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Patent # Description
2018/0076076 ELECTROSTATIC CLEANING DEVICE
An electrostatic cleaning device, mass transfer tool, and method of operation are disclosed. In an embodiment an electrostatic cleaning device includes a...
2018/0076075 SEMICONDUCTOR PROCESS EQUIPMENT
A substrate transport system is disclosed and includes a chamber having an interior wall, a planar motor disposed on the interior wall, and a substrate carrier...
2018/0076074 Container Storage Facility
A container storage facility includes a storage rack that has a plurality of storage sections as a storage section group, a gas supply device for supplying a...
2018/0076073 Container Storage Facility
A container storage facility includes a storage rack having a plurality of storage sections as storage section groups, a gas supply device configured to supply...
2018/0076072 AIR BLOW FOR SEMICONDUCTOR WAFERS IN A VACUUM SEMICONDUCTOR WAFER LAMINATOR SYSTEM
A vacuum semiconductor wafer laminator system. The system comprises a fan, a first outer air duct coupled to the fan and configured to direct air blown by the...
2018/0076071 WAFER BOAT AND TREATMENT APPARATUS FOR WAFERS
A wafer boat is described for the plasma treatment of disc-shaped wafers, in particular semiconductor wafers for semiconductor or photovoltaic applications,...
2018/0076070 PLASMA-TREATMENT DEVICE FOR WAFERS
In order to provide an improved introduction of high-frequency waves into a wafer boat, a plasma treatment apparatus for wafers, in particular for ...
2018/0076069 System and Method for Simultaneously Filling Containers with Different Fluent Compositions
A system and method for simultaneously filling containers with different fluent products are disclosed. The system includes a plurality of vehicles that are...
2018/0076068 Fluidic Assembly Using Tunable Suspension Flow
Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for increasing the efficiency of fluidic...
2018/0076067 HOLDING APPARATUS
A ceramic heater includes a plate-shaped base with an upper surface and a lower surface, a tubular shaft with an upper end surface connected to the lower...
2018/0076066 SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS
A technique enabling a stable resist pattern forming process, when substrate processing apparatuses that perform a resist coating process separately from a...
2018/0076065 INTEGRATED SYSTEM FOR SEMICONDUCTOR PROCESS
Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly,...
2018/0076064 CLUSTER TOOL APPARATUS AND A METHOD OF CONTROLLING A CLUSTER TOOL APPARATUS
A system and method of controlling a cluster tool apparatus, wherein the cluster tool includes one or more processing modules and a robot that is configured to...
2018/0076063 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes: a first process chamber where a substrate is subjected to a first process; a second process chamber where the...
2018/0076062 LIGHT-IRRADIATION THERMAL TREATMENT APPARATUS
A ring support is attached to an inner wall surface of a chamber that houses a semiconductor wafer to support a susceptor. When the semiconductor wafer is...
2018/0076061 HEAT TREATMENT METHOD AND HEAT TREATMENT DEVICE
First, a substrate with one main surface on which a thin film of at least one of a mono-molecular layer and a multi-molecular layer including dopants is formed...
2018/0076060 WAFER PERFORATING DEVICE
A wafer perforating device includes a chuck stage configured to receive a wafer, a housing spaced apart in a vertical direction on the chuck stage, wherein at...
2018/0076059 Article Transport Device
An article transport device includes an article support member for supporting an article having a plate-shaped flange portion in an upper portion thereof, with...
2018/0076058 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a substrate stage that supports a substrate, a follower stage disposed on a same plane as the substrate stage, a...
2018/0076057 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus 1 is configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing...
2018/0076056 ETCHING DEVICE, SUBSTRATE PROCESSING APPARATUS, ETCHING METHOD AND SUBSTRATE PROCESSING METHOD
During a first period, pure water used as a low-volatile liquid is supplied onto a substrate while the substrate is rotated. After discharge of the...
2018/0076055 Container Storage Facility
A container storage facility has storage portions for storing containers, and supplies a purge gas to the interior of the containers. The container storage...
2018/0076054 Anti-Plasma Adhesive Tape and Manufacturing Method
An anti-plasma adhesive tape utilized for manufacturing a semiconductor package includes a substrate; and an adhesive layer formed on the substrate, wherein...
2018/0076053 SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
A semiconductor module in which no crack of a metal film exists in a terminal is provided. A semiconductor module is provided, including: a semiconductor...
2018/0076052 LOW SURFACE ROUGHNESS SUBSTRATE HAVING A VIA AND METHODS OF MAKING THE SAME
Methods of forming a via in substrates include etching a damage region extending through a thickness of a stack of a plurality of substrates removably bonded...
2018/0076051 ETCHING METHOD AND ETCHING APPARATUS
A method for etching a titanium nitride film includes a first process of supplying reactive species, which include hydrogen and fluorine, to a base material...
2018/0076050 SUBSTRATE, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SUBSTRATE
A substrate includes a support layer, a column-shaped first bump, and a second bump. The support layer has a main surface. The first bump is filled with a...
