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Patent # Description
2017/0338247 CIRCUIT STRUCTURES WITH VERTICALLY SPACED TRANSISTORS AND FABRICATION METHODS
Circuit structures, such as inverters and static random access memories, and fabrication methods thereof are presented. The circuit structures include, for...
2017/0338246 DISPLAY DEVICE
A highly reliable display device is provided. The display device includes a first substrate, a first resin layer over the first substrate, a pixel portion and...
2017/0338245 THIN FILM TRANSISTOR, A METHOD OF MANUFACTURING THE SAME, AND A DISPLAY APPARATUS INCLUDING THE SAME
A thin film transistor including a substrate; a semiconductor layer disposed over the substrate; a gate insulting film disposed over the semiconductor layer;...
2017/0338244 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
A nonvolatile semiconductor memory device that have a new structure are provided, in which memory cells are laminated in a three dimensional state so that the...
2017/0338243 3-DIMENSIONAL NON-VOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
Provided are a 3-dimensional non-volatile memory device and a method of fabricating the same. The 3-dimensional non-volatile memory device may include a...
2017/0338242 THREE-DIMENSIONAL SEMICONDUCTOR DEVICE
A three-dimensional semiconductor device may include a lower electrode structure having a plurality of lower electrodes vertically stacked on a substrate and...
2017/0338241 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device includes a first structure, a dummy buffer stack structure, a peripheral contact hole, and a peripheral contact plug. The first...
2017/0338240 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device according to an embodiment, includes a stacked body, a plurality of first terraces, a second terrace, a plurality of interconnects, a...
2017/0338239 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor structure includes a substrate and a plurality of memory cells disposed on the substrate. Each memory cell includes a gate structure. The gate...
2017/0338238 SEMICONDUCTOR DEVICE
A semiconductor device is provided. The semiconductor device includes an electrode structure that has gate electrodes that are sequentially stacked on a...
2017/0338237 METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE ARRAY
A method of fabricating nanocrystal memory array includes stacking a silicon layer and a silicon germanium layer on a wafer. A gate oxide layer over is then...
2017/0338236 NON-OVERLAPPED-EXTENSION-IMPLANTATION NONVOLATILE MEMORY DEVICE CAPABLE OF BEING TREATED WITH ANTI-FUSE OPERATION
The present invention provides a non-overlapped-extension-implantation (NOI) nonvolatile memory device capable of being treated with anti-fuse operation....
2017/0338235 FINFET CIRCUIT STRUCTURES WITH VERTICALLY SPACED TRANSISTORS AND FABRICATION METHODS
Circuit structures, such as inverters and static random access memories, and fabrication methods thereof are presented. The circuit structures include, for...
2017/0338234 Methods, Structures and Devices for Intra-connection Structures
Systems and methods are provided for forming an intra-connection structure. A first gate structure and a first source/drain region adjacent to the first gate...
2017/0338233 STATIC RANDOM ACCESS MEMORY
A Static Random Access Memory (SRAM) Cell includes a first gate electrode layer covering a channel region of a read pull-down transistor, a second gate...
2017/0338232 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
A method of fabricating semiconductor device is provided. The method includes providing a substrate having a trench, plasma-ionizing a gas which comprises a...
2017/0338231 SEMICONDUCTOR STRUCTURE
A semiconductor structure is provided. The semiconductor structure includes a semiconductor substrate, a well region on the semiconductor substrate, a radio...
2017/0338230 S-Contact for SOI
Systems, methods, and apparatus for an improved protection from charge injection into layers of a device using resistive structures are described. Such...
2017/0338229 SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
A semiconductor device and a method for manufacturing the same are disclosed. The method comprises forming active patterns on a substrate that includes first...
2017/0338228 Structures and Methods for Fabricating Semiconductor Devices Using Fin Structures
Devices are described herein that include a first fin structure formed on a substrate. A second fin structure formed on the substrate. One or more gate...
2017/0338227 SEMICONDUCTOR DEVICE WITH METAL GATES
A semiconductor device includes at least a substrate, fin-shaped structures, a protection layer, epitaxial layers, and a gate electrode. The fin-shaped...
2017/0338226 CONTROLLING WITHIN-DIE UNIFORMITY USING DOPED POLISHING MATERIAL
Various embodiments include methods and integrated circuit structures. In some cases, an integrated circuit (IC) structure includes: a substrate; a set of fin...
2017/0338225 SEMICONDUCTOR STRUCTURE HAVING FINS AND METHOD FOR MANUFACTURING THE SAME
A semiconductor structure includes a substrate, at least one active fin present on the substrate, and at least one isolation dielectric surrounding the active...
2017/0338224 Heterojunction Field Effect Transistor Device with Serially Connected Enhancement Mode and Depletion Mode Gate...
Roughly described, a heterojunction field effect transistor device includes a first piezoelectric layer supporting a channel region, a second piezoelectric...
