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Patent # Description
2018/0138159 SOLID STATE DEVICE MINIATURIZATION
One or more example embodiments of miniaturized electric devices are disclosed. In some example embodiments, the electric device includes a first thin...
2018/0138158 FABRICATION METHOD OF PACKAGE ON PACKAGE STRUCTURE
A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first...
2018/0138157 LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF
A light emitting device includes: a base substrate; a plurality of unit regions provided on the base substrate; a barrier disposed at a boundary of the unit...
2018/0138156 CLIPS DEFINING ELECTRICAL PATHWAY ON A FLEXIBLE SHEET
A conductive pathway mounted on an electrically insulating sheet having an upper face and an opposed lower face, said sheet having a plurality of pairs of...
2018/0138155 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a...
2018/0138154 SEMICONDUCTOR MODULE
A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the...
2018/0138153 IMAGE PROCESSING DEVICE AND CONTROL METHOD THEREFOR
An image processing device includes: an integrated circuit chip arranged on a substrate to perform processing on image data; a first memory chip arranged...
2018/0138152 VERTICALLY STACKED MULTICHIP MODULES
In a general aspect, a circuit assembly apparatus can include first and second semiconductor die, and a substrate. The substrate can include an insulating...
2018/0138151 PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
An embodiment is a method including bonding a first die to a first side of an interposer using first electrical connectors, bonding a second die to first side...
2018/0138150 SEMICONDUCTOR PACKAGE HAVING A REDISTRIBUTION LINE STRUCTURE
A semiconductor package may include a first semiconductor chip having first bonding pads on a first active surface. The semiconductor package may include a...
2018/0138149 PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A POP structure includes a circuit board, a bottom package structure, a top package structure, and a metal frame structure. The circuit board has a plurality...
2018/0138148 COMPARTMENT SHIELDING FOR WARPAGE IMPROVEMENT
A semiconductor device package comprises a substrate, a first component, a second component, a package body and a conductive material. The substrate has a...
2018/0138147 Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device...
2018/0138146 MICROELECTRONIC DEVICE PACKAGE HAVING ALTERNATELY STACKED DIE
A microelectronic device package including multiple layers of stacked die. Multiple die layers in the package can include two or more die. At least two die in...
2018/0138145 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
A semiconductor package includes a package substrate, a first semiconductor chip, a second semiconductor chip, and a top interposer. The first semiconductor...
2018/0138144 SEMICONDUCTOR PACKAGES AND RELATED METHODS
Methods of forming a semiconductor package. Implementations include providing a leadframe, coupling a semiconductor die or an electronic component to the...
2018/0138143 WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
Wire bonding operations can be facilitated through the use of metal nanoparticle compositions. Both ball bonding and wedge bonding processes can be enhanced in...
2018/0138142 Film for Semiconductor Device and Fabrication Method Thereof
A film for semiconductor device includes a base material and an adhesive layer formed over the base material. The film is divided into an adhesive area and an...
2018/0138141 PROTECTIVE FILM FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE, AND COMPOSITE SHEET
[Object] To provide a semiconductor protective film capable of suppressing a warpage of a semiconductor chip without impairing productivity and reliability, a...
2018/0138140 METHOD OF FABRICATING SUBSTRATE STRUCTURE
A substrate structure is provided, which includes: a substrate body having a plurality of conductive pads; an insulating layer formed on the substrate body and...
2018/0138139 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface and a recess recessed from the first...
2018/0138138 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a method of...
2018/0138137 SEMICONDUCTOR CHIP
A semiconductor chip includes a semiconductor substrate including a bump region and a non-bump region, a bump on the bump region, and a passivation layer on...
2018/0138136 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
An insulating film is formed such that the insulating film covers a source electrode and a gate electrode, and an opening portion exposing a portion of the...
2018/0138135 SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD THEREOF
In a semiconductor element of the present invention, an electroless nickel-phosphorus plating layer and an electroless gold plating layer are formed on both a...
2018/0138134 SEMICONDUCTOR DEVICE
A semiconductor device includes a lead frame, a transistor, and an encapsulation resin. The lead frame includes a drain frame, a source frame, and a gate...
2018/0138133 PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE
Techniques and mechanisms to facilitate connection with one or more integrated circuit (IC) dies of a packaged device. In an embodiment, the packaged device...
