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Patent # Description
2017/0330819 HEAT EXCHANGING APPARATUS AND SEMICONDUCTOR REFRIGERATOR HAVING THE SAME
The present invention is related to a heat exchanging apparatus and a semiconductor refrigerator having the heat exchanging apparatus. Specifically, the...
2017/0330818 ELECTRONIC DEVICE
An electronic device includes: a resin substrate that includes insulation resin on which wiring made of conductive material is provided; a heat-generation...
2017/0330817 HEAT-DISSIPATING STRUCTURE AND METHOD FOR MANUFACTURING SAME
A heat-dissipating structure including a heat sink having a recessed portion on a first surface facing a heat generator, the recessed portion having a side...
2017/0330816 BONDING SCHEME FOR DIAMOND COMPONENTS WHICH HAS LOW THERMAL BARRIER RESISTANCE IN HIGH POWER DENSITY APPLICATIONS
A semiconductor device comprising: a semiconductor component; a diamond heat spreader; and a metal bond, wherein the semiconductor component is bonded to the...
2017/0330815 MOUNTING AND ENVIRONMENTAL PROTECTION DEVICE FOR AN IGBT MODULE
A semiconductor module is disclosed. The semiconductor module may include a housing having a sidewall portion, a housing support plate coupled to a bottom...
2017/0330814 ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on...
2017/0330813 BASE-ATTACHED ENCAPSULANT FOR SEMICONDUCTOR ENCAPSULATION, SEMICONDUCTOR APPARATUS, AND METHOD FOR...
A base-attached encapsulant for semiconductor encapsulation is used for collectively encapsulating a device-mounted surface of the semiconductor device-mounted...
2017/0330812 SEMICONDUCTOR PACKAGE WITH BARRIER FOR RADIO FREQUENCY ABSORBER
Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a...
2017/0330811 METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER, HERMETIC SEALING LID MEMBER, AND METHOD FOR MANUFACTURING...
This method for manufacturing a hermetic sealing lid member (1, 201, 301) includes forming a Ni plated metal plate (70, 170) by forming a Ni plated layer (11,...
2017/0330810 SEMICONDUCTOR DEVICE
Provided are a power device, a sensor which measures a physical state of the power device to transmit a signal according to the physical state, a main...
2017/0330809 SEMICONDUCTOR DEVICE
In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a...
2017/0330808 Semiconductor Structure Having a Test Structure Formed in a Group III Nitride Layer
In an embodiment, a semiconductor structure includes a support substrate comprising a surface adapted to support epitaxial growth of a Group III nitride, one...
2017/0330807 PREVENTION OF CHARGING DAMAGE IN FULL-DEPLETION DEVICES
Methods and systems method for checking a semiconductor device for compliance with a rule include determining whether a fully depleted semiconductor on...
2017/0330806 CRITICAL DIMENSION CONTROL BY USE OF A PHOTO AGENT
A method for critical dimension control in which a substrate is received having an underlying layer and a patterned layer formed on the underlying layer, the...
2017/0330805 SYSTEMS AND METHODS FOR ALIGNING AND COUPLING SEMICONDUCTOR STRUCTURES
In a system for aligning at least two semiconductor structures for coupling, an alignment device includes a mounting structure having at least first and second...
2017/0330804 PREVENTION OF CHARGING DAMAGE IN FULL-DEPLETION DEVICES
Methods and systems method for checking a semiconductor device for compliance with a rule include determining one or more device type categories to which a...
2017/0330803 WAFER PROCESSING LAMINATE, METHOD FOR MANUFACTURING THEREOF, AND METHOD FOR CHECKING COVERAGE OF ORGANIC FILM...
The present invention provides a wafer processing laminate including a wafer having a surface on which unevenness and/or a protective organic film layer (A) is...
2017/0330802 FET TRENCH DIPOLE FORMATION
A semiconductor structure includes a first layered dipole structure formed within a gate trench within a first polarity region of the semiconductor structure....
2017/0330801 METHOD OF FORMING GATE OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE HAVING SAME
The disclosed technology generally relates to semiconductor devices and more particularly to a gate structure for a semiconductor device, and to methods of...
2017/0330800 LASER-BASED SEPARATION METHOD
The invention relates to a method for creating a detachment area (2) in a solid (1), in particular for detaching the solid (1) along the separating region (2)....
2017/0330799 WAFER PROCESSING METHOD
A wafer processing method includes a modified layer forming step of applying a laser beam so as to focus the laser beam inside the wafer, and form a modified...
2017/0330798 PROCESS OF FORMING AN ELECTRONIC DEVICE
A process of forming an electronic device includes providing a substrate having a major surface; etching a portion of a the substrate to define a trench...
2017/0330797 MANGANESE BARRIER AND ADHESION LAYERS FOR COBALT
Provided herein are methods of forming conductive cobalt (Co) interconnects and Co features. The methods involve deposition of a thin manganese (Mn)-containing...
2017/0330796 FILLING A CAVITY IN A SUBSTRATE USING SPUTTERING AND DEPOSITION
A method may include providing a cavity in a surface of a substrate, the cavity comprising a sidewall portion and a lower surface; directing depositing species...
2017/0330795 ALUMINUM OXIDE FOR THERMAL MANAGEMENT OR ADHESION
Embodiments herein relate to a package using aluminum oxide as an adhesion and high-thermal conductivity layer with a buildup layer having a first side and a...