2017/0338223 SINGLE MASK LEVEL INCLUDING A RESISTOR AND A THROUGH-GATE IMPLANT
A method of forming an IC includes providing a field dielectric in a portion of a semiconductor surface, a bipolar or Schottky diode (BSD) class device area, a...
2017/0338222 ELECTROSTATIC DISCHARGE PROTECTION DEVICE FOR HIGH VOLTAGE
A circuit for protecting against electrostatic discharge events has a semiconductor substrate (200) of first conductivity embedding a first diode in a well...
2017/0338221 INTEGRATED CIRCUIT AND ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT THEREOF
An electrostatic discharge protection circuit is provided. The electrostatic discharge protection circuit includes a first metal-oxide-semiconductor (MOS)...
2017/0338220 DISPLAY DEVICE INCLUDING ELECTROSTATIC DISCHARGE CIRCUIT
The present invention relates to a display device including a static electricity discharge circuit. The display device according to an exemplary embodiment of...
2017/0338219 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING AN ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT
A semiconductor integrated circuit device having a first clamping circuit, a second clamping circuit, a third clamping circuit, a first path-changing line and...
2017/0338218 METHODS FOR FORMING INTEGRATED CIRCUIT HAVING GUARD RINGS
A method for forming an integrated circuit includes forming a first guard ring around at least one transistor over a substrate. The method further includes...
2017/0338217 Optoelectronic Semiconductor Chip and Method for Fabrication Thereof
An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a first semiconductor layer sequence having...
2017/0338216 COMPOUND MICRO-TRANSFER-PRINTED POWER TRANSISTOR DEVICE
Embodiments of the present invention provide a compound power transistor device including a first semiconductor substrate including a first semiconductor...
2017/0338215 HETEROGENEOUS CELL ARRAY
A heterogeneous cell array includes a first column of cells and a second column of cells. The first column of cells includes a first cell having a first area...
2017/0338214 STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier....
2017/0338213 NON-VOLATILE DUAL IN-LINE MEMORY MODULE (NVDIMM) MULTICHIP PACKAGE
A single multichip package is provided, comprising: a substrate having opposing upper and lower surfaces. A first die is mounted on the upper surface of the...
2017/0338212 DISPLAY DEVICE
The disclosure relates to a display device, including a first substrate, a light emitting component, an insulating layer, and a conductive element. The first...
2017/0338211 DISPLAY DEVICE
Provided is a display device, which includes a substrate, a transistor, a capacitor and a light emitting unit. The transistor and the capacitor are disposed on...
2017/0338210 LIGHT EMITTING DEVICE PACKAGE
A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second...
2017/0338209 Packaging a Substrate with an LED into an Interconnect Structure Only Through Top Side Landing Pads on the...
Standardized photon building blocks are packaged in molded interconnect structures to form a variety of LED array products. No electrical conductors pass...
2017/0338208 ELECTRONIC POWER DEVICE WITH VERTICAL 3D SWITCHING CELL
An electronic power device including: a first electronic power component in which all the electrodes are arranged at a first main face of the first electronic...
2017/0338207 Semiconductor Device and Method of Manufacture
A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device includes a first set of through vias between and...
2017/0338206 SEMICONDUCTOR PACKAGE
A semiconductor package includes: a first semiconductor chip in which a through-electrode is provided; a second semiconductor chip connected to a top surface...
2017/0338205 SEMICONDUCTOR PACKAGES INCLUDING THROUGH MOLD BALL CONNECTORS AND METHODS OF MANUFACTURING THE SAME
There is provided a structure and a method of manufacturing a semiconductor package. The method includes disposing a first semiconductor device and through...
2017/0338204 Device and Method for UBM/RDL Routing
An under bump metallurgy (UBM) and redistribution layer (RDL) routing structure includes an RDL formed over a die. The RDL comprises a first conductive portion...
2017/0338203 Semiconductor Devices and Methods of Manufacture Thereof
Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a first integrated circuit die, a...
2017/0338202 Advanced INFO POP and Method of Forming Thereof
In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing...
2017/0338201 POWER SEMICONDUCTOR MODULE AND ELECTRIC POWER STEERING APPARATUS USING THE SAME
[Problem] An object of the present invention is to miniaturize and integrate plural power semiconductors in an electronic circuit in a low cost without...
2017/0338199 Transferring Method, Manufacturing Method, Device and Electronic Apparatus of Micro-LED
A transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED, comprises: forming...
2017/0338198 DISPLAY DEVICE INCLUDING AN ANISOTROPIC CONDUCTIVE FILM, AND MANUFACTURING METHOD OF THE ANISOTROPIC CONDUCTIVE...
A display device including pads; an anisotropic conductive film on the pads; and a connection member bonded to the pads through the film, the connection member...
2017/0338197 SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
A technique which improves the reliability in coupling between a bump electrode of a semiconductor chip and wiring of a mounting substrate, more particularly a...
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