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Patent # Description
2018/0175100 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A method includes a first process in which a first wiring is provided on a surface of a semiconductor substrate; a second process in which a light transmitting...
2018/0175099 SOLID-STATE IMAGING DEVICE AND METHOD OF PRODUCING SOLID-STATE IMAGING DEVICE
A solid-state imaging device includes a sensor including an impurity diffusion layer provided in a surface layer of a semiconductor substrate; and an oxide...
2018/0175098 IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR
The present disclosure relates to the technical field of semiconductors, and discloses an image sensor and a manufacturing method therefor. The method...
2018/0175097 IMAGING DEVICE AND IMAGING UNIT
An imaging device having a first surface on which light is incident and a second surface on an opposite side of the first surface, includes a photoelectric...
2018/0175096 PHOTOELECTRIC CONVERSION DEVICE, PHOTOELECTRIC CONVERSION METHOD, AND IMAGE FORMING APPARATUS
A photoelectric conversion device includes a generation circuit and a controller. The generation circuit generates an image signal according to an intensity of...
2018/0175095 PHOTO DETECTOR SYSTEMS AND METHODS OF OPERATING SAME
According to embodiments of the present disclosure, a dynamic photodiode may include a substrate, a first doped region, a second doped region, a first...
2018/0175094 CMOS Image Sensor with Shared Sensing Node
A CMOS image sensor has a pixel array provided with a plurality of unit pixels arranged in a matrix shape of rows and columns. Each of the unit pixels includes...
2018/0175093 PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS
Photosensitive devices and associated methods are provided. In one aspect, for example, a photosensitive imager device can include a semiconductor substrate...
2018/0175092 CHIP PACKAGE HAVING CHIP CONNECTED TO SENSING DEVICE WITH REDISTRIBUTION LAYER IN INSULATOR LAYER
A chip package is provided. The chip package includes a sensing device. The chip package also includes a first conductive structure disposed on the sensing...
2018/0175091 IMAGE SENSOR
A substrate has a first surface and a second surface facing each other. A photoelectric conversion region includes a plurality of photoelectric conversion...
2018/0175090 NEAR INFRARED ABSORBING COMPOSITION, FILM, NEAR INFRARED CUT FILTER, AND SOLID IMAGE PICKUP ELEMENT
A near infrared absorbing composition includes: a copper compound; a radical trapping agent; and a resin which generates a radical at 180.degree. C. or higher.
2018/0175089 CAMERA MODULE AND ELECTRONIC APPARATUS
The present technology relates to a camera module and an electronic apparatus that can lower the risk of breakage. An imaging element has a light receiving...
2018/0175088 SOLID STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID STATE IMAGING DEVICE, AND IMAGING SYSTEM
A manufacturing method of a solid state imaging device according to one embodiment includes the steps of forming, on a substrate, a gate electrode of a first...
2018/0175087 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
A solid-state imaging device including an imaging area where a plurality of unit pixels are disposed to capture a color image, wherein each of the unit pixels...
2018/0175086 IMAGING DEVICE, OPERATING METHOD THEREOF, AND ELECTRONIC DEVICE
An imaging device whose dynamic range is broadened is provided. The imaging device includes a pixel including a first photoelectric conversion element and a...
2018/0175085 ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE SAME AND METHOD OF FORMING THE SAME
An elevated photosensor for image sensors and methods of forming the photosensor. The photosensor may have light sensors having indentation features including,...
2018/0175084 GERMANIUM-SILICON LIGHT SENSING APPARATUS
A method for fabricating an image sensor array having a first group of photodiodes for detecting light at visible wavelengths a second group of photodiodes for...
2018/0175083 IMAGING ELEMENT, ELECTRONIC DEVICE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
This technology relates to an imaging element and an electronic device for reducing any increase in pixel size while lessening any drop in image quality, and...
2018/0175082 IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR
The present disclosure relates to the technical field of semiconductors, and discloses an image sensor and a manufacturing method therefor. The image sensor...
2018/0175081 METHOD FOR MANUFACTURING AN ARRAY SUBSTRATE, ARRAY SUBSTRATE, GRAYSCALE MASK PLATE AND DISPLAY DEVICE
This disclosure relates to the field of display technologies, and discloses a method for manufacturing an array substrate, an array substrate, a grayscale mask...
2018/0175080 TOUCH DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
Embodiments of the present disclosure provide a touch display substrate and manufacturing method thereof. The method includes forming a touch signal line on a...
2018/0175079 THIN FILM TRANSISTOR ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THEREOF
The present application discloses a method for manufacturing a thin film transistor, including: subsequently depositing a first passivation layer, an organic...
2018/0175078 ARRAY SUBSTRATE, DISPLAY DEVICE AND MANUFACTURING METHOD FOR ARRAY SUBSTRATE
An array substrate is disclosed. The array substrate includes: a substrate adopting an organic material; an isolation layer adopting a metal material, and the...
