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Patent # Description
2018/0190901 STRUCTURE AND METHOD TO REDUCE SHORTING AND PROCESS DEGRADATION IN STT-MRAM DEVICES
A method of making a magnetic random access memory device includes forming a magnetic tunnel junction (MTJ) on an electrode, the MTJ including a reference...
2018/0190900 STRUCTURE AND METHOD TO REDUCE SHORTING AND PROCESS DEGRADATION IN STT-MRAM DEVICES
A method of making a magnetic random access memory device includes forming a magnetic tunnel junction (MTJ) on an electrode, the MTJ including a reference...
2018/0190899 MAGNETIC TUNNEL JUNCTION DEVICE WITH SPIN-FILTER STRUCTURE
A magnetic device includes a conductive layer into which current can be injected in a first direction, the conductive layer causing spin Hall effect or Rashba...
2018/0190898 METHOD AND SYSTEM FOR PROVIDING A DUAL MAGNETIC JUNCTION HAVING MITIGATED FLOWERING FIELD EFFECTS
A magnetic junction and method for providing the magnetic junction are described. The magnetic junction includes a free layer, first and second reference...
2018/0190897 MECHANICALLY STRENGTHENED PIEZOELECTRIC SENSOR FOR STRUCTURAL HEALTH MONITORING
The present invention discloses a mechanically strengthened piezoelectric sensor for Structural Health Monitoring applications. The sensor includes a two-sided...
2018/0190896 Ultrasonic Transmitter and Receiver
An ultrasonic transmitter and ultrasonic receiver include a piezoelectric layer and at least one conductive layer comprising metal nanoparticles. The metal...
2018/0190895 PIEZOELECTRIC MICRO-ELECTRO-MECHANICAL ACTUATOR DEVICE, MOVABLE IN THE PLANE
A MEMS actuator device of a piezoelectric type formed on a substrate, with a base unit including a base beam element having a main extension in a extension...
2018/0190894 Thermoelectric Conversion Element and Method of Manufacturing the Same, and Heat Radiation Fin
A thermoelectric conversion element includes: a magnetic body having a magnetization; and an electromotive body formed of material exhibiting a spin orbit...
2018/0190893 Thermoelectric Module
Provided is a thermoelectric module including electrodes and P-type and N-type semiconductors formed on a substrate by a printing method. The thermoelectric...
2018/0190892 THERMOELECTRIC CONVERSION MODULE, METHOD OF MANUFACTURING THERMOELECTRIC CONVERSION MODULE, AND THERMALLY...
The present invention addresses the problem of providing a thermoelectric conversion module which can be manufactured by a so-called roll-to-roll process with...
2018/0190891 THERMOELECTRIC MATERIAL, THERMOELECTRIC ELEMENT, OPTICAL SENSOR, AND METHOD FOR MANUFACTURING THERMOELECTRIC...
This invention relates to a thermoelectric material constituted of nanostructures and a thermoelectric element and an optical sensor including the same, as...
2018/0190890 SILICONE-ORGANIC RESIN COMPOSITE LAMINATE AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING SEMICONDUCTOR...
The invention provides a silicone-organic resin composite laminate comprising a laminate in which an organic resin layer containing an inorganic fiber cloth...
2018/0190889 LED PACKAGE USING ELECTOFORM STENCIL PRINTING
A method for manufacturing light emitting devices, comprising: providing a package body including: (i) a reflector cup defining a cavity and (ii) a plurality...
2018/0190888 LIGHT-EMITTING ELEMENT PACKAGE AND LIGHT-EMITTING ELEMENT MODULE COMPRISING SAME
Provided is a light-emitting element package, one embodiment comprising: a substrate; a light-emitting element disposed on the substrate; and a molded part...
2018/0190887 LIGHT EMITTING DEVICE STRUCTURE
A light emitting device structure includes a light emitting device, a molding compound, a transparent substrate and a reflective layer. The light emitting...
2018/0190886 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
A light emitting device includes a light emitting element having a first face positioned on an emission face side of the light emitting device, a second face...
2018/0190885 LED PACKAGE STRUCTURE AND CHIP-SCALE LIGHT EMITTING UNIT
The present disclosure discloses an LED package structure and a chip-scale light emitting unit. The chip-scale light emitting unit includes an LED chip, a...
2018/0190884 LED PACKAGE STRUCTURE
An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip...