2018/0076049 MASK ETCH FOR PATTERNING
A hard mask layer is deposited on a feature layer over a substrate. The hard mask layer comprises an organic mask layer. An opening in the organic mask layer...
2018/0076048 METHOD OF ETCHING SILICON OXIDE AND SILICON NITRIDE SELECTIVELY AGAINST EACH OTHER
Silicon oxide and silicon nitride can be etched selectively against each other with high efficiency. A method includes preparing a processing target object...
2018/0076047 METHOD FOR MANUFACTURING FILLING PLANARIZATION FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine...
2018/0076046 CHEMISTRIES FOR TSV/MEMS/POWER DEVICE ETCHING
Replacement chemistries for the cC.sub.4F.sub.8 passivation gas in the Bosch etch process and processes for using the same are disclosed. These chemistries...
2018/0076045 Methods and Systems for Advanced Ion Control for Etching Processes
A substrate is disposed on a substrate holder within a process module. The substrate includes a mask material overlying a target material with at least one...
2018/0076044 POLY DIRECTIONAL ETCH BY OXIDATION
Processing methods may be performed to form recesses in a semiconductor substrate. The methods may include oxidizing an exposed silicon surface on a...
2018/0076043 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding...
2018/0076042 BORANE MEDIATED DEHYDROGENATION PROCESS FROM SILANE AND ALKYLSILANE SPECIES FOR SPACER AND HARDMASK APPLICATION
Implementations described herein generally relate to the fabrication of integrated circuits and particularly to the deposition of a boron-doped amorphous...
2018/0076041 CONTACT INTEGRATION AND SELECTIVE SILICIDE FORMATION METHODS
Methods for selective silicide formation are described herein. The methods are generally utilized in conjunction with contact structure integration schemes and...
2018/0076040 FORMATION OF PURE SILICON OXIDE INTERFACIAL LAYER ON SILICON-GERMANIUM CHANNEL FIELD EFFECT TRANSISTOR DEVICE
Methods are provided to form pure silicon oxide layers on silicon-germanium (SiGe) layers, as well as an FET device having a pure silicon oxide interfacial...
2018/0076039 ASYMMETRIC HIGH-K DIELECTRIC FOR REDUCING GATE INDUCED DRAIN LEAKAGE
An asymmetric high-k dielectric for reduced gate induced drain leakage in high-k MOSFETs and methods of manufacture are disclosed. The method includes...
2018/0076038 Method For Producing Two N-Type Buried Layers In An Integrated Circuit
A method of fabricating an integrated circuit includes forming a patterned dielectric layer, which includes a first pattern of openings, over a substrate and...
2018/0076037 METHOD FOR BONDING OF SUBSTRATES
A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first...
2018/0076036 Self Aligned Silicon Carbide Contact Formation Using Protective Layer
A silicon-carbide substrate that includes: a doped silicon-carbide contact region directly adjoining a main surface of the substrate, and a dielectric layer...
2018/0076034 MULTI-ANGLED DEPOSITION AND MASKING FOR CUSTOM SPACER TRIM AND SELECTED SPACER REMOVAL
Multi-angled deposition and masking techniques are provided to enable custom trimming and selective removal of spacers that are used for patterning features at...
2018/0076033 MULTI-ANGLED DEPOSITION AND MASKING FOR CUSTOM SPACER TRIM AND SELECTED SPACER REMOVAL
Multi-angled deposition and masking techniques are provided to enable custom trimming and selective removal of spacers that are used for patterning features at...
2018/0076032 THICK TUNGSTEN HARDMASK FILMS DEPOSITION ON HIGH COMPRESSIVE/TENSILE BOW WAFERS
Implementations of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein...
2018/0076031 INTEGRATED METHOD FOR WAFER OUTGASSING REDUCTION
Implementations disclosed herein relate to methods for controlling substrate outgassing. In one implementation, the method includes removing oxides from an...
2018/0076030 SiC FILM FORMING METHOD AND SiC FILM FORMING APPARATUS
There is provided a SiC film forming method for forming a SiC film on a workpiece, including: a first step of forming a carbon film on the workpiece; and a...
2018/0076029 METHOD AND STRUCTURE FOR FORMING A DENSE ARRAY OF SINGLE CRYSTALLINE SEMICONDUCTOR NANOCRYSTALS
A dense array of semiconductor single crystalline semiconductor nanocrystals is provided in the present application by forming an amorphous semiconductor...
2018/0076028 Systems and Methods for UV-Based Suppression of Plasma Instability
A substrate is positioned in exposure to a plasma generation region within a plasma processing chamber. A first plasma is generated within the plasma...
2018/0076027 SELECTIVE METAL OXIDE DEPOSITION USING A SELF-ASSEMBLED MONOLAYER SURFACE PRETREATMENT
Embodiments of the invention provide methods for selective film deposition using a surface pretreatment. According to one embodiment, the method includes...
2018/0076026 STEAM OXIDATION INITIATION FOR HIGH ASPECT RATIO CONFORMAL RADICAL OXIDATION
A substrate oxidation assembly includes: a chamber body defining a processing volume; a substrate support disposed in the processing volume; a plasma source...
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