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Patent # Description
2018/0166318 METHOD FOR MANUFACTURE OF A SEMICONDUCTOR WAFER SUITABLE FOR THE MANUFACTURE OF AN SOI SUBSTRATE, AND SOI...
A semiconductor wafer suitable for fabricating an SOI substrate is provided by: producing a first layer of polycrystalline semiconductor on a top side of a...
2018/0166317 SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT
Semiconductor devices are described that have a metal interconnect extending vertically through a portion of the device to the back side of a semiconductor...
2018/0166315 VARIABLE ADJUSTMENT FOR PRECISE MATCHING OF MULTIPLE CHAMBER CAVITY HOUSINGS
A vertical adjustment assembly is disclosed in order to provide for matching vertical positions of two substrates within separate chambers or cavities of a...
2018/0166314 Wafer Chuck Apparatus With Contractible Sealing Devices For Securing Warped Wafers
A wafer chuck apparatus includes a chuck with a body and a vacuum line system formed within the body. The wafer chuck apparatus has sealing devices each...
2018/0166313 THERMOPLASTIC ELASTOMER (TPE) ADHESIVE CARRIER TAPE
Embodiments relate to a carrier tape that includes a first layer of thermoplastic elastomer (TPE) adhesive tape. The carrier tape may further include a second...
2018/0166312 ELECTROSTATICALLY CLAMPED EDGE RING
An edge ring for use in a plasma processing chamber with a chuck is provided. An edge ring body has a first surface to be placed over and facing the chuck,...
2018/0166311 NEW REPAIR METHOD FOR ELECTROSTATIC CHUCK
Implementations of the present disclosure relate to a method of refurbishing a sinter or plasma sprayed electrostatic chuck. Initially, a portion of a used...
2018/0166310 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a processing section that performs a batch process to a plurality of substrates. A first substrate transport...
2018/0166309 METHOD AND SYSTEM FOR MONITORING TEMPERATURE OF WAFER
A system includes a cooling device, a memory, and a processor. The cooling device is configured to detect a temperature of a wafer and to provide air to the...
2018/0166308 SEMICONDUCTOR PROCESSING BOAT DESIGN WITH PRESSURE SENSOR
Presented herein is a device processing boat comprising a base and at least one unit retainer disposed in the base. The device further comprises a cover having...
2018/0166307 INTEGRATED SUBSTRATE DEFECT DETECTION USING PRECISION COATING
Apparatuses and methods for improved substrate defect detection is provided. Substrate defects may be detected, possibly with defect detection equipment such...
2018/0166306 QUARTZ CRYSTAL MICROBALANCE UTILIZATION FOR FORELINE SOLIDS FORMATION QUANTIFICATION
Embodiments of the present disclosure generally relate to abatement for semiconductor processing equipment. More particularly, embodiments of the present...
2018/0166305 METHOD AND APPARATUS FOR WAFER BACKSIDE COOLING
A method for processing a semiconductor wafer is provided. The method includes placing a semiconductor wafer on a wafer chuck. The method further includes...
2018/0166304 ION INJECTOR AND LENS SYSTEM FOR ION BEAM MILLING
The embodiments herein relate to methods and apparatus for performing ion etching on a semiconductor substrate, as well as methods for forming such apparatus....
2018/0166303 METHOD OF SELECTIVELY ETCHING FIRST REGION MADE OF SILICON NITRIDE AGAINST SECOND REGION MADE OF SILICON OXIDE
Generation of a deposit can be suppressed and high selectivity can be acquired when etching a first region made of silicon nitride selectively against a second...
2018/0166302 METHOD OF FORMING A NITRIDE SEMICONDUCTOR SUBSTRATE
In a method of forming a nitride semiconductor substrate, a nitride semiconductor substrate may be formed on a silicon substrate. A protection layer may be...
2018/0166301 SEMICONDUCTOR MANUFACTURING SYSTEM
A system includes a protection device and a blocking device. The protection device is installed on a wall of a chamber. The protection device is configured to...
2018/0166300 POINT-OF-USE MIXING SYSTEMS AND METHODS FOR CONTROLLING TEMPERATURES OF LIQUIDS DISPENSED AT A SUBSTRATE
A liquid dispensing system for treating a substrate is provided and includes a flow controller, pressure regulator, mixing node, liquid mixer, temperature...
2018/0166299 MONOCRYSTAL AND POLYCRYSTAL TEXTURING DEVICE
A monocrystal and polycrystal texturing device includes a device body, various stations arranged in the device body, a transmission device and a control...
2018/0166298 SUBSTRATE PROCESSING APPARATUS
In a substrate processing apparatus, a mounting table and a gas supply part are provided in a processing container to face each other. The processing gas...
2018/0166297 SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The...
2018/0166296 Atomic Layer Etch Process Using Plasma In Conjunction With A Rapid Thermal Activation Process
A process for etching a film layer on a semiconductor wafer is disclosed. The process is particularly well suited to etching carbon containing layers, such as...
2018/0166295 ETCHING METHOD AND SUBSTRATE PROCESSING SYSTEM
In an etching method for removing a processing target layer formed on a substrate for manufacturing electronic devices, a first break-through process of...
2018/0166294 APPARATUS AND METHODS TO ACHIEVE UNIFORM PACKAGE THICKNESS
Embodiments herein relate to methods and apparatus to achieve substantially uniform package thickness after forming a buildup layer on a package substrate of...
