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Patent # Description
2018/0151410 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
To improve the characteristics of a semiconductor device having a substrate contact formed in a deep trench. In a method of forming a plug PSUB in a deep...
2018/0151409 SUBSTRATE SUPPORT UNIT, HEAT TREATMENT UNIT, AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME
Embodiments of the inventive concept relate to a substrate treating apparatus. A substrate support unit configured to support a substrate includes a support...
2018/0151408 GLASS SUBSTRATE, LAMINATED SUBSTRATE, LAMINATED SUBSTRATE MANUFACTURING METHOD, LAMINATE, PACKAGE, AND GLASS...
A glass substrate is laminated with a substrate containing silicon to thereby form a laminated substrate. The glass substrate has a concave surface and a...
2018/0151407 SYSTEM FOR SEMICONDUCTOR WAFER RETENTION AND SENSING IN A VACUUM LOAD LOCK
A workpiece clamp has a base with first and second sides with a cam ring rotatably coupled to the first side. The cam ring has plurality of cam slots. An...
2018/0151406 Semiconductor Tool With A Shield
A method includes loading a wafer onto a robot arm, wherein a shield is disposed over the wafer, moving the wafer from a first location to a second location,...
2018/0151405 PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent...
2018/0151404 METHOD OF FABRICATING DIAMOND-SEMICONDUCTOR COMPOSITE SUBSTRATES
A method of fabricating a semiconductor-on-diamond composite substrate, the method comprising: (i) starting with a native semiconductor wafer comprising a...
2018/0151403 Automated Electrostatic Bonding/De-Bonding Apparatus
An automated electrostatic bonding/de-bonding apparatus is used to automate a mating or separating process between a semiconductive wafer and a mobile...
2018/0151402 CERAMIC ELECTROSTATIC CHUCK HAVING A V-SHAPE SEAL BAND
Implementations described herein provide a substrate support assembly that includes a seal band. The seal band protects an adhesive layer that is disposed...
2018/0151401 SUBSTRATE SUPPORT ASSEMBLY HAVING A PLASMA RESISTANT PROTECTIVE LAYER
A substrate support assembly comprises a ceramic body and a thermally conductive base bonded to a lower surface of the ceramic body. The substrate support...
2018/0151400 PRE-ALIGNMENT DEVICE AND METHOD FOR WAFER
An apparatus for pre-aligning a wafer comprises: a wafer stage for carrying the wafer, wherein a first alignment mark (W1) and a second alignment mark (W2) are...
2018/0151399 SUBSTRATE TRANSFER DEVICE
A substrate transfer device 1 includes a casing 8 and a substrate conveying robot 7. A size of the casing 8 in a second direction Y is more than a size of the...
2018/0151397 METHOD FOR CONTROLLING TEMPERATURE OF FURNACE IN SEMICONDUCTOR FABRICATION PROCESS
A furnace for processing semiconductor wafer is provided. The furnace includes a tube having a closed upper end, an open lower end, and a sidewall connecting...
2018/0151396 TRANSLATING AND ROTATING CHUCK FOR PROCESSING MICROELECTRONIC SUBSTRATES IN A PROCESS CHAMBER
Cleaning systems and methods for semiconductor fabrication use rotatable and translatable chuck assemblies that incorporate a compact drive system to cause...
2018/0151395 CLEANING COMPOSITION, CLEANING APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A cleaning composition includes a surfactant, deionized (DI) water, and an organic solvent. The surfactant has a concentration of from about 0.03 M to about...
2018/0151394 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a substrate rotating mechanism for rotating a substrate, a nozzle part for discharging droplets of a processing...
2018/0151393 METHOD OF PACKAGING CHIP AND CHIP PACKAGE STRUCTURE
The present disclosure discloses a method of packaging a chip and a chip package structure. The method of packaging the chip includes: forming a protective...
2018/0151392 SEMICONDUCTOR PACKAGE FOR 3D STACKING AND METHOD OF FORMING THEREOF
The embodiment of the present disclosure discloses a method of packaging a chip and a chip package structure. the method of packaging the chip includes:...
2018/0151391 SYSTEMS AND METHODS FOR FLEXIBLE COMPONENTS FOR POWERED CARDS AND DEVICES
Die may be thinned using a thinning and/or a polishing process. Such thinned die may be flexible and may change operational characteristics when flexed. The...
2018/0151390 FINFET DEVICE HAVING OXIDE LAYER AMONG INTERLAYER DIELECTRIC LAYER
A semiconductor device includes a semiconductor substrate having a fin structure. A gate structure is disposed over the fin structure. A first dielectric layer...
2018/0151389 INTER-FAN-OUT WAFER LEVEL PACKAGING WITH COAXIAL TIV FOR 3D IC LOW-NOISE PACKAGING
A semiconductor package includes a first semiconductor element, an insulating layer, and a second semiconductor element. The first semiconductor element...
2018/0151388 CHEMICAL MECHANICAL POLISHING DEVICE AND CHEMICAL MECHANICAL POLISHING METHOD
The present disclosure describes a chemical mechanical polishing device and a chemical mechanical polishing method. The chemical mechanical polishing device...
2018/0151387 Process for Making Multi-Gate Transistors and Resulting Structures
In a gate last metal gate process for forming a transistor, a dielectric layer is formed over an intermediate transistor structure, the intermediate structure...
