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| Patent # | Description |
|---|---|
| 2018/0175100 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD A method includes a first process in which a first wiring is provided on a surface of a semiconductor substrate; a second process in which a light transmitting... |
| 2018/0175099 |
SOLID-STATE IMAGING DEVICE AND METHOD OF PRODUCING SOLID-STATE IMAGING
DEVICE A solid-state imaging device includes a sensor including an impurity diffusion layer provided in a surface layer of a semiconductor substrate; and an oxide... |
| 2018/0175098 |
IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR The present disclosure relates to the technical field of semiconductors, and discloses an image sensor and a manufacturing method therefor. The method... |
| 2018/0175097 |
IMAGING DEVICE AND IMAGING UNIT An imaging device having a first surface on which light is incident and a second surface on an opposite side of the first surface, includes a photoelectric... |
| 2018/0175096 |
PHOTOELECTRIC CONVERSION DEVICE, PHOTOELECTRIC CONVERSION METHOD, AND
IMAGE FORMING APPARATUS A photoelectric conversion device includes a generation circuit and a controller. The generation circuit generates an image signal according to an intensity of... |
| 2018/0175095 |
PHOTO DETECTOR SYSTEMS AND METHODS OF OPERATING SAME According to embodiments of the present disclosure, a dynamic photodiode may include a substrate, a first doped region, a second doped region, a first... |
| 2018/0175094 |
CMOS Image Sensor with Shared Sensing Node A CMOS image sensor has a pixel array provided with a plurality of unit pixels arranged in a matrix shape of rows and columns. Each of the unit pixels includes... |
| 2018/0175093 |
PHOTOSENSITIVE IMAGING DEVICES AND ASSOCIATED METHODS Photosensitive devices and associated methods are provided. In one aspect, for example, a photosensitive imager device can include a semiconductor substrate... |
| 2018/0175092 |
CHIP PACKAGE HAVING CHIP CONNECTED TO SENSING DEVICE WITH REDISTRIBUTION
LAYER IN INSULATOR LAYER A chip package is provided. The chip package includes a sensing device. The chip package also includes a first conductive structure disposed on the sensing... |
| 2018/0175091 |
IMAGE SENSOR A substrate has a first surface and a second surface facing each other. A photoelectric conversion region includes a plurality of photoelectric conversion... |
| 2018/0175090 |
NEAR INFRARED ABSORBING COMPOSITION, FILM, NEAR INFRARED CUT FILTER, AND
SOLID IMAGE PICKUP ELEMENT A near infrared absorbing composition includes: a copper compound; a radical trapping agent; and a resin which generates a radical at 180.degree. C. or higher. |
| 2018/0175089 |
CAMERA MODULE AND ELECTRONIC APPARATUS The present technology relates to a camera module and an electronic apparatus that can lower the risk of breakage. An imaging element has a light receiving... |
| 2018/0175088 |
SOLID STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID STATE IMAGING
DEVICE, AND IMAGING SYSTEM A manufacturing method of a solid state imaging device according to one embodiment includes the steps of forming, on a substrate, a gate electrode of a first... |
| 2018/0175087 |
SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING
DEVICE, AND ELECTRONIC APPARATUS A solid-state imaging device including an imaging area where a plurality of unit pixels are disposed to capture a color image, wherein each of the unit pixels... |
| 2018/0175086 |
IMAGING DEVICE, OPERATING METHOD THEREOF, AND ELECTRONIC DEVICE An imaging device whose dynamic range is broadened is provided. The imaging device includes a pixel including a first photoelectric conversion element and a... |
| 2018/0175085 |
ELEVATED POCKET PIXELS, IMAGING DEVICES AND SYSTEMS INCLUDING THE SAME AND
METHOD OF FORMING THE SAME An elevated photosensor for image sensors and methods of forming the photosensor. The photosensor may have light sensors having indentation features including,... |
| 2018/0175084 |
GERMANIUM-SILICON LIGHT SENSING APPARATUS A method for fabricating an image sensor array having a first group of photodiodes for detecting light at visible wavelengths a second group of photodiodes for... |
| 2018/0175083 |
IMAGING ELEMENT, ELECTRONIC DEVICE, MANUFACTURING APPARATUS, AND
MANUFACTURING METHOD This technology relates to an imaging element and an electronic device for reducing any increase in pixel size while lessening any drop in image quality, and... |
| 2018/0175082 |
IMAGE SENSOR AND MANUFACTURING METHOD THEREFOR The present disclosure relates to the technical field of semiconductors, and discloses an image sensor and a manufacturing method therefor. The image sensor... |
| 2018/0175081 |
METHOD FOR MANUFACTURING AN ARRAY SUBSTRATE, ARRAY SUBSTRATE, GRAYSCALE
MASK PLATE AND DISPLAY DEVICE This disclosure relates to the field of display technologies, and discloses a method for manufacturing an array substrate, an array substrate, a grayscale mask... |
| 2018/0175080 |
TOUCH DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREOF Embodiments of the present disclosure provide a touch display substrate and manufacturing method thereof. The method includes forming a touch signal line on a... |
| 2018/0175079 |
THIN FILM TRANSISTOR ARRAY SUBSTRATE AND METHOD OF MANUFACTURING THEREOF The present application discloses a method for manufacturing a thin film transistor, including: subsequently depositing a first passivation layer, an organic... |
| 2018/0175078 |
ARRAY SUBSTRATE, DISPLAY DEVICE AND MANUFACTURING METHOD FOR ARRAY
SUBSTRATE An array substrate is disclosed. The array substrate includes: a substrate adopting an organic material; an isolation layer adopting a metal material, and the... |
| 2018/0175077 |
THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME Disclosed is a thin film transistor substrate which facilitates to realize a bottom gate structure where a gate electrode is disposed below an active layer,... |
