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Patent # Description
2018/0061688 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a plurality of processing units and a gas supply unit. The plurality of processing units are stacked and arranged,...
2018/0061687 Transfer Device and Transfer Method Thereof
This disclosure provides a transfer device and a transfer method thereof. The transfer device comprises: a first machine base that carries a substrate; and at...
2018/0061686 APPARATUS FOR TRANSFERRING THIN-FILM ELEMENTS
There is an apparatus for transferring a thin-film element, the apparatus comprising: a belt-type stamp; at least one support roller configured to allow a...
2018/0061685 CURING APPARATUS AND METHOD USING THE SAME
A UV curing apparatus includes a processing chamber, a UV light source disposed above the processing chamber, a window disposed between the processing chamber...
2018/0061684 OPTICAL HEATING OF LIGHT ABSORBING OBJECTS IN SUBSTRATE SUPPORT
A substrate support assembly includes a ceramic plate and a cooling base coupled to the ceramic plate. A light absorbing object is disposed in the ceramic...
2018/0061683 DIRECT OPTICAL HEATING OF SUBSTRATES THROUGH OPTICAL GUIDE
A substrate support assembly includes a ceramic plate, a cooling plate coupled to the ceramic plate, and an optical guide coupled to the cooling plate. The...
2018/0061682 REDUCED WIRE COUNT HEATER ARRAY BLOCK
A thermal system includes multiple thermal elements, multiple power lines, and a control system. Each of the thermal elements define a resistor and a current...
2018/0061681 PLASMA PROCESSING APPARATUS
There is provided a plasma processing apparatus, including: a chamber main body; a plasma trap installed inside a chamber provided by the chamber main body,...
2018/0061680 PLASMA PROCESSING METHOD
Disclosed is a plasma processing device that provides an object to be treated with plasma treatment. A wafer as an object to be treated, which is attached on...
2018/0061679 MULTI CHAMBER PROCESSING SYSTEM WITH SHARED VACUUM SYSTEM
Methods and apparatus for a multi-chamber processing system having shared vacuum systems are disclosed herein. In some embodiments, a multi-chamber processing...
2018/0061678 SUBSTRATE PROCESSING APPARATUS AND NOZZLE CLEANING METHOD
The controller of a substrate processing apparatus carries out a liquid column forming step in which cleaning liquid is discharged through a lower surface...
2018/0061677 SUBSTRATE PROCESSING METHOD
A substrate processing method includes a liquid film forming step of supplying a low surface tension liquid onto the upper surface of the substrate while...
2018/0061676 PUMP APPARATUS AND SUBSTRATE TREATING APPARATUS
A drive mechanism deforms two diaphragms to perform alternate increase and decrease in volume of a supply chamber. At this time, the two diaphragms are...
2018/0061675 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the...
2018/0061674 METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an...
2018/0061673 SPACE-EFFICIENT UNDERFILLING TECHNIQUES FOR ELECTRONIC ASSEMBLIES
Space-efficient underfilling techniques for electronic assemblies are described. According to some such techniques, an underfilling method may comprise...
2018/0061672 CHIP PACKAGE PROCESS
A chip package process includes the following steps. A supporting structure and a carrier plate are provided. The supporting structure has a plurality of...
2018/0061671 Semiconductor Device with Plated Lead Frame
A semiconductor device includes an insulating carrier structure comprised of an insulating inorganic material. The carrier structure has a receptacle in which...
2018/0061670 ELECTRONIC COMPONENT
An electronic component capable of downsizing and narrowing of a mounting space. The electronic component includes: a laminated body made up of a plurality of...
2018/0061669 Semiconductor Device and Method
A method of manufacturing a semiconductor device includes placing a polymer raw material mixture over a substrate. The polymer raw material may include a...
2018/0061668 Integrated Circuit Package Pad and Methods of Forming
A semiconductor device and method for forming the semiconductor device is provided. The semiconductor device includes an integrated circuit having through vias...
2018/0061667 SEMICONDUCTOR PACKAGE WITH MULTIPLE MOLDING ROUTING LAYERS AND A METHOD OF MANUFACTURING THE SAME
Embodiments of the present invention are directed to a method of manufacturing a semiconductor package with an internal routing circuit. The internal routing...
2018/0061666 Method for Producing a Metal-Ceramic Substrate with at Least One Via
A method for producing a metal-ceramic substrate with at least one electrically conductive via, in which one metal layer, respectively, is attached in a planar...
2018/0061665 METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES INCLUDING TWO-DIMENSIONAL MATERIAL STRUCTURES
A method of forming a semiconductor device structure comprises forming at least one 2D material over a substrate. The at least one 2D material is treated with...
2018/0061664 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming a reference pattern in an inspection pattern formation region, forming a first mask layer...
2018/0061663 CONTINUOUS AND PULSED RF PLASMA FOR ETCHING METALS
Methods for etching tungsten and other metal or metal-containing films using a nitrogen-containing etchant gas are provided. The methods involve exposing the...