2018/0151386 METHOD FOR GENERATING VERTICAL PROFILES IN ORGANIC LAYER ETCHES
A method for etching an organic carbon based layer below a silicon containing hardmask is provided. An etch gas is provided comprising oxygen and a halogen...
2018/0151385 Heat Shield for Chamber Door and Devices Manufactured Using Same
A chamber door, such as an etch chamber door may be heated during etch processing to, e.g., prevent etching by-products from adhering to the etch chamber door....
2018/0151384 METHODS FOR PROCESSING SEMICONDUCTOR WAFERS HAVING A POLYCRYSTALLINE FINISH
A method of processing a semiconductor wafer includes depositing a silicon layer on the semiconductor wafer. The silicon layer has a substantially uniform...
2018/0151383 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Semiconductor structures and fabrication methods are provided. The semiconductor structure includes a base including first, second, third, and fourth regions,...
2018/0151382 Semiconductor Methods and Devices
To pattern a gate electrode, a mandrel of material is initially deposited and then patterned. In an embodiment the patterning is performed by performing a...
2018/0151381 High-Density Semiconductor Device
A method of manufacturing a semiconductor device includes depositing a first material on a substrate, depositing on the substrate a second material that has an...
2018/0151380 SUBSTRATE PROCESSING APPARATUS AND HEAT SHIELD PLATE
There is provided a substrate processing apparatus which includes: a process container configured to accommodate a substrate; a partition member disposed...
2018/0151379 ELECTRODES FOR LOCALIZED CONTROL FACILITATING THE INTEGRATION OF POROUS SILICON FORMED BY GALVANIC ETCHING
A method of manufacturing a porous silicon (PSi) includes providing a semiconductor wafer; depositing a mask layer on a first side of the semiconductor wafer;...
2018/0151378 FinFET Device and Method of Forming
A finFET device and methods of forming are provided. The method includes etching recesses in a substrate on opposite sides of a gate stack. The method also...
2018/0151377 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device includes a first nitride semiconductor layer formed over a substrate, a second nitride semiconductor layer formed over the first nitride...
2018/0151376 METHODS OF FABRICATING SEMICONDUCTOR DEVICES
A method of fabricating a semiconductor device includes forming first and second gate dielectric layers on first and second regions of a semiconductor...
2018/0151375 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A method of manufacturing a non-volatile memory semiconductor device includes forming a plurality of memory cells on a non-volatile memory cell area of a...
2018/0151374 PATTERNED STRUCTURE FOR ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
The present invention provides a patterned structure for an electronic device and a manufacturing method thereof. The patterned structure includes a patterned...
2018/0151373 Semiconductor Device and Methods of Manufacture
A semiconductor device and method of manufacture are provided. In an embodiment a metal layer is formed over a substrate using a fluorine-free deposition...
2018/0151372 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
A method of manufacturing a semiconductor structure includes depositing a silicon layer over a substrate, removing a portion of the silicon layer to form a...
2018/0151371 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
A semiconductor device includes first fin-shaped structures and second fin-shaped structures, which are separately disposed on a semiconductor substrate. Each...
2018/0151370 WAFER PROCESSING METHOD
A processing method for a wafer having a plurality of streets inclined at 45.degree. relative to a cleavage direction including a laser processing step of...
2018/0151369 ION IMPLANTING METHOD
An ion implanting method includes providing a gas having a bonding energy ranged from about 220 kJ/mol to about 450 kJ/mol; ionizing the gas to form a...
2018/0151368 ENGINEERING THE OPTICAL PROPERTIES OF AN INTEGRATED COMPUTATIONAL ELEMENT BY ION IMPLANTATION
Systems and methods of engineering the optical properties of an optical Integrated Computational Element device using ion implantation during fabrication are...
2018/0151367 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE COMPRISING A THIN SEMICONDUCTOR WAFER
A method for manufacturing a vertical power semiconductor device is provided, wherein a first impurity is provided at the first main side of a semiconductor...
2018/0151366 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
A semiconductor device includes: a substrate having a cell region with a semiconductor element and an outer peripheral region; and a drift layer on the...
2018/0151365 SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, INVERTER CIRCUIT, DRIVING DEVICE, VEHICLE,...
A semiconductor device according to an embodiment includes a SiC layer having a first and a second plane; a first electrode having a first region in the SiC...
2018/0151364 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device is provided. The method includes: grinding a surface of an SiC wafer so that a crushed layer having a...
2018/0151363 SEMICONDUCTOR METHODS AND DEVICES
In some embodiments, a method of a semiconductor process includes conformally forming a spacer layer over a plurality of mandrels that are disposed over a mask...
2018/0151362 METHOD OF FORMING PATTERNS FOR SEMICONDUCTOR DEVICE
A method of forming patterns for a semiconductor device includes preparing a hardmask composition including a carbon allotrope, a spin-on hardmask (SOH)...
2018/0151361 N-TYPE DOPING OF STRAINED EPITAXIAL GERMANIUM FILMS THROUGH CO-IMPLANTATION AND NANOSECOND PULSED LASER MELTING
In one aspect a method of fabricating an n-doped strained germanium (Ge) film is disclosed, which includes depositing a strained Ge film on an underlying...
2018/0151360 LASER ANNEALING APPARATUS, AND FABRICATION METHODS OF POLYCRYSTALLINE SILICON THIN FILM AND THIN FILM TRANSISTOR
A laser annealing apparatus, a fabrication method of a polysilicon thin film, and a fabrication method of a thin film transistor are provided. The laser...
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