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Patent # Description
2018/0158787 INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
An integrated fan-out package including an insulating encapsulation, a radio frequency integrated circuit (RF-IC), an antenna, a ground conductor, and a...
2018/0158786 RADIO FREQUENCY (RF) INDUCTIVE SIGNAL COUPLER AND METHOD THEREFOR
A reference circuit includes an integrated circuit (IC) formed on a semiconductor substrate including a first spiral inductor and a second spiral inductor. The...
2018/0158785 PACKAGING STRUCTURES FOR METALLIC BONDING BASED OPTO-ELECTRONIC DEVICE AND MANUFACTURING METHODS THEREOF
The present disclosure proposes a packaging structure for a metallic bonding based opto-electronic device and a manufacturing method thereof. According to the...
2018/0158784 FABRICATION METHOD OF ELECTRONIC PACKAGE HAVING EMBEDDED PACKAGE BLOCK
A method for fabricating an electronic package is provided, including steps of: providing a carrier having at least an electronic element and at least a...
2018/0158783 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device package includes: (1) a carrier; (2) an electronic component disposed over a top surface of the carrier; (3) a package body disposed...
2018/0158782 ELECTRONIC CIRCUIT PACKAGE HAVING HIGH COMPOSITE SHIELDING EFFECT
Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the...
2018/0158781 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes an interlayer insulating film on a substrate, the...
2018/0158780 MOLDING STRUCTURE FOR WAFER LEVEL PACKAGE
A method in which microelectronic devices are attached to a substrate surface, wherein spaces interpose neighboring ones of the microelectronic devices. Each...
2018/0158779 Semiconductor Device and Method of Forming an Integrated SIP Module with Embedded Inductor or Package
A semiconductor device has a substrate with a first opening and second opening formed in the substrate. A first semiconductor component is disposed on the...
2018/0158778 PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
Packaged semiconductor assemblies including interconnect structures and methods for forming such interconnect structures are disclosed herein. One embodiment...
2018/0158777 REDISTRIBUTION LAYER STRUCTURES FOR INTEGRATED CIRCUIT PACKAGE
An integrated circuit (IC) package with improved performance and reliability is disclosed. The IC package includes an IC die and a routing structure. The IC...
2018/0158776 Integrated Circuit Having a High Cell Density
An integrated circuit includes a cell that is between a substrate and a supply conductive line and that includes a source region, a contact conductive line, a...
2018/0158775 HIGH Q FACTOR INDUCTOR STRUCTURE
A three-dimensional (3-D) inductor is incorporated in a substrate. The 3-D inductor has a first connector plate, a second connector plate, a third connector...
2018/0158774 FABRICATION METHOD OF SEMICONDUCTOR SUBSTRATE
A method for fabricating a semiconductor substrate is disclosed, which includes: forming a first dielectric layer on a substrate body; foil ling a plurality of...
2018/0158773 SEMICONDUCTOR DEVICE INCLUDING A BIT LINE
A semiconductor device includes a substrate including a cell array region including a cell active region. An insulating pattern is on the substrate. The...
2018/0158772 CAPACITOR MOUNTING STRUCTURE
A mounting structure includes a silicon die, an interposer, a substrate, and a capacitor. The capacitor includes a multilayer body, a first outer electrode...
2018/0158771 SEMICONDUCTOR DEVICE
It is intended to reduce the price of a semiconductor device and increase the reliability thereof. In an interposer, a plurality of wiring layers are disposed...
2018/0158770 METHODS OF MAKING WIRING SUBSTRATE FOR STACKABLE SEMICONDUCTOR ASSEMBLY AND MAKING STACKABLE SEMICONDUCTOR ASSEMBLY
The wiring substrate includes a cavity and a plurality of metal leads disposed around the cavity. The metal leads are bonded with a resin compound and provide...
2018/0158769 MODIFYING EXECUTION FLOW IN SAVE-TO-RETURN CODE SCENARIOS
A computer-implemented method includes, in a code transformation system, identifying save-to-return code instructions, function call code instructions,...
2018/0158768 Semiconductor Device and Method of Forming a 3D Interposer System-In-Package Module
A semiconductor device has a first substrate. A first semiconductor component and second semiconductor component are disposed on the first substrate. In some...
2018/0158767 METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE
An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a...
2018/0158766 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor package includes: (a) providing a carrier; (b) disposing a dielectric layer and a conductive pad on the carrier; (c)...
2018/0158765 INTEGRATED CIRCUIT PACKAGE COMPRISING LEAD FRAME
An integrated circuit package comprises a lead frame including a plurality of leads and a current conductor forming an electrically conductive path that...
2018/0158764 3D CHIP ASSEMBLIES USING STACKED LEADFRAMES
A stacked-chip assembly including a plurality of IC chips or die that are stacked, and a plurality of stacked leads. Leads from separate leadframes may be...
2018/0158763 SEMICONDUCTOR DEVICE AND METERING APPARATUS
A semiconductor device includes: an oscillator; a semiconductor chip that includes an oscillation circuit connected to the oscillator, a timer circuit that...
