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Patent # Description
2018/0090357 ROBOT SYSTEM AND INCLINE DETECTION METHOD
A robot system includes: a robotic hand configured to load and unload a workpiece into and from a cassette in which a plurality of workpieces are aligned in a...
2018/0090356 SUBSTRATE TRANSPORTER AND SUBSTRATE TRANSPORT METHOD
In a substrate transporter, a carry-in-and-out mechanism transports a substrate placed in a horizontal posture. A notch aligner rotates a substrate in a...
2018/0090355 VACUUM-ASSISTED VESSEL ENVIRONMENTAL CONTAMINANT PURGING
Methods are disclosed for purging contaminants from a vessel such as a FOUP with vacuum-assistance. After the vessel is purged of environmental contaminants...
2018/0090354 POSITION DETECTION SYSTEM AND PROCESSING APPARATUS
There is provided a position detection system for use in a processing apparatus including a mounting table configured to mount thereon a disc-shaped target...
2018/0090353 METHOD OF ACHIEVING IMPROVED TRANSIENT RESPONSE IN APPARATUS FOR CONTROLLING FLOW AND SYSTEM FOR ACCOMPLISHING SAME
Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, a method of...
2018/0090352 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus including a plurality of baking chambers stacked in a prescribed direction, each baking chamber carrying out heat treatment of...
2018/0090351 ADHESIVE TAPE SEPARATING TOOL, MANUFACTURING APPARATUS OF SEMICONDUCTOR CHIP, MANUFACTURING APPARATUS OF MEMS...
Provided is an adhesive tape separating tool which separates adhesive tape bonded to one face of a work which includes an opening on the one face from the...
2018/0090350 APPARATUS FOR MANUFACTURING A SILICON CARBIDE WAFER
Various embodiments provide a reaction chamber including a support, a receptacle, and a sponge. The support includes a plurality of bars that are spaced from...
2018/0090348 Wafer Processing Method and Apparatus
An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface...
2018/0090347 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS X
A substrate cleaning apparatus for bringing an elongated roll cleaning member into sliding contact with a flat plate type substrate to perform cleaning...
2018/0090346 SUBSTRATE TREATING DEVICE AND SUBSTRATE TREATING METHOD
A substrate treating device immerses substrates in a mixed-acid aqueous solution, and performs an etching treatment on the substrates. The substrate treating...
2018/0090345 OPERATION METHOD OF PLASMA PROCESSING APPARATUS
A vacuum processing apparatus includes a processing chamber inside a vacuum vessel, a plasma forming chamber above, a dielectric plate member having multiple...
2018/0090344 RING ASSEMBLY AND CHUCK ASSEMBLY HAVING THE SAME
A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a...
2018/0090343 SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING DEVICE
A substrate treating method dries a substrate on a surface of which a predetermined pattern is formed. The substrate treating method includes: a washing step...
2018/0090342 SUBSTRATE PROCESSING METHOD
A substrate processing method includes a substrate holding step of holding a substrate by means of a substrate holder which holds the substrate horizontally...
2018/0090341 SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING DEVICE
A substrate treating method is for etching and washing a predetermined substrate. Specifically, the substrate treating method includes: an etching step of...
2018/0090340 SUBSTRATE TREATING DEVICE AND SUBSTRATE TREATING METHOD
The substrate treating device performs a predetermined treatment on a substrate by immersing the substrate into a treating liquid that contains a predetermined...
2018/0090339 PACKAGE CARRIER
A package carrier includes a substrate, at least one heat conducting element, an insulating material, a first patterned circuit layer and a second patterned...
2018/0090338 POWER MODULE AND FABRICATION METHOD FOR THE SAME
The power module includes: a first metallic circuit pattern, a semiconductor device disposed on the first metallic circuit pattern; a leadframe electrically...
2018/0090337 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
An object of the present invention is to provide a semiconductor device including a film to be processed having a uniform height. A first coating film made of...
2018/0090336 Catalyst-Assisted Chemical Etching With A Vapor-Phase Etchant
A method of catalyst-assisted chemical etching with a vapor-phase etchant has been developed. In one approach, a semiconductor substrate including a patterned...
2018/0090335 MARGIN FOR FIN CUT USING SELF-ALIGNED TRIPLE PATTERNING
A method for fabricating a semiconductor structure. The method includes forming a plurality of mandrel structures. A plurality of first spacers is formed on...
2018/0090334 Methods and Systems for Advanced Ion Control for Etching Processes
A substrate is disposed on a substrate holder within a process module. The substrate includes a mask material overlying a target material with at least one...
2018/0090333 MANUFACTURING PROCESS OF ELEMENTAL CHIP
A manufacturing process of an elemental chip comprises steps of preparing a substrate held on the holding tape, the substrate including first and second sides...
2018/0090332 SUBSTRATE PROCESSING DEVICE WHICH PERFORMS PROCESSING ON SUBSTRATE
A substrate processing device includes: a substrate holding member which horizontally holds a substrate; a first supply unit which has a first opening opposed...
2018/0090331 METHOD OF MANUFACTURING WAFER LEVEL CHIP SCALE PACKAGE
A method of manufacturing a semiconductor device includes receiving a die including a top surface, a die pad exposed from the top surface, and sacrificial...
