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Patent # Description
2018/0047638 SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
A method for fabricating a semiconductor structure includes forming a plurality of dummy gate structures on a substrate. Each dummy gate structure includes a...
2018/0047637 SELF-ALIGNED PUNCH THROUGH STOPPER LINER FOR BULK FINFET
A technique relates to forming a self-aligning field effect transistor. A starting punch through stopper comprising a substrate having a plurality of fins...
2018/0047636 METHOD OF FABRICATING FINFET STRUCTURE
A method of fabricating a semiconductor device includes forming a first well region and a second well region in a semiconductor substrate, forming an isolation...
2018/0047635 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device includes a semiconductor substrate, an isolation structure, and a spacer. The semiconductor substrate includes at least one fin...
2018/0047634 SEMICONDUCTOR DEVICE INCLUDING CONTACT STRUCTURE
A semiconductor device including a contact structure is provided. The semiconductor device includes an isolation region defining a lower active region. First...
2018/0047633 Method for Forming Semiconductor Device Structure with Gate
A method for forming a semiconductor device structure is provided. The method includes forming a dielectric layer over a substrate. The substrate has a fin...
2018/0047632 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Semiconductor structures and fabrication methods are provided. An exemplary fabrication method includes providing a base substrate; forming gate structures...
2018/0047631 SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF
Semiconductor structure and fabrication method thereof are provided. An exemplary method includes providing a semiconductor substrate including a plurality of...
2018/0047630 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
A method for manufacturing a semiconductor substrate according to the present invention includes a hydrogen layer forming step of forming a hydrogen layer on a...
2018/0047629 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
An object of the present invention is to improve the reliability of a semiconductor device. A semiconductor device has a first lead group comprised of a plurality...
2018/0047628 METHOD FOR SINGULATING AN ASSEMBLAGE INTO SEMICONDUCTOR CHIPS, AND SEMICONDUCTOR CHIP
A method for singulating an assemblage into a plurality of semiconductor chips is specified, wherein an assemblage comprising a carrier, a semiconductor layer...
2018/0047627 STRAIN RELIEF EPITAXIAL LIFT-OFF VIA PRE-PATTERNED MESAS
Disclosed herein are methods to eliminate or reduce the peeling-off of epitaxial lifted-off thin film epilayers on secondary host substrates that allow for the...
2018/0047626 THRU-SILICON-VIA STRUCTURES
Stress generation free thru-silicon-via structures with improved performance and reliability and methods of manufacture are provided. The method includes...
2018/0047625 REFLOW ENHANCEMENT LAYER FOR METALLIZATION STRUCTURES
A reflow enhancement layer is formed in an opening prior to forming and reflowing a contact metal or metal alloy. The reflow enhancement layer facilitates the...
2018/0047624 Cu WIRING FORMING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A method of forming, on a substrate having on a surface thereof a film having a trench of a preset pattern and a via at a bottom of the trench, a Cu wiring by...
2018/0047623 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
A semiconductor structure and a method for fabricating the semiconductor structure are provided. The method includes forming a base substrate, including a...
2018/0047622 DIFFUSION BARRIER LAYER FORMATION
A method of forming a titanium nitride (TiN) diffusion barrier includes exposing a deposition surface to a first pulse of a titanium-containing precursor and...
2018/0047621 FORMATION OF A TRANSITION METAL NITRIDE
A use of an amine-containing silane for forming a transition metal nitride is provided. In this use, the amine of the amine-containing silane is the source of...
2018/0047620 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
The reliability of wirings, each of which includes a main conductive film containing copper as a primary component, is improved. On an insulating film...
2018/0047618 ENGINEERED SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURE
A substrate includes a polycrystalline ceramic core; a first adhesion layer encapsulating the polycrystalline ceramic core; a conductive layer encapsulating...
2018/0047617 AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES
Semiconductor devices having air gap spacers that are formed as part of BEOL or MOL layers of the semiconductor devices are provided, as well as methods for...
2018/0047616 METHOD OF FORMING INTER-LEVEL DIELECTRIC STRUCTURES ON SEMICONDUCTOR DEVICES
A semiconductor device and a method for making the semiconductor device are provided. The method of making the semiconductor device may include patterning a...
2018/0047615 AIR GAP SPACER FORMATION FOR NANO-SCALE SEMICONDUCTOR DEVICES
Semiconductor devices having air gap spacers that are formed as part of BEOL or MOL layers of the semiconductor devices are provided, as well as methods for...
2018/0047614 THERMALLY STABLE CHARGE TRAPPING LAYER FOR USE IN MANUFACTURE OF SEMICONDUCTOR-ON-INSULATOR STRUCTURES
A single crystal semiconductor handle substrate for use in the manufacture of semiconductor-on-insulator (e.g., silicon-on-insulator (SOI)) structure is etched...
2018/0047613 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
A semiconductor device and a method for fabricating the semiconductor device are provided. The method includes providing a semiconductor substrate including a...
