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Patent # Description
2018/0159041 Polymer-Perovskite Films, Devices, and Methods
Provided herein are perovskite-polymer films, methods of forming polymer-perovskite films, and devices including polymer-perovskite films. The...
2018/0159040 OPTO-ELECTRICAL DEVICES INCORPORATING METAL NANOWIRES
The present disclosure relates to OLED and PV devices including transparent electrodes that are formed of conductive nanostructures and methods of improving...
2018/0159039 PHOTOELECTRIC CONVERSION ELEMENT, IMAGING ELEMENT, OPTICAL SENSOR, AND COMPOUND
The present invention provides a photoelectric conversion element exhibiting excellent low dark current characteristics and heat resistance, an imaging element...
2018/0159038 DISPLAY PANEL, DISPLAY SUBSTRATE, AND INKJET PRINTING METHOD APPLICABLE TO THE DISPLAY SUBSTRATE
Disclosed are a display panel, a display substrate, and an inkjet printing method. The display panel includes an underlying substrate, anode layers of a...
2018/0159037 3D PRINTED ACTIVE ELECTRONIC MATERIALS AND DEVICES
Disclosed is a process whereby diverse classes of materials can be 3D printed and fully integrated into device components with active properties. An exemplary...
2018/0159036 METHOD OF MAKING AN ORGANIC THIN FILM TRANSISTOR
In one aspect, organic thin film transistors are described herein. In some embodiments, an organic thin film transistor comprises a source terminal, a drain...
2018/0159035 EVAPORATION CARRIER PLATE AND EVAPORATION APPARATUS
An evaporation carrier plate and an evaporation apparatus are provided in embodiments of the disclosure, both belonging to the technical field of evaporation...
2018/0159034 EMITTER AND METHOD FOR MANUFACTURING THE SAME
A method for manufacturing an emitter comprises providing a semiconductor substrate having a main surface, the semiconductor substrate comprising a cavity...
2018/0159033 LOW POWER BARRIER MODULATED CELL FOR STORAGE CLASS MEMORY
Systems and methods for providing a Barrier Modulated Cell (BMC) structure that may comprise a reversible resistance-switching memory element within a memory...
2018/0159032 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device includes a first word line and a first bit line. The semiconductor device further includes a mold film disposed between the first word...
2018/0159031 SWITCHING DEVICE FORMED FROM CORRELATED ELECTRON MATERIAL
Subject matter disclosed herein may relate to fabrication of a correlated electron material (CEM) switch. In embodiments, processes are described in which...
2018/0159030 SEMICONDUCTOR DEVICES
A semiconductor device includes a stacked structure of cell structures, an electrode structure, and a heating electrode. Each cell structure includes a capping...
2018/0159029 CORRELATED ELECTRON DEVICE FORMED VIA CONVERSION OF CONDUCTIVE SUBSTRATE TO A CORRELATED ELECTRON REGION
Subject matter disclosed herein may relate to fabrication of correlated electron materials used, for example, to perform a switching function. In embodiments,...
2018/0159028 CONTROLLING DOPANT CONCENTRATION IN CORRELATED ELECTRON MATERIALS
Subject matter disclosed herein may relate to fabrication of a correlated electron material (CEM) device. In embodiments, after formation of the one or more...
2018/0159026 SPIN CURRENT MAGNETIZATION ROTATIONAL ELEMENT, MAGNETORESISTANCE EFFECT ELEMENT, AND MAGNETIC MEMORY
A spin current magnetization rotational element includes: a magnetization free layer including a synthetic structure consisting of a first ferromagnetic metal...
2018/0159025 SEMICONDUCTOR DEVICE
A vertical Hall element having an improved sensitivity and reduced offset voltage includes: a second conductivity type semiconductor layer formed on a...
2018/0159024 MAGNETIC MEMORY DEVICE
According to one embodiment, a magnetic memory device includes a conductive layer, first to fourth magnetic layers, first and second intermediate layers, and a...
2018/0159023 SEMICONDUCTOR DEVICE
A first lower interconnection structure and a second lower interconnection structure are formed using a first design rule on a first region of a substrate and...
2018/0159022 ELECTROMECHANICAL CONVERTER CONSISTING OF A CYCLICALLY STABLE, REVERSIBLE, AND EXPANDABLE ELECTRODE, AND A...
The invention relates to thin, flexible and expandable electrically conductive electrode layers based on conductive carbon, said layers having a sufficiently...
2018/0159021 MEMS PROCESS POWER
A transducer includes a first piezoelectric layer; and a second piezoelectric layer that is above the first piezoelectric layer; wherein the second...
2018/0159020 PIEZOELECTRIC THIN FILM-STACKED BODY, PIEZOELECTRIC THIN FILM SUBSTRATE, PIEZOELECTRIC THIN FILM DEVICE,...
A piezoelectric thin film-stacked body is provided. A piezoelectric thin film-stacked body has a first electrode layer, a first oxide layer stacked on the...
2018/0159019 PIEZOELECTRIC THIN FILM-STACKED BODY, PIEZOELECTRIC THIN FILM SUBSTRATE, PIEZOELECTRIC THIN FILM DEVICE,...
A piezoelectric thin film-stacked body is provided. A piezoelectric thin film-stacked body has a first electrode layer, a first intermediate layer stacked on...
2018/0159018 PIEZOELECTRIC VIBRATION DEVICE
A piezoelectric vibration device is provided that includes a piezoelectric transformer, a flexible board and a case. The flexible board includes an...