| 2018/0175076 |
TRANSISTOR ARRAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME A transistor array panel according to an exemplary embodiment includes: a substrate; a first buffer layer positioned on the substrate; and a first transistor... |
| 2018/0175075 |
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor... |
| 2018/0175074 |
SEMICONDUCTOR DEVICE, DISPLAY SYSTEM, AND ELECTRONIC DEVICE A novel semiconductor device or display device is provided. A semiconductor substrate is used as a substrate of a display portion and a transistor in the... |
| 2018/0175073 |
ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE An array substrate, a manufacturing method thereof and a display device are provided. The array substrate includes a display region and a GOA region. The... |
| 2018/0175072 |
TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF A transistor array panel includes a transistor which includes a gate electrode, a semiconductor layer on the gate electrode, and a source electrode and a drain... |
| 2018/0175071 |
DISPLAY UNIT AND ELECTRONIC APPARATUS A display unit of the present disclosure includes a plurality of pixel circuits each including a light-emitting element, a drive transistor that has a drain... |
| 2018/0175070 |
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME A semiconductor device includes a base substrate, a buried insulating film on the base substrate, a first semiconductor substrate pattern on the buried... |
| 2018/0175069 |
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE AND METHOD FOR OPERATING AN
ELECTRONIC DEVICE According to various embodiments, an electronic device may include a carrier including at least a first region and a second region being laterally adjacent to... |
| 2018/0175068 |
SEMICONDUCTOR STRUCTURE Semiconductor structures are provided. A semiconductor structure includes a bottom substrate having a first region and a second region; an insulation layer... |
| 2018/0175067 |
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME A semiconductor device manufacturing technique which allows reduction of semiconductor chip size. First, a pad and other wires are formed over an insulating... |
| 2018/0175066 |
ARRAY SUBSTRATE, DISPLAY PANEL, AND DISPLAY DEVICE An array substrate comprising: a plurality of scanning lines (G) arranged in a first direction; a plurality of data lines (S) arranged in a second direction,... |
| 2018/0175065 |
Electrical Connection Structure, Array Substrate and Display Device An electrical connection structure, an array substrate and a display device. The electrical connection structure includes a first electrical connection... |
| 2018/0175064 |
WAFERS AND DEVICE STRUCTURES WITH BODY CONTACTS Wafers for fabrication of devices that include a body contact, device structures with a body contact, methods for forming a wafer that supports the fabrication... |
| 2018/0175063 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME The present disclosure relates to a semiconductor device. The semiconductor device includes a semiconductor on an insulator (SOI) substrate having a bottom... |
| 2018/0175062 |
SEMICONDUCTOR DEVICE A semiconductor device (1) is manufactured which includes a SiC epitaxial layer (28), a plurality of transistor cells (18) that are formed in the SiC epitaxial... |
| 2018/0175061 |
Semiconductor Chip Including Integrated Circuit Having Cross-Coupled
Transistor Configuration and Method for... A first conductive structure forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A... |
| 2018/0175060 |
STANDARD CELL CIRCUITS EMPLOYING VOLTAGE RAILS ELECTRICALLY COUPLED TO
METAL SHUNTS FOR REDUCING OR AVOIDING... Standard cell circuits employing voltage rails electrically coupled to metal shunts for reducing or avoiding increases in voltage drop are disclosed. In one... |
| 2018/0175059 |
Stack Of Horizontally Extending And Vertically Overlapping Features,
Methods Of Forming Circuitry Components,... A method of forming circuitry components includes forming a stack of horizontally extending and vertically overlapping features. The stack has a primary... |
| 2018/0175058 |
METHOD OF CONTROLLING A SEMICONDUCTOR MEMORY DEVICE According to an embodiment, a semiconductor memory device comprises: a semiconductor substrate; a memory cell array configured having a plurality of memory... |
| 2018/0175057 |
NON-VOLATILE STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME According to an embodiment, a non-volatile storage device includes a first layer, a second layer formed on the first layer, a stacked body including a... |
| 2018/0175056 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME According to one embodiment, a semiconductor device includes a substrate; a stacked body provided on the substrate, the stacked body including a plurality of... |
| 2018/0175055 |
SEMICONDUCTOR MEMORY DEVICE A semiconductor memory device includes a conducting layer and an insulating layer that are disposed above a semiconductor substrate, a plurality of pillars... |
| 2018/0175054 |
NON-VOLATILE MEMORY WITH REDUCED VARIATIONS IN GATE RESISTANCE A three-dimensional non-volatile memory comprises a plurality of word line layers arranged alternatingly with a plurality of dielectric layers in a stack over... |
| 2018/0175053 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Provided herein may be a semiconductor device and a method of manufacturing the same. The method of manufacturing the semiconductor device may include forming... |
| 2018/0175052 |
NON-VOLATILE MEMORY DEVICE A non-volatile memory device includes channel hole structures, bit lines, and intermediate wiring. The channel hole structures are arranged in a ... |
| 2018/0175051 |
THREE DIMENSIONAL MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME A 3D memory device includes a substrate, a ridge-shaped stack, a memory layer, a channel layer and a capping layer. The ridge-shaped stack includes a plurality... |
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