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Patent # Description
2018/0151561 SEMICONDUCTOR DEVICE INCLUDING VERTICAL CHANNEL
A semiconductor device includes a substrate having a first region and a second region; a first nanowire in the first region in a direction perpendicular to an...
2018/0151560 Contact Structure and Method of Fabricating the Same
A method includes forming a first transistor and a second transistor over a substrate, wherein the first transistor and the second transistor share a...
2018/0151559 INTEGRATED CIRCUIT, SYSTEM FOR AND METHOD OF FORMING AN INTEGRATED CIRCUIT
An integrated circuit structure includes a first well, and a first and a second set of implants. The first well includes a first dopant type, a first portion...
2018/0151558 SEMICONDUCTOR DEVICE
A semiconductor device includes a diode provided with: a drift layer being a first conductivity type; a cathode region being provided in a back face side of...
2018/0151557 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor substrate provided with an IGBT cell having a collector region and a diode cell having a cathode region, a...
2018/0151556 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device includes a substrate, a first recess formed in the substrate, a first source/drain filling the first recess, a vertical metal resistor...
2018/0151555 INTRA-METAL CAPACITOR AND METHOD OF FORMING THE SAME
An intra-metal capacitor is provided. The intra-metal capacitor is formed in a dielectric layer and comprising a first electrode and a second electrode,...
2018/0151554 Planar and Non-Planar Fet-Based Electrostatic Discharge Protection Devices
An electrostatic discharge (ESD) protection device having a source region coupled to a first electrical node, a first drain region coupled to a second...
2018/0151553 STATIC RANDOM ACCESS MEMORY DEVICE
A semiconductor device including a static random access memory (SRAM) device includes a first SRAM array including a first plurality of bit cells arranged in a...
2018/0151552 METHOD OF MANUFACTURING CONDUCTORS AND SEMICONDUCTOR DEVICE WHICH INCLUDES CONDUCTORS
A method of manufacturing conductors for a semiconductor device, the method comprising: forming a structure on a base; and eliminating selected portions of...
2018/0151551 High-Density Semiconductor Device
A method of manufacturing a semiconductor device includes providing a material above a substrate and respectively forming separate gate electrode lines on...
2018/0151550 Semiconductor Device with Reduced Leakage Current
An integrated circuit includes a substrate and a first set of functional cell units formed over the substrate. Each of the functional cell units includes a...
2018/0151549 Package-On-Package with Cavity in Interposer
A package includes an interposer, which includes a core dielectric material, a through-opening extending from a top surface to a bottom surface of the core...
2018/0151548 Optoelectronic Component and Method for Producing an Optoelectronic Component
An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the optoelectronic component includes a...
2018/0151547 METHOD OF MANUFACTURING LIGHT-EMITTING ELEMENT
A method of manufacturing a light emitting device includes: placing, on a supporting layer, a light-emitting element including an anode and a cathode at a...
2018/0151546 PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
A package structure includes a semiconductor device, a first dielectric layer, a redistribution line and a conductive bump. The first dielectric layer is over...
2018/0151545 LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE USING THE SAME
A light-emitting device and a light-emitting module using the same are provided. The light-emitting device includes a substrate module and a light-emitting...
2018/0151544 LED MODULE
An LED module includes: a substrate having a main surface and a back surface which face in opposite directions from each other in a thickness direction; a...
2018/0151543 DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND FABRICATION METHOD THEREOF
A display device including a growth substrate; a plurality of semiconductor light emitting devices grown on the growth substrate and disposed on one surface of...
2018/0151542 ELECTRONIC PACKAGES WITH THREE-DIMENSIONAL CONDUCTIVE PLANES, AND METHODS FOR FABRICATION
An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned...
2018/0151541 HETEROGENEOUS INTEGRATION OF ULTRATHIN FUNCTIONAL BLOCK BY SOLID PHASE ADHESIVE AND SELECTIVE TRANSFER
A method including coupling a device substrate to a carrier substrate; aligning a portion of the device substrate to a host substrate; separating the portion...
2018/0151540 CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the...
2018/0151539 DISPLAY DEVICE AND ELECTRONIC DEVICE
A display panel includes a plurality of light-emitting elements. Light emitted from a first light-emitting element has a CIE 1931 chromaticity coordinate x of...
2018/0151538 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor package structure is provided. A stacked structure formed over the carrier substrate is provided, wherein the stacked...
2018/0151537 PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Package structures and methods for forming the same are provided. A package structure includes a package component including a first bump. The package...
