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Patent # Description
2018/0108553 Substrate Transport Vacuum Platform
A transport apparatus including a robot drive; an arm having a first end connected to the robot drive; and at least one end effector connected to a second end...
2018/0108552 Substrate Transport Vacuum Platform
A transport apparatus including a robot drive; an arm having a first end connected to the robot drive; and at least one end effector connected to a second end...
2018/0108551 Substrate Transport Vacuum Platform
An apparatus including a first device configured to support at least one substrate thereon; and a first transport having the device connected thereto. The...
2018/0108550 Semiconductor Wafer Transportation
A method includes causing a carrier of an overhead hoist transfer system (OHT) to latch onto a top latch of a first semiconductor wafer transportation pod, the...
2018/0108549 SUBSTRATE PROCESSING APPARATUS
The disclosure provides a substrate processing apparatus. The substrate processing apparatus includes: an etching region and one or more aerosol absorption...
2018/0108548 Systems and Methods for Workpiece Processing
Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for...
2018/0108547 Semiconductor Bonding Apparatus and Related Techniques
A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of...
2018/0108546 METHOD AND APPARATUS FOR CLEANING COMPONENT OF SUBSTRATE PROCESSING APPARATUS
Disclosed are an apparatus and a method for cleaning a component of a substrate dry processing apparatus. The method for cleaning a component of a substrate...
2018/0108545 WET ETCHING DEVICE AND EXPLOSION PREVENTION METHOD THEREOF
The present invention provides a wet etching device and an explosion prevention method thereof. The heater (22) is utilized to monitor the temperature in the...
2018/0108544 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes a substrate holding unit configured to hold a substrate; a first processing liquid nozzle configured to supply a...
2018/0108543 NOZZLE AND ETCHING APPARATUS
A nozzle for use in an etching apparatus and an etching apparatus including the nozzle are provided. The nozzle includes: a hollowed main body having a...
2018/0108542 Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
A semiconductor device has an interposer mounted over a carrier. The interposer includes TSV formed either prior to or after mounting to the carrier. An...
2018/0108541 INFORMATION MANAGEMENT DEVICE AND INFORMATION MANAGEMENT METHOD
A management device that, when a component is mounted on a substrate, acquires pickup source information that includes pickup position information of the...
2018/0108540 METHOD OF FORMING AN INTERPOSER AND A METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING THE SAME
A method of manufacturing a semiconductor package including forming a photoresist pattern on a first surface of an interposer substrate. The interposer...
2018/0108539 METHOD FOR MANUFACTURING WIRING PATTERN, METHOD FOR MANUFACTURING TRANSISTOR, AND MEMBER FOR TRANSFER
An object is to provide a novel method in place of the above-described conventional technology, as a technique for obtaining a thin film with a wiring pattern...
2018/0108538 SILICON EPITAXIAL WAFER AND METHOD OF PRODUCING SAME
A silicon single crystal is pulled up such that nitrogen concentration of the crystal is 1.times.10.sup.11 to 2.times.10.sup.13 atoms/cm.sup.3, the crystal...
2018/0108537 GAS COMPOSITION FOR DRY ETCHING AND DRY ETCHING METHOD
A silicon oxide film or a silicon nitride film is selectively etched by using an etching gas composition including a hydrofluorocarbon that has an unsaturated...
2018/0108536 SLURRY, POLISHING LIQUID SET, POLISHING LIQUID, METHOD FOR POLISHING SUBSTRATE, AND SUBSTRATE
The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal...
2018/0108535 CONTROLLING OF ETCH DEPTH IN DEEP VIA ETCHING PROCESSES AND RESULTANT STRUCTURES
The present disclosure relates to semiconductor structures and, more particularly, to a method to control depth of etch in deep via etching and related...
2018/0108534 METHOD OF FORMING TITANIUM OXIDE FILM AND METHOD OF FORMING HARD MASK
A method for forming a titanium oxide film on a substrate to be processed, which has a silicon portion on a surface thereof, the method including: forming a...
2018/0108533 METHOD AND APPARATUS FOR USING UNIVERSAL CAVITY WAFER IN WAFER LEVEL PACKAGING
An electronics module assembly is described herein that packages dies using a universal cavity wafer that is independent of electronics module design. In one...
2018/0108532 SILICON OXIDE SILICON NITRIDE STACK ION-ASSISTED ETCH
A method for ion-assisted etching a stack of alternating silicon oxide and silicon nitride layers in an etch chamber is provided. An etch gas comprising a...
2018/0108531 HIGH ASPECT RATIO ETCH
A method for etching a layer in a processing chamber is provided. A plurality of cycles is provided, where each cycle comprises a deposition phase, a clearing...
2018/0108530 METHOD FOR MANUFACTURING NIOBATE-SYSTEM FERROELECTRIC THIN-FILM DEVICE
This method for manufacturing a niobate-system ferroelectric thin-film device includes: a lower electrode film formation step of forming a lower electrode film...
2018/0108529 INTEGRATED DIRECT DIELECTRIC AND METAL DEPOSITION
Efficient integrated sequential deposition of alternating layers of dielectric and conductor, for example oxide/metal or metal nitride, e.g., SiO.sub.2/TiN, in...
2018/0108528 GATE OXIDE STRUCTURE AND METHOD FOR FABRICATING THE SAME
A method for forming a gate oxide layer on a substrate is provided, in which a region of the substrate is defined out by a shallow trench isolation (STI)...
2018/0108527 Self-Aligned Double Spacer Patterning Process
A method includes forming a mask layer over a target layer. A merge cut feature is formed in the mask layer. A first mandrel layer is formed over the mask...