2018/0166293 METHOD FOR FORMING DEEP TRENCH STRUCTURE
A method for forming a deep trench structure is provided. The method includes forming a first recess in a top portion of a substrate and forming a first...
2018/0166292 INDIUM PHOSPHIDE SMOOTHING AND CHEMICAL MECHANICAL PLANARIZATION PROCESSES
A chemical mechanical planarization for indium phosphide material is provided in which at least one opening is formed within a dielectric layer located on a...
2018/0166291 SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD THEREOF
In some embodiments of the present disclosure, a method of treating an atom on a substrate includes an operation of ionizing an etchant and the ionized etchant...
2018/0166290 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Provided is a method of manufacturing a semiconductor device with which a trench shape having vertical, flat, and smooth side wall surfaces can be formed even...
2018/0166289 SUPER HYDROPHOBIC SURFACE FABRICATION METHOD
The present invention relates to a method for producing a super-hydrophobic surface, and to a stack having a super-hydrophobic surface prepared by the above...
2018/0166288 METHODS FOR SILICIDE FORMATION
The present disclosure generally relates to methods of selectively forming titanium silicides on substrates. The methods are generally utilized in conjunction...
2018/0166287 METHOD OF FORMING SEMICONDUCTOR DEVICE USING TITANIUM-CONTAINING LAYER AND DEVICE FORMED
A method of forming a semiconductor device includes etching an inter-layer dielectric (ILD) to form a contact opening exposing a portion of a source/drain...
2018/0166286 ELECTROLYTIC PLATING APPARATUS
An electrolytic plating apparatus capable of establishing electric connection between a power supply and a substrate without physical contact is disclosed. The...
2018/0166285 METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH ETCH STOP LAYER
A method for forming a semiconductor device structure is provided. The method includes disposing a semiconductor substrate in a physical vapor deposition (PVD)...
2018/0166284 METHOD FOR MANUFACTURING BUMP STRUCTURE
The present invention relates to a method for manufacturing a bump structure capable of enhancing adhesion, comprising the steps of: forming an under bump...
2018/0166283 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
A semiconductor structure and a fabrication method are provided. The fabrication method includes providing a base substrate including a substrate and a...
2018/0166282 WAFER PROCESSING METHOD
Disclosed herein is a wafer processing method including a protective film forming step of forming a protective film with which the whole of a surface of a...
2018/0166281 DOPANT INTRODUCTION METHOD AND HEAT TREATMENT METHOD
A thin film containing a dopant is deposited on a surface of a semiconductor wafer. The semiconductor wafer on which the thin film containing the dopant is...
2018/0166280 Methods and Apparatus for Preventing Counter-Doping During High Temperature Processing
In a described example method, semiconductor wafer with a backside silicon nitride layer is encapsulated with a diffusion barrier layer prior to a high...
2018/0166279 SEMICONDUCTOR DEVICE
A semiconductor device is provided. The semiconductor device includes: a first region formed on a front surface side of a semiconductor substrate; a drift...
2018/0166278 Resist Having Tuned Interface Hardmask Layer For EUV Exposure
A method is disclosed to prepare a substrate for photolithography. The method includes forming an underlayer over a surface of the substrate; depositing an...
2018/0166277 Resist Having Tuned Interface Hardmask Layer For EUV Exposure
A method is disclosed to prepare a substrate for photolithography. The method includes forming an underlayer over a surface of the substrate; depositing an...
2018/0166276 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A method for manufacturing a semiconductor device includes forming a mask layer including a) one metal from tungsten, tantalum, zirconium, hafnium, molybdenum,...
2018/0166275 SEMICONDUCTOR TEMPLATES AND FABRICATION METHODS
A method of making a semi-polar semiconductor template comprises providing a semi-polar semiconductor wafer; etching the semiconductor wafer to form a regular...
2018/0166274 METAL GATE STRUCTURE AND MANUFACTURING METHOD THEREOF
An NMOS transistor gate structure includes at least one spacer defining a gate region over a semiconductor substrate, a gate dielectric layer disposed on the...
2018/0166273 COMPOSITION AND METHOD FOR REMOVING RESIDUE FROM CHEMICAL-MECHANICAL PLANARIZATION SUBSTRATE
Described is a post-CMP cleaning solution and methods useful to remove residue from a CMP substrate or to prevent formation of residue on a surface of a CMP...
2018/0166272 ENHANCED CHARGED PARTICLE BEAM PROCESSES FOR CARBON REMOVAL
Method and system for enhanced charged particle beam processes for carbon removal. With the method and system for enhancing carbon removal, associated method...
2018/0166271 METHOD FOR MANUFACTURING GROUP III-V NITRIDE SEMICONDUCTOR EPITAXIAL WAFER
A Ga source gas and a nitrogen source gas are supplied to form a GaN channel layer on a semiconductor substrate. Next, a temperature is lowered while supplying...
2018/0166270 METHOD OF DEPOSITING A THIN FILM
In a method of deposition a thin film, a substrate having a pattern may be provided. A surface of the substrate may be treated using a deposition-suppressing...
2018/0166269 REAL TIME MEASUREMENT TECHNIQUES COMBINING LIGHT SOURCES AND MASS SPECTROMETER
The present invention provides a mass spectrometer comprising a sample inlet, an ionization source, a mass analyzer, and an ion detector, wherein the...
2018/0166268 IONIZATION AND ION INTRODUCTION DEVICE FOR MASS SPECTROMETER
The disclosure relates to an ionization and ion introduction device for a mass spectrometer. The device includes an ionization source chamber at a pressure...
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