2018/0061662 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device including: a semiconductor substrate; a first coil formed on the semiconductor substrate via a first insulation film; a second...
2018/0061661 THIN FILM TRANSISTOR SUBSTRATE, DISPLAY PANEL, AND LASER ANNEALING METHOD
A thin film transistor substrate includes a plurality of thin film transistors arranged in columns and rows respectively on a substrate. Each of the thin film...
2018/0061660 Barrier Layer Formation Using Thermal Processing
A method of fabricating a semiconductor device includes forming a barrier layer over a surface of a semiconductor substrate. A treated barrier layer is formed...
2018/0061659 SILICON-BASED DEPOSITION FOR SEMICONDUCTOR PROCESSING
A method for processing a substrate in a processing chamber, comprising forming a deposition over the substrate is provided. A silicon containing gas is flowed...
2018/0061658 Self-Aligned Patterning Process Utilizing Self-Aligned Blocking and Spacer Self-Healing
A multiple patterning process is provided with a self-aligned blocking (SAB) technique. The SAB technique trades off difficult overlay requirements for more...
2018/0061657 Substrate Processing Method
There is provided a substrate processing method performed on a substrate having a recess formed in a surface thereof, a first silicon-containing film formed on...
2018/0061656 METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
A method for forming a semiconductor structure includes following steps. A substrate is provided, and a semiconductor layer is formed on the substrate. Next, a...
2018/0061655 METHOD OF PROCESSING TARGET OBJECT
A method of processing a target object is provided. The target object includes a first protrusion portion, a second protrusion portion, an etching target layer...
2018/0061654 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS
In accordance with an embodiment, a manufacturing method of a semiconductor device includes bringing a first catalyst into contact with a workpiece to form an...
2018/0061653 METHOD OF QUASI-ATOMIC LAYER ETCHING OF SILICON NITRIDE
A method of etching is described. The method includes providing a substrate having a first material containing silicon nitride and a second material that is...
2018/0061652 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A trench is formed at an exposed portion of a semiconductor substrate by performing a dry etching process with a hard mask of silicon oxide film serving as an...
2018/0061651 METHODS OF MEASURING ELECTRICAL CHARACTERISTICS DURING PLASMA ETCHING
Wafers processed by methods of plasma etching are disclosed. In one embodiment, a wafer is prepared by a process including positioning the wafer within a...
2018/0061650 HIGH DRY ETCH RATE MATERIALS FOR SEMICONDUCTOR PATTERNING APPLICATIONS
Methods and apparatuses for depositing low density spacers using atomic layer deposition for negative patterning schemes are provided herein. Methods involve...
2018/0061649 APPARATUS AND METHOD FOR TREATING SUBSTRATE
Disclosed are an apparatus and a method for treating a substrate. The method includes repeatedly rotating the substrate alternately at a first speed and at a...
2018/0061648 DEPOSITION OF SMOOTH METAL NITRIDE FILMS
In one aspect, methods of forming smooth ternary metal nitride films, such as Ti.sub.xW.sub.yN.sub.z films, are provided. In some embodiments, the films are...
2018/0061647 METHOD OF FABRICATING ELECTRICALLY ERASABLE PROGRAMMABLE NON-VOLATILE MEMORY CELL STRUCTURE
A NVM cell structure includes a semiconductor substrate having a first conductivity type, a first well region having a second conductivity type, a floating...
2018/0061646 ASYMMETRIC HIGH-K DIELECTRIC FOR REDUCING GATE INDUCED DRAIN LEAKAGE
An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes...
2018/0061645 ASYMMETRIC HIGH-K DIELECTRIC FOR REDUCING GATE INDUCED DRAIN LEAKAGE
An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes...
2018/0061644 METHODS FOR FORMING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
A semiconductor device and method is disclosed. In one example, the method for forming a semiconductor device includes forming a trench extending from a front...
2018/0061643 METHOD FOR PRODUCING THIN FILM TRANSISTOR AND THIN FILM TRANSISTOR
A method for producing a thin film transistor and a thin film transistor that can suppress deterioration and variation in performance are provided. A method...
2018/0061642 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming a first metal layer on a semiconductor substrate and forming a second metal layer on the...
2018/0061641 APPARATUS AND METHOD FOR TREATING SUBSTRATE
Disclosed is an apparatus for treating a substrate. The apparatus includes a process executing module and a controller. The process executing module includes a...
2018/0061640 IN-SITU SPACER RESHAPING FOR SELF-ALIGNED MULTI-PATTERNING METHODS AND SYSTEMS
Methods and systems for in-situ spacer reshaping for self-aligned multi-patterning are described. In an embodiment, a method of forming a spacer pattern on a...
2018/0061639 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
The yield of a manufacturing process of a semiconductor device is increased. The mass productivity of a semiconductor device is increased. A semiconductor...
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