2018/0108526 METHOD OF FORMING NANOWIRES
The disclosed technology generally relates semiconductor devices and more particularly to semiconductor devices comprising nanowires. In one aspect, a method...
2018/0108525 Method for Forming a Thin Film Comprising an Ultrawide Bandgap Oxide Semiconductor
A method is disclosed for depositing a high-quality thin films of ultrawide bandgap oxide semiconductors at growth rates that are higher than possible using...
2018/0108524 BONDED SEMICONDUCTOR STRUCTURES
A method is disclosed that includes operations as follows. With an ion-implanted layer which is disposed between an epitaxial layer and a first semiconductor...
2018/0108523 Mass Spectrometry Device and Analysis Method for Gas Phase Molecule-ion Reaction
A mass spectrometry device and analysis method for a gas phase molecule-ion reaction. The device comprises a reaction gas introduction device and a gas phase...
2018/0108522 IMR-MS DEVICE
Ion-molecule-reaction-mass spectrometry (IMR-MS) device, comprising an ion source, an adjacent reaction chamber and a mass spectrometer subsequent to the...
2018/0108521 Method of Increasing Quality of Tandem Mass Spectra
A method and apparatus for improving the quality of spectra of a sample obtained from a tandem mass spectrometer system containing an ion trap. The method and...
2018/0108520 RATE ENHANCED PULSED DC SPUTTERING SYSTEM
A sputtering system and method are disclosed. The system includes a first power source that is configured to apply a first voltage at a first electrode that...
2018/0108519 POWER DELIVERY FOR HIGH POWER IMPULSE MAGNETRON SPUTTERING (HiPIMS)
A system for the generation and delivery of a pulsed, high voltage signal for a process chamber includes a remotely disposed high voltage supply to generate a...
2018/0108518 FILM FORMING APPARATUS, CLEANING METHOD FOR FILM FORMING APPARATUS AND RECORDING MEDIUM
A film forming apparatus 1 includes a plasma generating mechanism 47 commonly used for plasmarizing a processing gas and a cleaning gas supplied into a...
2018/0108517 COATING ARCHITECTURE FOR PLASMA SPRAYED CHAMBER COMPONENTS
A method of plasma spraying an article comprises inserting the article into a vacuum chamber for a low pressure plasma spraying system. A low pressure plasma...
2018/0108516 ION BEAM IRRADIATION APPARATUS AND SUBSTRATE PROCESSING APPARATUS
Disclosed is an ion beam irradiation apparatus including: a plurality of plate-like grid electrodes arranged in a beam irradiation direction so as to overlap...
2018/0108514 Multi-Column Electron Beam Lithography Including Field Emitters on a Silicon Substrate with Boron Layer
A multi-column electron beam device includes an electron source comprising multiple field emitters fabricated on a surface of a silicon substrate. To prevent...
2018/0108513 METHOD AND SYSTEM FOR DIMENSIONAL UNIFORMITY USING CHARGED PARTICLE BEAM LITHOGRAPHY
A method for mask process correction or forming a pattern on a reticle using charged particle beam lithography is disclosed, where the reticle is to be used in...
2018/0108512 Charged Particle Beam Apparatus, Alignment Method of Charged Particle Beam Apparatus, Alignment Program, and...
The present invention shortens the time spent in a search for a visual field by a user in a charged particle beam apparatus in which an observation range on a...
2018/0108511 MULTIBEAM-FOCUS ADJUSTING METHOD, MULTIBEAM-FOCUS MEASURING METHOD, AND CHARGED-PARTICLE-BEAM LITHOGRAPHY APPARATUS
A multibeam-focus adjusting method in a charged-particle-beam lithography apparatus that draws a pattern by irradiating a sample with multibeams having a...
2018/0108510 STABLE SUPPORT FILMS FOR ELECTRON MICROSCOPY
This disclosure provides systems, methods, and apparatus related to arrangements including electron microscopy grids. In one aspect an arrangement includes an...
2018/0108509 IMAGE INTENSIFIER BLOOM MITIGATION
Image intensifiers may include a photocathode that emits photoelectrons in proportion to the rate photons impact the photocathode. The photoelectrons are...
2018/0108508 FOLD OVER EMITTER AND COLLECTOR FIELD EMISSION TRANSISTOR
A field emission transistor includes a gate, a fold over emitter, and fold over collector. The emitter and the collector are separated from the gate by a void...
2018/0108507 FUSE ELEMENT AND METHOD OF FABRICATION
A method of fabricating a fuse includes providing a fuse element within a casing. The fuse element has a plurality of ligaments configured to direct a current...
2018/0108506 FUSES WITH INTEGRATED METALS
Fuse assemblies are disclosed. In one implementation, a fuse assembly may be disposed that includes a first portion of the second portion. The first portion...
2018/0108505 CIRCUIT BREAKERS WITH HANDLE BEARING PINS
Circuit breakers with handles having at least one handle bearing pin that contacts an upper end portion of a moving arm and allows the arm to rotate to "OFF",...
2018/0108504 MEDIUM VOLTAGE CIRCUIT BREAKER IN SUBSEA ENVIRONMENT
In an embodiment, the present invention provides a medium voltage circuit breaker in high pressure subsea environment, including: a vacuum circuit breaker; and...
2018/0108503 ELECTRICAL TEST SWITCH WITH SOLIDIFYING BASE
A test switch for use in electrical power distribution networks is provided. The test switch facilitates the connection between the power distribution...
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