Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2018/0182699 POST-GRIND DIE BACKSIDE POWER DELIVERY
Disclosed is a die. The die may include a material layer, a plurality of vias, and a plurality of metal channels. The material layer may have a top side and a...
2018/0182698 SEMICONDUCTOR DEVICE AND METHOD OF FORMING CANTILEVERED PROTRUSION ON A SEMICONDUCTOR DIE
A semiconductor device has a first semiconductor die with a base material. A covering layer is formed over a surface of the base material. The covering layer...
2018/0182697 FORMING A STRESS COMPENSATION LAYER AND STRUCTURES FORMED THEREBY
Methods of forming a microelectronic structure are described. Those methods comprise forming a stress compensation layer on a substrate, forming at least one...
2018/0182696 HIGH DENSITY PACKAGE INTERCONNECTS
Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die...
2018/0182695 PACKAGE FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
A package for a semiconductor device includes: a plate-shaped base member having a substantially rectangular shape in a plan view; a first and second electrode...
2018/0182694 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
A semiconductor device includes: a frame; a first-external-terminal provided to a first side portion of the frame; a first substrate enclosed in the frame and...
2018/0182693 Packaged Semiconductor Device Having Nanoparticle Adhesion Layer Patterned Into Zones of Electrical Conductance...
A device comprises a substrate and an adhesive nanoparticle layer patterned into zones of electrical conductance and insulation on top of the substrate...
2018/0182692 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
An improvement is achieved in the reliability of a semiconductor device. A SIP includes an analog chip, a microcomputer chip having a main surface smaller in...
2018/0182690 PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
A packaging structure and a method for fabricating the packaging structure are provided. The packaging structure includes a base substrate including a solder...
2018/0182689 SEMICONDUCTOR ARRAY AND PRODUCTION METHOD FOR MICRO DEVICE
There are provided a semiconductor array and a method for producing a micro device, in which the semiconductor laminate used in the micro device can be readily...
2018/0182688 POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRICATION METHOD OF THE POWER MODULE...
The power module semiconductor device (2) includes: an insulating substrate (10); a first pattern (10a) (D) disposed on the insulating substrate (10); a...
2018/0182687 PHASE CHANGING ON-CHIP THERMAL HEAT SINK
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the...
2018/0182686 COUNTER-FLOW EXPANDING CHANNELS FOR ENHANCED TWO-PHASE HEAT REMOVAL
A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding...
2018/0182685 DEVICES FOR ABSORBING ENERGY FROM ELECTRONIC COMPONENTS
A device for absorbing energy from an electronic component includes a low melting alloy layer including a first side and a second side opposing the first side,...
2018/0182684 ELECTRONIC DEVICE AND JOINED MEMBER
To cooled down a circuit to an appropriate temperature. An electronic device is provided with a low-temperature-side deformation member, and a ...
2018/0182683 PROCESS FOR THE WAFER-SCALE FABRICATION OF HERMETIC ELECTRONIC MODULES
An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical...
2018/0182682 SEMICONDUCTOR DEVICE PACKAGE WITH STRESS RELIEF LAYER
A semiconductor device package includes an encapsulation layer, a die, a stress relief layer, and a redistribution layer. The encapsulation layer has an...
2018/0182681 RESIN SUBSTRATE, COMPONENT-MOUNTING RESIN SUBSTRATE, AND METHOD OF MANUFACTURING COMPONENT-MOUNTING RESIN SUBSTRATE
A component-mounting resin substrate includes a resin substrate and a component. The resin substrate includes a thermoplastic resin body. The component is...
2018/0182680 RESIN CIRCUIT BOARD AND RESIN CIRCUIT BOARD HAVING COMPONENT MOUNTED THEREON
A resin circuit board includes a multilayer body, mounting land conductors, and second components. The multilayer body includes thermoplastic resin layers...
2018/0182679 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes: a base plate; an insulating substrate provided on an upper surface of the base plate; a conductive pattern provided on an...
2018/0182678 CASE, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF CASE
A case and a semiconductor device including the case are provided for solving the following issues: when fixing a lid body to a case body by an adhesive, a...
2018/0182677 TEST STRUCTURE FOR TESTING VIA RESISTANCE AND METHOD
Aspects of the present disclosure include a semiconductor test device and method. The test device includes a first Kelvin testable structure and a second...
2018/0182676 Defect Analysis
A system for analyzing defects comprises determining coordinates of a defect using a wafer inspection tool; identifying a structure of interest near the defect...
2018/0182675 INTEGRATED CIRCUIT STRUCTURE INCLUDING POWER RAIL AND TAPPING WIRE WITH METHOD OF FORMING SAME
The disclosure relates to integrated circuit (IC) structures with substantially T-shaped wires, and methods of forming the same. An IC structure according to...
2018/0182674 METHOD, APPARATUS, AND SYSTEM FOR USING A COVER MASK FOR ENABLING METAL LINE JUMPING OVER MOL FEATURES IN A...
At least one method, apparatus and system disclosed involves providing an integrated circuit having metal feature flyover over an middle-of-line (MOL) feature....
