate by selective dry surface...
2017/0287716 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device, includes rotating a substrate support tool accommodated in a process chamber and configured to support a...
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