2018/0159017 MICROSCALE SENSOR STRUCTURE WITH BACKSIDE CONTACTS AND PACKAGING OF THE SAME
A microscale sensor structure is provided that enables backside electrical connection to flush-mounted microscale sensors without through-wafer-vias (TWVs). A...
2018/0159016 Thermoelectric Devices
This disclosure relates to methods for manufacturing devices capable of functioning as thermoelectric generators and related objects by the process of additive...
2018/0159015 FLEXIBLE ENCAPSULATION OF A FLEXIBLE THIN-FILM BASED THERMOELECTRIC DEVICE WITH SPUTTER DEPOSITED LAYER OF...
A method of encapsulating a thin-film based thermoelectric module includes forming the thin-film based thermoelectric module by sputter depositing pairs of...
2018/0159014 FLEXIBLE THERMOELECTRIC STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the...
2018/0159013 PIN COUPLING BASED THERMOELECTRIC DEVICE
A method includes coupling a number of sets of N and P thermoelectric legs to a substrate. Each set includes an N thermoelectric leg and a P thermoelectric leg...
2018/0159011 THERMAL GROUND PLANES AND LIGHT-EMITTING DIODES
Methods and systems for thermal management of one or more LEDs are disclosed. One or more LEDs may be coupled with an external layer of a thermal ground plane...
2018/0159010 LIGHT-EMITTING DEVICE
This disclosure discloses a light-emitting device. The light-emitting device includes: a heat-dissipating structure having a first part and a second part...
2018/0159009 METHOD FOR PRODUCING AN ELECTRONIC COMPONENT WITH A CARRIER ELEMENT AND ELECTRONIC COMPONENT WITH A CARRIER ELEMENT
The invention relates to a method for producing an electronic component with a carrier element (100), with the steps: producing the carrier element (100),...
2018/0159008 LIGHT EMITTING DIODE ASSEMBLY USING THERMAL PYROLYTIC GRAPHITE FOR THERMAL MANAGEMENT
A light emitting diode assembly comprising such thermal management assembly is shown and described herein. The light emitting diode assembly may comprise a...
2018/0159007 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE WITH EXPOSED WIRE END PORTIONS
A method of manufacturing one or more light emitting devices includes: forming one or more emitting elements, each including a first conductive type...
2018/0159006 LIGHT EMITTING DEVICE AND SOLDER BOND STRUCTURE
A light emitting device includes a light emitting element; a sub-mount including a sub-mount substrate with a front surface on which the light emitting element...
2018/0159005 SEMICONDUCTOR LIGHT EMITTING DEVICE INCLUDING CAP STRUCTURE AND METHOD OF MAKING SAME
A light emitting device and method of forming the same, the light emitting device including: a substrate, a buffer layer disposed on the substrate, a...
2018/0159004 LIGHT-EMITTING DEVICE
A light-emitting device includes a light body having an internal electrode layer, and a conductive layer. The conductive layer has a first portion formed on...
2018/0159003 Illumination Device
There is proposed an illuminating device, comprising (a) a luminous element, (b) a support, and (c) a primary optical element, characterized in that (i) said...
2018/0159002 LIGHT-EMITTING DEVICE
A light-emitting device includes: a substrate; and at least one light source comprising: a light-emitting element comprising a plurality of electrodes that...
2018/0159001 LED FABRICATION USING HIGH-REFRACTIVE-INDEX ADHESIVES
Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting...
2018/0159000 LED DEVICE, LED MODULE AND ULTRAVIOLET LIGHT EMITTING DEVICE
An LED device is provided which includes a substrate, an LED element disposed on the substrate, an inorganic glass molded body disposed at a position where all...
2018/0158999 LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE
A light-emitting device and a method of manufacturing a light-emitting device are provided. The light-emitting device includes a transparent substrate having a...
2018/0158998 LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
A light-emitting device and a manufacturing method thereof are provided, which device yields light exhibiting an actual hue with a deviation reduced as much as...
2018/0158997 PLANAR ALIGNED NANORODS AND LIQUID CRYSTAL ASSEMBLIES
A method is described for preparing a nanorods assembly. The method comprises providing a mixture comprising at least a liquid crystal and nanorods and...
2018/0158996 PACKAGING METHOD FOR HIGH GAMUT WHITE LIGHT QUANTUM DOT LED
A packaging method of high color gamut white light quantum dot (QD) light emitting diodes (LEDs). The method includes: a. add an organic solvent to red light...
2018/0158995 WAVELENGTH COINVENTOR, FLUORESCENT COLOR WHEEL, AND LIGHT-EMITTING DEVICE
A wavelength converter is provided. The wavelength converter comprises a light emitting-reflecting layer, and the light emitting-reflecting layer comprises a...
2018/0158994 LIGHT EMITTING DEVICE
A light emitting device includes a light emitting element that emits a light having a peak emission wavelength in a wavelength range of not less than 410 nm...
2018/0158993 Method for Producing at Least One Optoelectronic Semiconductor Component and Optoelectronic Semiconductor Component
A method for producing at least one optoelectronic semiconductor component and an optoelectronic semiconductor component are disclosed. In an embodiment, the...
2018/0158992 LED MODULE
The invention relates to a method for producing an LED module (1) and comprises at least the following steps:--providing at least one LED chip (4) on a...
2018/0158991 SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME
A semiconductor element includes a semiconductor layer, a carbide substrate, and a reflective layer. The carbide substrate is provided on the semiconductor...
2018/0158990 TRANSPARENT ELECTRON BLOCKING HOLE TRANSPORTING LAYER
A light emitting diode includes an active region configured to emit light, a composite electrical contact layer, and a transparent electron blocking hole...
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