2018/0151536 CHIP-ON FILM AND DISPLAY DEVICE INCLUDING THE SAME
A chip-on film and a display device including the same are disclosed. The chip-on film includes a first base film, a second base film positioned on the first...
2018/0151535 WAFER BONDING STRUCTURE AND WAFER BONDING METHOD
Wafer bonding methods and wafer bonding structures are provided. An exemplary wafer bonding method includes providing a first wafer; forming a first interlayer...
2018/0151534 ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME
An electronic component includes: a substrate; a device chip including a functional element located on a lower surface thereof and mounted on an upper surface...
2018/0151533 MANUFACTURING METHOD FOR POWER SEMICONDUCTOR DEVICE, AND POWER SEMICONDUCTOR DEVICE
An object of the invention is to provide: a manufacturing method for a highly reliable power semiconductor device which prevents breakage of an conductor...
2018/0151532 WIRE BONDING APPARATUS
To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members...
2018/0151531 NOBLE METAL PASTE FOR BONDING OF SEMICONDUCTOR ELEMENT
A precious metal paste which does not cause contamination of a member, which can be uniformly coated to a member to be bonded, and which is in good condition...
2018/0151530 PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
A package structure and method of forming the same includes: a first package including: a first die; a via adjacent the first die; a molding compound...
2018/0151529 SOLDER IN CAVITY INTERCONNECTION STRUCTURES
The present disclosure relates to the field of fabricating microelectronic packages, wherein cavities are formed in a dielectric layer deposited on a first...
2018/0151528 Packaging Structures of Integrated Circuits
A chip includes a first group of dummy bumps disposed at a top surface of the chip in a first corner of the chip, a second group of dummy bumps disposed at the...
2018/0151527 Film Scheme for Bumping
A bump structure with a barrier layer, and a method for manufacturing the bump structure, are provided. In some embodiments, the bump structure comprises a...
2018/0151526 SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE SUPPORT RING
A semiconductor wafer has an edge support ring around a perimeter of the semiconductor wafer and conductive layer formed over a surface of the semiconductor...
2018/0151525 REDISTRIBUTION LAYER STRUCTURE AND FABRICATION METHOD THEREFOR
A method of manufacturing a semiconductor device includes depositing a first passivation layer over a substrate, depositing a conductive material over the...
2018/0151524 PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
A package structure is provided comprising a die, a redistribution layer, at least one integrated passive device (IPD), a plurality of solder balls and a...
2018/0151523 METHOD FOR MANUFACTURING INTERCONNECT STRUCTURE
A conductive interconnect structure includes a contact pad; a conductive body connected to the contact pad at a first end; and a conductive layer positioned on...
2018/0151522 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate having a first surface, a second surface...
2018/0151521 METHOD OF FABRICATING REDISTRIBUTION CIRCUIT STRUCTURE
A redistribution circuit structure electrically connected to at least one conductor underneath is provided. The redistribution circuit structure includes a...
2018/0151520 POST PASSIVATION INTERCONNECT AND FABRICATION METHOD THEREFOR
A method of manufacturing a semiconductor structure. The method includes depositing a conductive material over a substrate, and removing a portion of the...
2018/0151519 METHOD FOR MANUFACTURING REDISTRIBUTION LAYER
In a method for manufacturing a semiconductor device, a semiconductor substrate having a top surface is provided. A top metal layer is formed in the top...
2018/0151518 SEMICONDUCTOR PACKAGE WITH ANTENNA
A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom...
2018/0151517 SEMICONDUCTOR ELEMENT MOUNTING BOARD
A semiconductor element mounting board includes: a circuit conductor disposed on the insulating board, a plurality of semiconductor element connection pads...
2018/0151516 LIGHT-EMITTING DEVICE
The present disclosure provides a light emitting device including an LED array including a plurality of LED cells connected in series disposed on a single...
2018/0151515 SYSTEM AND METHOD FOR STRIPLINE ELECTRODES FOR THIN-FILM CHARACTERIZATION
Systems and methods provide a device for characterizing a thin film, including a conducting or insulating substrate, an active layer on the conducting or...
2018/0151514 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRIC POWER CONVERSION DEVICE
A technology is proposed in which the improvement of the capability of a semiconductor device can be realized by satisfying both reduction of leakage currents...
2018/0151513 INTEGRATED CIRCUIT (IC) DEVICES WITH VARYING DIAMETER VIA LAYER
An integrated circuit (IC) device includes a device layer and a passivation layer, where the passivation layer has vias formed in an interior region of the...
2018/0151512 STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes: a first dielectric layer having a first surface; a molding compound disposed on the first surface of the first dielectric...
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