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Patent # Description
2018/0122851 Low Noise InGaAs Photodiode Array
A photodiode pixel structure for imaging short wave infrared (SWIR) and visible light built in a planar structure and may be used for one dimensional and two...
2018/0122850 SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
A semiconductor device including a first semiconductor section including a first wiring layer at one side thereof, the first semiconductor section further...
2018/0122845 SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Disclosed are a substrate bonding apparatus and a method of manufacturing a semiconductor device. The substrate bonding apparatus comprises vacuum pumps, a...
2018/0122844 SELECTIVE DEPOSITION AND PLANARIZATION FOR A CMOS IMAGE SENSOR
The present application relates to a method to simplify the scribe line opening filling processes, and to further improve the surface uniformity of the...
2018/0122843 Semiconductor Device with a Radiation Sensing Region and Method for Forming the Same
A semiconductor device includes a semiconductor substrate, a radiation-sensing region, at least one isolation structure, and a doped passivation layer. The...
2018/0122841 SENSOR, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
A sensor, a manufacturing method thereof and an electronic device. The sensor includes: a base substrate; a thin-film transistor (TFT) disposed on the base...
2018/0122835 DISPLAY DEVICE
A display device comprising: a first TFT using silicon (Si) and a second TFT using oxide semiconductor are formed on a substrate, a distance between the...
2018/0122834 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
As a display device has higher definition, the number of pixels is increased and thus, the number of gate lines and signal lines is increased. When the number...
2018/0122833 THIN FILM TRANSISTOR SUBSTRATE HAVING BI-LAYER OXIDE SEMICONDUCTOR
The present disclosure relates to a thin film transistor substrate having a bi-layer oxide semiconductor. The present disclosure provides a thin film...
2018/0122830 FLEXIBLE DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
A flexible display device includes: a bendable display panel; a protective layer on a surface of the display panel; and an elastic layer on the first surface...
2018/0122827 DISPLAY DEVICE
Disclosed is a display device including a data distribution circuit with enhanced electrical characteristic. The display device includes a plurality of...
2018/0122826 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device using an SOI (Silicon On Insulator) substrate, capable of preventing malfunction of MISFETs (Metal Insulator Semiconductor Field Effect...
2018/0122824 STANDARD CELL ARCHITECTURE WITH M1 LAYER UNIDIRECTIONAL ROUTING
A standard cell CMOS device includes metal oxide semiconductor transistors having gates formed from gate interconnects. The gate interconnects extend in a...
2018/0122821 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes forming a mold structure including alternately stacked mold insulating and sacrificial layers on a...
2018/0122820 METHOD FOR FORMING FLASH MEMORY STRUCTURE
Methods for forming semiconductor structures are provided. The method for forming the semiconductor structure includes forming a control gate over a substrate...
2018/0122819 VERTICAL MEMORY DEVICE
A vertical memory device includes a substrate having a cell array region and a connection region positioned on an exterior of the cell array region. Gate...
2018/0122812 MEMORY CELL STRUCTURE
Provided is a memory cell including a rectangular shaped via for at least one Vss node connection. In some embodiments, the rectangular shaped via has a...
2018/0122811 METHODS OF FABRICATING MEMORY DEVICES
Methods of fabricating a memory device are provided. The methods may include forming a mask pattern including line-shaped portions that are parallel to each...
2018/0122810 SEMICONDUCTOR DEVICE
A semiconductor device is provided. The semiconductor device includes an upper interlayer insulating layer disposed on a substrate. A first electrode spaced...
2018/0122809 DYNAMIC RANDOM ACCESS MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF
A manufacturing method of a dynamic random access memory (DRAM) structure includes following steps. A substrate is provided, wherein the substrate includes a...
2018/0122806 METHOD TO IMPROVE THE HIGH K QUALITY FOR FINFET
A method of manufacturing a semiconductor device includes providing a substrate structure including PMOS and NMOS regions having respective first and second...
2018/0122802 METHODS FOR FABRICATING FIN FIELD EFFECT TRANSISTORS
Methods for fabricating Fin field effect transistors (FinFETs) are disclosed. First and second semiconductor fins and an insulator therebetween are formed....
2018/0122794 ELECTROSTATIC PROTECTION DEVICE OF LDMOS SILICON CONTROLLED STRUCTURE
An electrostatic protection device of an LDMOS silicon controlled structure comprises a P-type substrate (310), an N-well (320) and a P-well (330) on the...
2018/0122792 VERTICAL TRANSISTORS WITH MERGED ACTIVE AREA REGIONS
A semiconductor device includes a substrate and an active area region forming a bottom source/drain region on the substrate. Vertical transistors are formed on...
2018/0122791 Package Structure and Methods of Forming the Same
Embodiments relate to packages and methods of forming packages. A package includes a package substrate, a first device die, first electrical connectors, an...