2018/0090330 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A method of manufacturing a source structure for a p-type metal-oxide-semiconductor (PMOS) field effect transistor (FET) is provided. In the method, a first...
2018/0090329 METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING A BLOCKING INSULATION LAYER
A method of manufacturing a semiconductor device includes forming insulation layers and sacrificial layers that are alternately and repeatedly stacked on top...
2018/0090328 MULTIPLE NANOSECOND LASER PULSE ANNEAL PROCESSES AND RESULTANT SEMICONDUCTOR STRUCTURE
Semiconductor structures and methods of fabricating the same using multiple nanosecond pulsed laser anneals are provided. The method includes exposing a gate...
2018/0090327 SEMICONDUCTOR STRUCTURE INCLUDING LOW-K SPACER MATERIAL
A semiconductor structure includes a substrate, and a replacement metal gate (RMG) structure is attached to the substrate. The RMG structure includes a lower...
2018/0090326 CONTROLLING THRESHOLD VOLTAGE IN NANOSHEET TRANSISTORS
Embodiments are directed to a method of forming a semiconductor device and resulting structures for controlling a threshold voltage on a nanosheet-based...
2018/0090325 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming an insulating pattern layer on a substrate, conformally forming a first conductive layer with...
2018/0090324 SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CARBON NANOTUBE GATE
A method of forming a semiconductor device includes forming a channel layer on a substrate. A gate dielectric is deposited on the channel layer, and a mask is...
2018/0090323 SUBSTRATE PROCESSING APPARATUS
Provided is a substrate processing apparatus. The substrate processing apparatus includes a tube having an inner space, a substrate support on which a...
2018/0090322 SUBSTRATE PROCESSING APPARATUS
Provided is a substrate processing apparatus. The substrate processing apparatus includes a first tube defining an inner space, a substrate holder in which a...
2018/0090321 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
A silicon carbide semiconductor device includes a silicon carbide semiconductor substrate of a first conductivity type, a gate insulating film provided on a...
2018/0090320 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
A silicon carbide semiconductor device, including a silicon carbide semiconductor substrate, and an insulating film formed on a front surface of the silicon...
2018/0090319 HARD MASK AND MANUFACTURING METHOD THEREOF
There is provided a hard mask used in forming a recess having a depth of 500 nm or more by dry etching. The hard mask includes a boron-based film formed as an...
2018/0090318 FORMING A FIN CUT IN A HARDMASK
A method of fabricating a hard mask structure is provided. According to the method, a hard mask layer is disposed over a substrate. The hard mask layer...
2018/0090317 ELECTRONIC DEVICE HAVING TWO-DIMENSIONAL (2D) MATERIAL LAYER AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE...
An electronic device includes first and second electrodes that are spaced apart from each other and a 2D material layer. The 2D material layer connects the...
2018/0090316 GAAS THIN FILM GROWN ON SI SUBSTRATE, AND PREPARATION METHOD FOR GAAS THIN FILM GROWN ON SI SUBSTRATE
Disclosed is a preparation method for a GaAs thin film grown on an Si substrate, said method comprising the following steps: (1) Si (111) substrate cleaning;...
2018/0090315 POLYSILICON RESIDUE REMOVAL IN NANOSHEET MOSFETS
A method is presented for forming a semiconductor device. The method includes depositing a sacrificial layer on a fin structure formed on a substrate and then...
2018/0090314 Methods and Apparatus for Printing High-Viscosity Materials
A method for disposing material includes positioning a donor film including a donor material at a predefined distance from an acceptor substrate, the donor...
2018/0090313 METHOD FOR FORMING DIELECTRIC FILM AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A method of forming a dielectric film includes providing a substrate in a chamber, and forming a silicon nitride film on the substrate using an atomic layer...
2018/0090312 SHELLING OF HALIDE PEROVSKITE NANOPARTICLES FOR THE PREVENTION OF ANION EXCHANGE
A core/shell semiconductor nanoparticle structure comprises a core comprising a halide perovskite semiconductor and a shell comprising a semiconductor material...
2018/0090311 BORON FILM, BORON FILM FORMING METHOD, HARD MASK, AND HARD MASK MANUFACTURING METHOD
There is provided a boron film forming method which includes forming a boron film on a target substrate by CVD by supplying a boron-containing gas as a...
2018/0090310 Method of Manufacturing Semiconductor Device
Disclosed is a method of manufacturing a semiconductor device. The method includes: (a) accommodating a substrate having a plurality of carbon-containing films...
2018/0090309 VERTICAL 2D STRUCTURES FOR ADVANCED ELECTRONIC AND OPTOELECTRONIC SYSTEMS
The present invention relates to methods for fabricating vertical homogenous and heterogeneous two-dimensional structures, the fabricated vertical...
2018/0090308 SUBSTRATE TREATMENT METHOD OF TREATING SUBSTRATE, AND SUBSTRATE TREATMENT APPARATUS
There are provided a first supplying step including at least one first treatment process of supplying treatment liquid toward an upper surface of a rotated...
2018/0090307 WAFER STRESS CONTROL AND TOPOGRAPHY COMPENSATION
A method of forming a semiconductor wafer includes generating a stress topography model of a semiconductor wafer with a plurality of desired structures in a...
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