2018/0182673 Semiconductor Device and Manufacturing Method Thereof
A semiconductor device includes a substrate, a first insulating structure, a second insulating structure, at least one first active semiconductor fin, and at...
2018/0182672 IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
A support structure for use in fan-out wafer level packaging is provided that includes, a silicon handler wafer having a first surface and a second surface...
2018/0182671 CRACK PREVENT AND STOP FOR THIN GLASS SUBSTRATES
A method of forming a 3D crack-stop structure in, through, and wrapped around the edges of a substrate to prevent through-substrate cracks from propagating and...
2018/0182670 SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND EQUIPMENT
A semiconductor apparatus includes a semiconductor substrate having an upper surface on which a semiconductor element is disposed, a lower surface opposite to...
2018/0182669 METHOD OF FILLING A VIA HOLE AND APPARATUS FOR PERFORMING THE SAME
A method of filling a via hole and an apparatus for performing the same are disclosed. The method includes providing a filling material having a fluidity on a...
2018/0182668 MIDDLE OF THE LINE (MOL) CONTACTS WITH TWO-DIMENSIONAL SELF-ALIGNMENT
Disclosed are methods of forming an integrated circuit (IC) structure with self-aligned middle of the line (MOL) contacts and the resulting IC structure. In...
2018/0182667 ARRAY SUBSTRATE, DISPLAY DEVICE, AND FAULT REPAIR METHOD FOR ARRAY SUBSTRATE
The present disclosure discloses an array substrate, a display device and a fault repair method for an array substrate, and belongs to the field of display...
2018/0182666 Microelectronic assembly from processed substrate
Representative implementations of techniques, methods, and formulary provide repairs to processed semiconductor substrates, and associated devices, due to...
2018/0182665 Processed Substrate
Representative implementations of techniques, methods, and formulary provide repairs to processed semiconductor substrates, and associated devices, due to...
2018/0182664 SYSTEMS AND METHODS FOR WETTING SUBSTRATES
Methods of wetting a semiconductor substrate may include forming a controlled atmosphere in a processing chamber housing the semiconductor substrate. The...
2018/0182663 SEMICONDUCTOR CHIP, SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER
The present disclosure relates to the technical field of semiconductors, and in particular to a semiconductor chip, a semiconductor wafer and a method for...
2018/0182662 METHOD FOR PREPARING SUBSTRATE WITH CARRIER TRAPPING CENTER
The present disclosure provides a method for preparing a substrate with a carrier trapping center. The method includes: injecting bubbling ions into the...
2018/0182661 METHOD FOR TRANSFERRING MONOCRYSTALLINE PADS
A method of transferring blocks of semiconductor material to a substrate comprises the following steps: a. providing an intermediate substrate, the...
2018/0182660 SUBSTRATE TRANSFER MECHANISMS
In one embodiment, a substrate support assembly includes a susceptor for supporting a substrate, and a supporting transfer mechanism coupled to the susceptor,...
2018/0182659 SUBSTRATE ATTACHMENT/DETACHMENT DEVICE, PLATING DEVICE, CONTROL DEVICE FOR A SUBSTRATE ATTACHMENT/DETACHMENT...
A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device...
2018/0182658 HORIZONTAL ARTICULATED ROBOT
A horizontal articulated robot includes: a first link; a second link whose proximal end portion is coupled to one of an upper side and a lower side of a distal...
2018/0182657 Wafer pin chuck fabrication and repair
In a wafer chuck design featuring pins or "mesas" making up the support surface, engineering the pins to have an annular shape, or to contain holes or pits,...
2018/0182656 MEASUREMENT METHOD, METHOD OF REMOVING STATIC ELECTRICITY, AND PLASMA PROCESSING APPARATUS
A measurement method includes vibrating a wafer through up-and-down movement of one or more pins supporting the wafer after performing processing with...
2018/0182655 SUBSTRATE STORING CONTAINER
The plurality of protective grooves 225 has openings 2231 wider than thicknesses of the edge portions of the substrates W to allow the edge portions of the...
2018/0182654 Die tray with channels
Representative implementations of devices and techniques provide a device and a technique for processing integrated circuit (IC) dies. The device comprises a...
2018/0182653 ELECTRONIC SYSTEM FOR TESTING AND CONTROLLING SEMICONDUCTOR MANUFACTURING EQUIPMENT
An electronic system includes a memory and a processor. The memory stores first setting data of a manufacturing process condition of semiconductor ...
2018/0182652 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING SYSTEM
A substrate processing apparatus includes a base member having an opening, a substrate holding member fixedly provided on the base member and configured to...
2018/0182651 Common procedure of interconnecting electronic chip with connector body and forming the connector body
A method which comprises applying a common pressing force operative to interconnect an electronic chip with a connector body by an interconnect structure, and...
2018/0182650 BUMPED ELECTRODE ARRAYS FOR MICROASSEMBLERS
An apparatus including a bumped electrode array and a method of fabricating a bumped electrode array is disclosed. The method includes providing a substrate...
2018/0182649 SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING SYSTEM
A substrate processing device includes a substrate holding table, an ultraviolet irradiator, a tubular member, a first gas supplying unit, and a second gas...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.