2018/0122788 LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
A light emitting diode includes a semiconductor structure, a first electrode, a second electrode, and an extending electrode. The semiconductor structure has...
2018/0122785 DIRECT BANDGAP SEMICONDUCTOR BONDED TO SILICON PHOTONICS
According to an example of the present disclosure a direct bandgap (DBG) semiconductor structure is bonded to an assembly comprising a silicon photonics (SiP)...
2018/0122782 Power Module
The present disclosure relates to power modules. The teachings thereof may be embodied in a power unit and/or a drive unit for driving the power unit, along...
2018/0122779 STACKED MEMORY WITH INTERFACE PROVIDING OFFSET Interconnect S
A stacked memory with interface providing offset interconnects. An embodiment of memory device includes a system element and a memory stack coupled with the...
2018/0122772 SEMICONDUCTOR PACKAGES
A semiconductor package includes a first package and a second package stacked on the first package. The first package includes a redistribution substrate, a...
2018/0122770 METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC CHIP AND A CARRIER SUBSTRATE AND ELECTRONIC...
An electrical connection wire connects an electrical connection pad of an electrical chip and an electrical connection pad of a carrier substrate to which the...
2018/0122768 SPRING ELEMENT FOR A POWER SEMICONDUCTOR MODULE
The present invention relates to a spring element for a power semiconductor module, wherein the spring element includes a first part made from a first material...
2018/0122767 ELECTRONIC DEVICE
An electronic device includes: a substrate having an upper surface (front surface) on which a semiconductor chip is mounted, and a lower surface (back surface)...
2018/0122765 BONDING WIRE FOR SEMICONDUCTOR DEVICE
A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer on a surface of the Cu alloy core material, and contains Ga...
2018/0122762 SEMICONDUCTOR DEVICES WITH UNDERFILL CONTROL FEATURES, AND ASSOCIATED SYSTEMS AND METHODS
Semiconductor devices with underfill control features, and associated systems and methods. A representative system includes a substrate having a substrate...
2018/0122760 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes: an integrated circuit having an electrode pad; a first insulating layer disposed on the integrated circuit; a redistribution...
2018/0122758 DISPLAY APPARATUS AND METHOD FOR BINDING THE SAME
Embodiments of the present application provide a display apparatus and a method for binding the same. The apparatus includes: a flexible display panel; and a...
2018/0122755 RADIO FREQUENCY (RF) APPARATUS
A radio-frequency (RF) apparatus that reduces signal reflections at input and output terminals is disclosed. The RF apparatus includes an assembly base and a...
2018/0122754 ON-DIE SEAL RINGS
Aspects of the disclosure provide an integrated circuit (IC) formed on a die. The IC includes first one or more electronic circuits and a seal ring structure....
2018/0122753 DEVICE COMPRISING A STACK OF ELECTRONIC CHIPS
A device includes a first chip having a front side and a back side. A second chip is stacked with the first chip and located on the back side of the first...
2018/0122752 IC with Insulating Trench and Related Methods
A method of making an integrated circuit (IC) includes forming circuitry over a top surface of a semiconductor substrate having the top surface and an opposite...
2018/0122748 FLOATING PACKAGE STIFFENER
Embodiments herein may relate to a package with one or more layers. A silicon die may be coupled with the one or more layers via an adhesive. A package...
2018/0122746 COOLER WITH EMI-LIMITING INDUCTOR
A power device package includes a dielectric substrate having an upper conductor layer and a lower conductor layer, a semiconductor die coupled to the upper...
2018/0122745 INPUT/OUTPUT PINS FOR CHIP-EMBEDDED SUBSTRATE
Input/output pins for a chip-embedded substrate may be fabricated by applying a contact-distinct volume of solder to at least two contacts that are recessed...
2018/0122744 AVD HARDMASK FOR DAMASCENE PATTERNING
A method including forming a dielectric layer on a contact point of an integrated circuit structure; forming a hardmask including a dielectric material on a...
2018/0122739 STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE
Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a dielectric layer over a...
2018/0122738 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A semiconductor device includes a first interlayer dielectric layer disposed over a substrate, metal wirings, a second interlayer dielectric layer disposed...
2018/0122737 FABRICATING UNIQUE CHIPS USING A CHARGED PARTICLE MULTI-BEAMLET LITHOGRAPHY SYSTEM
Method of manufacturing electronic devices using a maskless lithographic exposure system using a maskless pattern writer, wherein beamlet control data is...
2018/0122736 GLASS FIBER REINFORCED PACKAGE SUBSTRATE
A glass fiber layer is embedded in a thin film package substrate to reinforce the strength of the thin film package substrate. The thin film package substrate...
2018/0122734 PACKAGE SUBSTRATE AND FLIP-CHIP PACKAGE CIRCUIT INCLUDING THE SAME
This disclosure provides a package substrate, a flip-chip package circuit, and their fabrication methods. The package substrate includes: a first wiring layer...
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