2018/0138132 SEMICONDUCTOR DEVICE
Airtightness of a hollow portion is maintained, and yield and durability are improved. A semiconductor device 1 includes a device substrate 2, a semiconductor...
2018/0138131 COMPOSITE MAGNETIC SEALING MATERIAL AND ELECTRONIC CIRCUIT PACKAGE USING THE SAME
Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or...
2018/0138130 CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
A chip package structure is provided. The chip package structure includes a redistribution structure including a dielectric structure and a grounding line in...
2018/0138129 MULTI-HEIGHT SEMICONDUCTOR STRUCTURES
Among other things, one or more semiconductor arrangements, and techniques for forming such semiconductor arrangements are provided. A layer, such as a poly...
2018/0138127 ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame...
2018/0138126 PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
A package structure includes a first redistribution layer, a molding material, a semiconductor device and an inductor. The molding material is located on the...
2018/0138125 CONDUCTIVE STRUCTURE, LAYOUT STRUCTURE INCLUDING CONDUCTIVE STRUCTURE, AND METHOD FOR MANUFACTURING CONDUCTIVE...
A layout structure including a conductive structure is provided. The layout structure includes a dielectric layer formed on a substrate and a conductive...
2018/0138124 INTERCONNECT STRUCTURE WITH AIR-GAPS
In some embodiments, the present disclosure relates to an interconnect structure. The interconnect structure has a first dielectric layer disposed over a...
2018/0138123 INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
Aspects of the present disclosure include a semiconductor device which includes a dielectric layer deposited over a conductive region and an interconnect...
2018/0138122 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
As means for preventing a leakage of a fuse element cut by laser trimming due to a conductive residue or the like, an insulating film which has a high thermal...
2018/0138121 SEMICONDUCTOR DEVICE AND A METHOD OF INCREASING A RESISTANCE VALUE OF AN ELECTRIC FUSE
A semiconductor device is provided which includes an interlayer dielectric formed on a semiconductor substrate, a first insulating layer, having a trench,...
2018/0138120 Semiconductor Device with Metallization Structure on Opposite Sides of a Semiconductor Portion
A semiconductor device includes a semiconductor layer with a thickness of at most 50 .mu.m. A first metallization structure is disposed on a first surface of...
2018/0138119 DIELECTRIC THERMAL CONDUCTOR FOR PASSIVATING EFUSE AND METAL RESISTOR
A semiconductor device includes a first dielectric layer formed on a second dielectric layer and planar contacts formed in the second dielectric layer. The...
2018/0138118 INTEGRATED CIRCUIT PACKAGE SUBSTRATE
Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one...
2018/0138117 SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS
A semiconductor device with a redistribution structure on partial encapsulation is disclosed and may include an electronic device having a top surface, a...
2018/0138116 Semiconductor Device and Method
A semiconductor device includes a substrate, a first redistribution layer (RDL) over a first side of the substrate, one or more semiconductor dies over and...
2018/0138115 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor package structure includes a dielectric structure defining a plurality of through holes, wherein each of the through holes includes a first...
2018/0138114 SUBSTRATE, SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING PROCESS
A substrate includes a first conductive structure, a second conductive structure attached to the first conductive structure and a third conductive structure...
2018/0138113 SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRUCTURE
A semiconductor device package includes a semiconductor chip, a glass substrate having a first surface facing the semiconductor chip and a second surface...
2018/0138112 POWER FIELD-EFFECT TRANSISTOR (FET), PRE-DRIVER, CONTROLLER, AND SENSE RESISTOR INTEGRATION FOR MULTI-PHASE...
Techniques are described for integrating power field-effect transistors (FETs), pre-drivers, controllers, and/or resistors into a common multi-chip package for...
2018/0138111 Package with interconnections having different melting temperatures
A package comprising at least one electronic chip, a first heat removal body on which the at least one electronic chip is mounted by a first interconnection, a...
2018/0138110 Enhanced Adhesion by Nanoparticle Layer Having Randomly Configured Voids
The surface of a substrate of a first material is modified by depositing a layer of a solvent paste comprising nanoparticles of a second material that have a...
2018/0138109 SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
In one embodiment, methods for making semiconductor devices are disclosed.
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