2018/0158762 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor chip having a first surface, a first electrode and a second electrode provided on the first surface, a wiring...
2018/0158761 SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
A semiconductor device has a configuration in which a high-side module portion and a low-side module portion overlap each other. The semiconductor device...
2018/0158760 LEAD FRAME
A lead frame includes a plurality of leads formed from a metal plate having a front side and a back side, a first resin member, and a second resin member. The...
2018/0158759 CHIP PACKAGE AND A WAFER LEVEL PACKAGE
Various embodiments provide for a chip package including a carrier; a layer over the carrier; a further carrier material over the layer, the further carrier...
2018/0158758 Leadframe and method of manufacturing the same
A method of manufacturing a hybrid leadframe is provided comprising providing a thin leadframe layer comprising a diepad and a structured region and attaching...
2018/0158757 METHOD FOR ELECTRICALLY CONTACTING A COMPONENT BY GALVANIC CONNECTION OF AN OPEN-PORED CONTACT PIECE, AND...
The invention relates to a method for electrically contacting a component (10) (for example a power component and/or a (semiconductor) component having at...
2018/0158756 INTEGRATED CIRCUIT WITH INTEGRALLY FORMED MICRO-CHANNEL OSCILLATING HEAT PIPE
A miniaturized oscillating heat pipe (OHP) embedded within an integrated circuit (IC) is provided. The miniaturized oscillating heat pipe (OHP) integrally...
2018/0158755 THERMAL MITIGATION CONTROL RETAINING CLIP
A retaining clip adapted to be applied to secure and/or compress e.g., a heat sink element, to one or more assemblies of an electronic device may include a...
2018/0158754 HIGH POWER THERMALLY CONDUCTIVE RADIO FREQUENCY ABSORBERS
Radio frequency ("RF") absorbing devices used as RF termination devices or free space absorbers, for example, are formed with a planar wafer made of an...
2018/0158753 HEAT DISSIPATING STRUCTURE AND MANUFACTURE
A heat dissipating structure includes a heat source; a heat dissipating part disposed to oppose to the heat source; a concave portion formed in at least one of...
2018/0158752 SEMICONDUCTOR STORAGE DEVICES
A semiconductor storage device includes a circuit substrate. The circuit substrate includes a main body and a connection tab connected to a side of the main...
2018/0158751 SEMICONDUCTOR DEVICE PACKAGES WITH DIRECT ELECTRICAL CONNECTIONS AND RELATED METHODS
Semiconductor device packages in accordance with this disclosure may include a substrate and a stack of semiconductor dice attached to the substrate. An...
2018/0158750 CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
Provided are chip-on-film package and display device including the same. The chip-on-film package comprises: a base film; a driving chip which is disposed on a...
2018/0158749 Package Structure for Heat Dissipation
A package structure and method of manufacturing is provided, whereby heat dissipating features are provided for heat dissipation. Heat dissipating features...
2018/0158748 HEAT DISSIPATION APPARATUS FOR SEMICONDUCTOR MODULE
A heat dissipation apparatus for a semiconductor module according to an exemplary embodiment of the present invention includes: a heatsink which is provided to...
2018/0158746 CHIP PACKAGE
A chip package may include a first polymer layer and a first semiconductor chip in the first polymer layer. The first semiconductor chip may include a first...
2018/0158745 SEMICONDUCTOR DEVICE COMPRISING A DIE SEAL INCLUDING LONG VIA LINES
The patterning technique used for forming sophisticated metallization systems of semiconductor devices may be monitored and evaluated more efficiently by...
2018/0158744 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Semiconductor structures and fabrication methods thereof are provided. An exemplary semiconductor structure includes a semiconductor substrate having a device...
2018/0158743 Resin Molding and Sensor Device
A resin molding includes a semiconductor element, a circuit board, and a resin. A conductor connected to the semiconductor element is formed on the circuit...
2018/0158742 THROUGH-SILICON VIA BASED SEMICONDUCTOR PACKAGE
Provided is a semiconductor package. The semiconductor package comprises: a device substrate having a device pattern formed thereon; a cap substrate overlying...
2018/0158741 DISPLAY DEVICE
A display device includes a display area, a peripheral area, a pad portion, a bending area, a first crack detection circuit, and a first crack detection line....
2018/0158740 DISPLAY ELEMENT MANUFACTURING METHOD AND MANUFACTURING APPARATUS
The display element manufacturing apparatus has a transporting part, which transports a substrate in a first direction, a first alignment system, which detects...
2018/0158739 STACKED SHORT AND LONG CHANNEL FINFETS
An analog integrated circuit is disclosed in which short channel transistors are stacked on top of long channel transistors, vertically separated by an...
2018/0158738 SEMICONDUCTOR DEVICE STRUCTURE
A method for fabricating a semiconductor device structure is shown. A gate dielectric layer is formed on a substrate. A portion of the gate dielectric layer,...
2018/0158737 INTEGRATION METHOD FOR FINFET WITH TIGHTLY CONTROLLED MULTIPLE FIN HEIGHTS
A method including forming a fin of a nonplanar device on a substrate, the fin including a second layer between a first layer and a third layer; replacing the...
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