2018/0047612 Two-level Tape Frame Rinse Assembly
A two-level tape frame rinse assembly is configured for grasping the substrate so as to create a gap between the substrate and a backside support plate that...
2018/0047611 SEMICONDUCTOR WAFER DEVICE AND MANUFACTURING METHOD THEREOF
A method of dies singulation includes providing a carrier, disposing a plurality of dies over a surface of the carrier according to a plurality of scribe lines...
2018/0047610 FABRICATION METHOD OF ELECTRONIC PACKAGE
An electronic package is provided, including: a circuit structure having opposite first and second surfaces, wherein first and second circuit layers are formed...
2018/0047609 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
The yield of a manufacturing process of a display device is increased. The productivity of a display device is increased. A hydrogen-containing layer is formed...
2018/0047608 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
A method of manufacturing an electronic device includes: in transferring one or a plurality of element sections onto a first substrate from a second substrate,...
2018/0047607 APPARATUS AND METHOD FOR MEASUREMENT OF THE THERMAL PERFORMANCE OF AN ELECTROSTATIC WAFER CHUCK
An apparatus and method are described for measuring the thermal performance of a wafer chuck, such as an electrostatic chuck. In one example, the apparatus ha...
2018/0047606 ELECTROSTATIC CHUCK HEATER
An electrostatic chuck heater is such that a sheet heater formed by embedding a heater wire in a resin sheet is disposed between an electrostatic chuck and a...
2018/0047605 FILM ELECTRODE FOR ELECTROSTATIC CHUCK
A perforated film electrode for a pinned electrostatic chuck that lies below the top surface of the pins in the valleys or interstices between pins, below the...
2018/0047604 SUBSTRATE HOLDING APPARATUS
A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit,...
2018/0047603 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
One or plurality of correction information corresponding to one or plurality of spin chucks are acquired in advance for adjustment of a position of a substrate...
2018/0047602 TRANSFER CHAMBER
The transfer chamber transfers a wafer (W) as a transferred object to or from a processing device (6) by using a transfer robot (2) provided thereinside, and...
2018/0047601 TRANSFER DEVICE AND TRANSFER METHOD
The disclosure provides a transfer device and a transfer method using the same. The transfer device comprises a first conveyance roller, a transfer roller and...
2018/0047600 SENSING METHOD AND SENSING SYSTEM
A sensing method includes sensing the target object by sensing light that is derived from emitted light and has passed the target object, in which the emitted...
2018/0047599 PROCESS KIT EROSION AND SERVICE LIFE PREDICTION
Embodiments of the present disclosure provide a method, system, and computer program product for monitoring a service life of a chamber component. In one...
2018/0047598 PLATFORM ARCHITECTURE TO IMPROVE SYSTEM PRODUCTIVITY
A loading station for a substrate processing system includes first and second vertically-stacked loading stations. The first loading station includes a first...
2018/0047597 SUPPORT RING WITH ENCAPSULATED LIGHT BARRIER
Embodiments described herein provide a thermal processing apparatus with a heat source and a rotating substrate support opposite the heat source, the rotating...
2018/0047596 APPARATUS AND RADIANT HEATING PLATE FOR PROCESSING WAFER-SHAPED ARTICLES
An apparatus for processing wafer-shaped articles includes a rotary chuck adapted to hold a wafer-shaped article of a predetermined diameter thereon. A radiant...
2018/0047595 PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD USING SAME
Provided is a plasma processing apparatus capable of implementing both a radical irradiation step and an ion irradiation step using a single apparatus and...
2018/0047594 METHOD FOR CONDITIONING SILICON PART
A method for conditioning and cleaning a silicon part is provided. The silicon part is heated to a temperature of at least 300.degree. C. in the presence of...
2018/0047593 METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
A method for drying wafer-shaped articles comprises rotating a wafer-shaped article of a predetermined diameter on a rotary chuck, and dispensing a drying...
2018/0047592 LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD
There is provided a guide member 3 in which an inclined surface 32 thereof is inclined downwardly outwards from an edge portion of a rear surface of a...
2018/0047591 SUPPORTING DEVICE AND SUPPORTING METHOD FOR ARTICLES
A supporting device includes a supporting member including a first positioning member positioning a bottom of a first article and inhibiting horizontal...
2018/0047590 LIMITING ELECTRONIC PACKAGE WARPAGE
An electronic package includes a carrier, semiconductor chip, a lid, and a lid-ring. The carrier includes a top surface and a bottom surface configured to be...
2018/0047589 LEAD CARRIER WITH PRINT FORMED PACKAGE COMPONENTS AND CONDUCTIVE PATH REDISTRIBUTION STRUCTURES
A lead carrier includes a temporary support layer, member, medium, or carrier upon which are dispersed a plurality of package sites, organized in a...
2018/0047588 LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS
A lead carrier includes a continuous sheet of mold compound having a top side and an opposing back side, and forms an array of package sites corresponding to...
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