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Patent # Description
2018/0108604 CHIP ON FILM AND DISPLAY DEVICE
Disclosed are a chip on film and a display device. the chip on film includes a plurality of output pads independent from each other extending in the first...
2018/0108603 SEMICONDUCTOR DEVICE AND WIRING BOARD DESIGN METHOD
The present disclosure provides a semiconductor device including: a semiconductor chip; a substrate including a first region where the semiconductor chip is...
2018/0108602 FAN-OUT BALL GRID ARRAY PACKAGE STRUCTURE AND PROCESS FOR MANUFACTURING THE SAME
A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface...
2018/0108601 MOLDED INTELLIGENT POWER MODULE AND METHOD OF MAKING THE SAME
An intelligent power module (IPM) has a first, second, third and fourth die paddles, a first, second, third, fourth, fifth and sixth metal-oxide-semiconductor...
2018/0108600 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device of the present invention includes: a plurality of wiring boards disposed separately from one another; a plurality of semiconductor...
2018/0108599 DIE PAD, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
The specification discloses a technique for preventing a bonding material from reaching the upper and lower surfaces of a semiconductor chip in bonding the...
2018/0108598 MOLDED INTELLIGENT POWER MODULE
An intelligent power module (IPM) has a first, second, third and fourth die paddles, a first, second, third, fourth, fifth and sixth metal-oxide-semiconductor...
2018/0108597 WIRE BONDING STRUCTURE AND ELECTRONIC DEVICE
A wire bonding structure includes a bonding target and a wire with its bond portion bonded to the bonding target. The bond portion has a bottom surface in...
2018/0108596 AIR GAP AND AIR SPACER PINCH OFF
Embodiments are directed to a method of forming a semiconductor device and resulting structures having an air spacer between a gate and a contact by forming a...
2018/0108595 DUAL MODULE FOR DUAL CHIP CARD
A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting...
2018/0108594 CARBON NANOTUBE STRUCTURE, HEAT DISSIPATION SHEET, AND METHOD OF MANUFACTURING CARBON NANOTUBE STRUCTURE
A carbon nanotube structure includes a plurality of carbon nanotubes, and a graphite film that binds one ends of the plurality of carbon nanotubes. And a heat...
2018/0108593 BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK, METHOD FOR PRODUCING BONDED BODY, METHOD FOR...
A bonded body is provided that is formed by bonding a metal member formed from copper, nickel, or silver, and an aluminum alloy member formed from an aluminum...
2018/0108591 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor module and a cooler. The semiconductor device includes semiconductor element(s) within a molded resin and a...
2018/0108590 Conductive Line System and Process
A system and method for providing a conductive line is provided. In an embodiment the conductive line is formed by forming two passivation layers, wherein each...
2018/0108589 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a semiconductor substrate, a semiconductor element formed in or on the semiconductor substrate, a metal layer connected to the...
2018/0108588 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a semiconductor substrate, a semiconductor element formed in or on the semiconductor substrate, a metal layer connected to the...
2018/0108587 METHOD FOR PASSIVATING A SURFACE OF A SEMICONDUCTOR AND RELATED SYSTEMS
A system and a method for passivating a surface of a semiconductor. The method includes providing the surface of the semiconductor to a reaction chamber of a...
2018/0108586 LEAD BONDING STRUCTURE
A lead bonding structure includes: a plurality of leads extending outward from a package; and a plurality of electrode pads formed on a circuit board. The...
2018/0108585 CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
A chip package and packaging method are provided. The package includes: a substrate; a sensing chip coupled with the substrate, where the sensing chip has a...
2018/0108584 Semiconductor Substrate
A semiconductor substrate includes a device carrier, a plurality of stiffener structures and a plurality of spaced areas. The device carrier includes a...
2018/0108583 DEVICE CHIP, ACCOMMODATING TRAY, AND METHOD OF ACCOMMODATING DEVICE CHIPS
A device chip is shaped as an inverted frustum with a device formed on an upper surface thereof. An accommodating tray for accommodating a plurality of device...
2018/0108582 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a substrate with a recess subsiding from a selected surface of the substrate to accommodate a semiconductor element. Connected...
2018/0108581 LID, AND OPTICAL DEVICE PACKAGE
A lid constitutes, together with a housing, a package that encloses an optical element. The lid includes a frame plate divided into a first member and a second...
2018/0108580 METHOD FOR MANUFACTURING A SEMICONDUCTOR PRODUCT WAFER
Improved methods for manufacturing semiconductor product wafer with the additional use of non-product masks are described. According to certain aspects of the...
2018/0108579 SOLAR CELL EMITTER CHARACTERIZATION USING NON-CONTACT DOPANT CONCENTRATION AND MINORITY CARRIER LIFETIME...
A method and apparatus for estimating an effect of variations of wafer properties on operating parameters of photovoltaic cells during manufacturing is...
2018/0108578 Metrology Systems And Methods For Process Control
Methods and systems for estimating values of parameters of interest based on repeated measurements of a wafer during a process interval are presented herein....