2017/0330794 VIA BLOCKING LAYER
Techniques are disclosed for insulating or electrically isolating select vias within a given interconnect layer, so a conductive routing can skip over those...
2017/0330793 Packages with Through-Vias Having Tapered Ends
A package includes a device die, a molding material molding the device die therein, a through-via substantially penetrating through the molding material,...
2017/0330792 METHODS OF FABRICATING SILICON-ON-INSULATOR (SOI) SEMICONDUCTOR DEVICES USING BLANKET FUSION BONDING
A method for fabricating silicon-on-insulator (SOI) semiconductor devices, wherein the piezoresistive pattern is defined within a blanket doped layer after...
2017/0330791 Method of Fabricating Semiconductor Device Isolation Structure
A semiconductor device including reentrant isolation structures and a method for making such a device. A preferred embodiment comprises a substrate of...
2017/0330790 AIR GAP OVER TRANSISTOR GATE AND RELATED METHOD
A semiconductor device may include a transistor gate in a device layer; an interconnect layer over the device layer; and an air gap extending through the...
2017/0330789 Structure Having Isolated Deep Substrate Vias With Decreased Pitch And Increased Aspect Ratio And Related Method
A structure having isolated deep substrate vias with decreased pitch and increased aspect ratio is disclosed. The structure includes a device layer over a...
2017/0330788 Control Of The Incidence Angle Of An Ion Beam On A Substrate
One system includes a chamber, a chuck assembly, and an ion source. The chuck assembly includes a substrate support and a precession assembly with a center...
2017/0330787 MOUNTING TABLE SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND TEMPERATURE CONTROL METHOD
There is provided a mounting table system which includes: a mounting table rotatably installed so as to mount a substrate thereon; a plurality of heating parts...
2017/0330786 Automated Replacement of Consumable Parts Using Interfacing Chambers
A cluster tool assembly includes a vacuum transfer module, a process module having a first side connected to the vacuum transfer module. An isolation valve...
2017/0330785 SHEET, TAPE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
[PROBLEM] In accordance with one aspect of the present invention, to provide a tape and a sheet that make it possible to reduce cracking that would otherwise...
2017/0330784 SEMICONDUCTOR STRUCTURES COMPRISING POLYMERIC MATERIALS
Methods of forming semiconductor structures include providing a polymeric material over a carrier substrate, bonding another substrate to the polymeric...
2017/0330783 VACUUM CHUCK, BEVELING/POLISHING DEVICE, AND SILICON WAFER BEVELING/POLISHING METHOD
A vacuum chuck includes: a vacuum chuck stage having a circular vacuum surface; a vacuum protection pad provided to the vacuum surface; an annular or...
2017/0330782 METHOD FOR IN-DIE OVERLAY CONTROL USING FEOL DUMMY FILL LAYER
Methods for in-die overlay reticle measurement and the resulting devices are disclosed. Embodiments include providing parallel structures in a first layer on a...
2017/0330781 APPARATUS FOR FLIPPING SEMICONDUCTOR DEVICE
An apparatus for transferring a semiconductor device comprises platform comprising a carrier; a positioning unit above the platform and comprising an opening;...
2017/0330780 METHOD AND DEVICE FOR TREATING THE UNDERSIDE OF A SUBSTRATE
A method for treating the underside of a planar substrate with a treatment medium includes hydrophobizing the underside of the substrate, subsequently forming...
2017/0330779 MAGAZINE FOR PACKAGED INTEGRATED CIRCUITS
An IC magazine with retractable stop pins at both ends of the IC magazine. The retractable stop pins project into the magazine slot through an opening from a...
2017/0330778 RING SPACER
A ring spacer interposed between plate-shaped objects above and below in a container for storing and transporting the plate-shaped objects when a plurality of...
2017/0330777 PLASMA-PROCESSING DETECTION INDICATOR IN WHICH METAL OXIDE FINE PARTICLES ARE USED AS COLOR-CHANGE LAYER
The present invention provides a plasma treatment detection indicator including a color-changing layer that changes color by plasma treatment, exhibiting...
2017/0330776 PYROMETRY FILTER FOR THERMAL PROCESS CHAMBER
Embodiments of the invention generally relate to pyrometry during thermal processing of semiconductor substrates. More specifically, embodiments of the...
2017/0330775 MANUFACTURING CELL AND MANUFACTURING CELL MANAGEMENT SYSTEM
A manufacturing cell includes an allowable range setting unit configured to set an allowable range for physical quantity data or statistical processing data,...
2017/0330774 LASER PROCESSING APPARATUS
A laser oscillator of a laser processing apparatus generates burst pulses each composed of a plurality of sub-pulses. The plurality of sub-pulses are generated...
2017/0330773 PLASMA PROCESSING SYSTEM USING ELECTRON BEAM AND CAPACITIVELY-COUPLED PLASMA
A plasma processing system. The system may include a vacuum chamber including an electron emission region and a processing region, in which plasma is produced...
2017/0330772 PLASMA PROCESSING APPARATUS
A capacitively-coupled plasma processing apparatus includes: at least one chamber body providing chambers separated from each other; upper electrodes...
2017/0330771 LIQUID PARTICLE COUNTING OF SEMICONDUCTOR COMPONENT PARTS
Embodiments of the present disclosure generally relate to cleaning substrates, and more particularly, to methods and apparatus for endpoint detection of a...
2017/0330770 METHOD OF CLEANING A SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME
In a method of cleaning a substrate, a protecting liquid may be sprayed to a surface of the substrate from a first position in a first spray direction....
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