2018/0175077 THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME
Disclosed is a thin film transistor substrate which facilitates to realize a bottom gate structure where a gate electrode is disposed below an active layer,...
2018/0175076 TRANSISTOR ARRAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
A transistor array panel according to an exemplary embodiment includes: a substrate; a first buffer layer positioned on the substrate; and a first transistor...
2018/0175075 COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor...
2018/0175074 SEMICONDUCTOR DEVICE, DISPLAY SYSTEM, AND ELECTRONIC DEVICE
A novel semiconductor device or display device is provided. A semiconductor substrate is used as a substrate of a display portion and a transistor in the...
2018/0175073 ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
An array substrate, a manufacturing method thereof and a display device are provided. The array substrate includes a display region and a GOA region. The...
2018/0175072 TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF
A transistor array panel includes a transistor which includes a gate electrode, a semiconductor layer on the gate electrode, and a source electrode and a drain...
2018/0175071 DISPLAY UNIT AND ELECTRONIC APPARATUS
A display unit of the present disclosure includes a plurality of pixel circuits each including a light-emitting element, a drive transistor that has a drain...
2018/0175070 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A semiconductor device includes a base substrate, a buried insulating film on the base substrate, a first semiconductor substrate pattern on the buried...
2018/0175069 METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERATING AN ELECTRONIC DEVICE
According to various embodiments, an electronic device may include a carrier including at least a first region and a second region being laterally adjacent to...
2018/0175068 SEMICONDUCTOR STRUCTURE
Semiconductor structures are provided. A semiconductor structure includes a bottom substrate having a first region and a second region; an insulation layer...
2018/0175067 SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating...
2018/0175066 ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE
An array substrate comprising: a plurality of scanning lines (G) arranged in a first direction; a plurality of data lines (S) arranged in a second direction,...
2018/0175065 Electrical Connection Structure, Array Substrate and Display Device
An electrical connection structure, an array substrate and a display device. The electrical connection structure includes a first electrical connection...
2018/0175064 WAFERS AND DEVICE STRUCTURES WITH BODY CONTACTS
Wafers for fabrication of devices that include a body contact, device structures with a body contact, methods for forming a wafer that supports the fabrication...
2018/0175063 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
The present disclosure relates to a semiconductor device. The semiconductor device includes a semiconductor on an insulator (SOI) substrate having a bottom...
2018/0175062 SEMICONDUCTOR DEVICE
A semiconductor device (1) is manufactured which includes a SiC epitaxial layer (28), a plurality of transistor cells (18) that are formed in the SiC epitaxial...
2018/0175061 Semiconductor Chip Including Integrated Circuit Having Cross-Coupled Transistor Configuration and Method for...
A first conductive structure forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A...
2018/0175060 STANDARD CELL CIRCUITS EMPLOYING VOLTAGE RAILS ELECTRICALLY COUPLED TO METAL SHUNTS FOR REDUCING OR AVOIDING...
Standard cell circuits employing voltage rails electrically coupled to metal shunts for reducing or avoiding increases in voltage drop are disclosed. In one...
2018/0175059 Stack Of Horizontally Extending And Vertically Overlapping Features, Methods Of Forming Circuitry Components,...
A method of forming circuitry components includes forming a stack of horizontally extending and vertically overlapping features. The stack has a primary...
2018/0175058 METHOD OF CONTROLLING A SEMICONDUCTOR MEMORY DEVICE
According to an embodiment, a semiconductor memory device comprises: a semiconductor substrate; a memory cell array configured having a plurality of memory...
2018/0175057 NON-VOLATILE STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
According to an embodiment, a non-volatile storage device includes a first layer, a second layer formed on the first layer, a stacked body including a...
2018/0175056 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
According to one embodiment, a semiconductor device includes a substrate; a stacked body provided on the substrate, the stacked body including a plurality of...
2018/0175055 SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device includes a conducting layer and an insulating layer that are disposed above a semiconductor substrate, a plurality of pillars...
2018/0175054 NON-VOLATILE MEMORY WITH REDUCED VARIATIONS IN GATE RESISTANCE
A three-dimensional non-volatile memory comprises a plurality of word line layers arranged alternatingly with a plurality of dielectric layers in a stack over...
2018/0175053 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Provided herein may be a semiconductor device and a method of manufacturing the same. The method of manufacturing the semiconductor device may include forming...
2018/0175052 NON-VOLATILE MEMORY DEVICE
A non-volatile memory device includes channel hole structures, bit lines, and intermediate wiring. The channel hole structures are arranged in a ...
2018/0175051 THREE DIMENSIONAL MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
A 3D memory device includes a substrate, a ridge-shaped stack, a memory layer, a channel layer and a capping layer. The ridge-shaped stack includes a plurality...
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