2018/0108577 IC UNIT AND METHOND OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME
There are provided an Integrated Circuit (IC) unit, a method of manufacturing the same, and an electronic device including the IC unit. According to an...
2018/0108576 SEMICONDUCTOR ARRANGEMENT AND METHOD OF FORMING
A semiconductor arrangement is provided comprising a guard region. The semiconductor arrangement comprises an active region disposed on a first side of the...
2018/0108575 FINFET DEVICE AND FABRICATION METHOD THEREOF
A method for fabricating a Fin-FET device includes forming fin structures on a substrate and an isolation structure to cover a portion of sidewall surfaces of...
2018/0108574 FINFET DEVICE AND FABRICATION METHOD THEREOF
A FinFET device and fabrication method thereof is provided. The fabrication method include: providing a semiconductor substrate with a fin protruding from the...
2018/0108573 FIN-FET DEVICES AND FABRICATION METHODS THEREOF
A method for fabricating a Fin-FET device includes providing a base structure and a plurality of fin structures protruding from the base structure. Along a...
2018/0108572 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
The present disclosure relates to the technical field of semiconductor processes, and discloses a semiconductor device and a manufacturing method therefor. The...
2018/0108571 METHOD, APPARATUS, AND SYSTEM FOR USING A COVER MASK FOR ENABLING METAL LINE JUMPING OVER MOL FEATURES IN A...
At least one method, apparatus and system disclosed involves providing an integrated circuit having metal feature flyover over an middle-of-line (MOL) feature....
2018/0108570 METHOD FOR MANUFACTURING FINS
A method for manufacturing fins includes following steps. A substrate including a plurality of fins formed thereon is provided. At least an ion implantation is...
2018/0108569 SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
A semiconductor apparatus and its manufacturing method are presented. The method entails providing a substrate structure comprising a substrate, one or more...
2018/0108568 LASER LIFT-OFF METHOD OF WAFER
The present invention relates to a laser lift-off method of wafer. The method includes the steps as follows: focusing laser in an inside for a wafer (10) to...
2018/0108567 SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE
A method for forming a semiconductor device comprises forming an insulation trench structure comprising insulation material extending into the semiconductor...
2018/0108566 INTEGRATED CIRCUIT STRUCTURE HAVING DEEP TRENCH CAPACITOR AND THROUGH-SILICON VIA AND METHOD OF FORMING SAME
One aspect of the disclosure relates to a method of forming an integrated circuit structure. The method may include providing a substrate having a front side...
2018/0108565 METHOD OF LASER-PROCESSING DEVICE WAFER
There is provided a method of laser-processing a device wafer with a laser beam applied thereto. The device wafer has a face side having thereon a plurality of...
2018/0108564 DESIGN AND INTEGRATION OF FINFET DEVICE
An integrated circuit containing finFETs may be formed with fins extending above isolation oxide. A first finFET and a second finFET have exposed fin heights...
2018/0108563 METHOD OF FABRICATING ISOLATION STRUCTURE
A method of fabricating an isolation structure is provided. A first oxide layer and a first, second, and third hard mask layers are formed on a substrate. A...
2018/0108562 PROTECTIVE COVER FOR ELECTROSTATIC CHUCK
In embodiments, manufacturing a protective cover for an electrostatic chuck comprises coating a top surface and side walls of a conductive wafer with a plasma...
2018/0108561 Robot Having Arm with Unequal Link Lengths
An apparatus including at least one drive; a first robot arm having a first upper arm, a first forearm and a first end effector. The first upper arm is...
2018/0108560 SUBSTRATE HOLDER
Substrate holders having support plates for mounting of substrates are disclosed. The substrate holders use a combination of spring clamping elements and pins...
2018/0108559 Methods and Systems for Chucking a Warped Wafer
Methods and systems for vacuum mounting a warped, thin substrate onto a flat chuck are presented herein. A vacuum chuck includes three or more collapsible...
2018/0108558 WAFER DE-BONDING DEVICE
A wafer de-bonding device comprises a stage (1) for holding a device wafer and a carrier wafer bonded together, and a tool (2) with a gas outlet (2.2) disposed...
2018/0108557 DEVICE COMPRISING FILM FOR ELECTROSTATIC COUPLING OF A SUBSTRATE TO A SUBSTRATE CARRIER
The invention relates to an apparatus for electrostatic coupling of a substrate with a substrate carrier, wherein the apparatus includes a flexible plastic...
2018/0108556 MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR PRODUCING THE SAME
A method for producing a member for a semiconductor manufacturing apparatus 10 includes (a) a step of providing an electrostatic chuck 20, a supporting...
2018/0108555 ELECTROSTATIC CHUCK DEVICE
An electrostatic chuck device includes: a placing plate having a placement surface on which a plate-like sample is placed on one side thereof; an electrostatic...
2018/0108554 METHOD FOR SELF-ALIGNING A THIN-FILM DEVICE ON A HOST SUBSTRATE
A method for self-aligning a thin-film device on a host substrate is provided. A predetermined location on a host substrate is treated with a hydrophobic...
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