2018/0190883 PHOTON EXTRACTION FROM ULTRAVIOLET LIGHT-EMITTING DEVICES
In various embodiments, a layer of organic encapsulant is provided over a surface of an ultraviolet (UV) light-emitting semiconductor die, and at least a...
2018/0190882 FLIP CHIP LIGHT EMITTING DIODE PACKAGE STRUCTURE
A flip chip light emitting diode package structure includes a package carrier, a light guiding unit and at least one light emitting unit. The light guiding...
2018/0190881 PHOSPHOR PLATE ASSEMBLY, LED PACKAGE STRUCTURE, AND METHOD FOR MANUFACTURING LED PACKAGE STRUCTURE
An LED package structure includes a substrate, an electrode layer and an insulating layer disposed on the substrate with a coplanar arrangement, an LED chip...
2018/0190880 PHOSPHOR DEPOSITION SYSTEM FOR LEDS
A method to produce a light-emitting device package includes mounting junctions on pads of a metalized substrate, where the junctions are at least partially...
2018/0190879 PHOSPHOR AND LIGHT EMITTING DEVICE AND BACKLIGHT MODULE INCLUDING THE SAME
A phosphor includes a europium-doped nitride phosphor powder and a manganese-doped fluoride phosphor powder. The weight ratio of the europium-doped nitride...
2018/0190878 DISPLAY DEVICE
A display device including a backplane, a plurality of light-emitting devices, a first distributed Bragg reflector layer and a second distributed Bragg...
2018/0190877 Nitride Semiconductor Wafer, Manufacturing Method Thereof, Nitride Semiconductor Ultraviolet Light-Emitting...
To prevent degradation of electrical characteristics caused by a resin filled between electrodes in an ultraviolet light-emitting operation, there is provided...
2018/0190876 DISPLAY DEVICES AND METHODS FOR FORMING DISPLAY DEVICES
A display device is provided. The display device includes a thin-film transistor substrate, a conductive pad disposed on the thin-film transistor substrate,...
2018/0190875 MULTISTEP DEPOSITION OF ZINC OXIDE ON GALLIUM NITRIDE
A method for fabricating a Zinc Oxide (ZnO) conductive film on a semiconductor material, including depositing a doped ZnO seed layer on a diode, wherein the...
2018/0190874 Method for Producing an Optoelectronic Semiconductor Device and Optoelectronic Semiconductor Device
A method for producing an optoelectronic semiconductor device and an optoelectronic semiconductor device are disclosed. In an embodiment the method includes...
2018/0190873 SOLID STATE TRANSDUCER DIES HAVING REFLECTIVE FEATURES OVER CONTACTS AND ASSOCIATED SYSTEMS AND METHODS
Systems and methods for improved light emitting efficiency of a solid state transducer (SST), for example light emitting diodes (LED), are disclosed. One...
2018/0190872 ELECTRODE AND PHOTOELECTRIC SEMICONDUCTOR DEVICE USING THE SAME
An electrode and a photoelectric semiconductor device using the same are provided. The electrode includes a pad layer, a barrier layer and a reflection layer,...
2018/0190871 LIGHT-EMITTING ELEMENT COMPRISING A PLURALITY OF WAVELENGTH CONVERTERS, AND PRODUCTION METHOD THEREFOR
Disclosed are a light-emitting element and a production method therefor. In one aspect, a light-emitting element is provided to comprise a light-emitting...
2018/0190870 LIGHT-EMITTING DEVICE
A light-emitting device according to the present invention comprises: a light-emitting structure comprising a first conductive semiconductor layer, an active...
2018/0190869 LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE
A light emitting device disclosed in an embodiment includes: a light emitting chip including a plurality of semiconductor layers and first and second...
2018/0190868 LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE (As Amended)
A light emitting device disclosed in an embodiment includes: a light emitting chip including a light emitting part, including a plurality of semiconductor...
2018/0190867 LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE PACKAGE INCLUDING THE SAME
A light-emitting device according to an embodiment of the present invention includes a substrate; a light-emitting structure provided on the substrate, and...
2018/0190866 SEMICONDUCTOR OPTICAL DEVICE
A semiconductor optical device has a multilayer structure 30 including a first compound semiconductor layer 31, an active layer 33, and a second compound...
2018/0190865 COMPACT LOW POWER HEAD-MOUNTED DISPLAY
A display panel is described which includes Light Emitting Diodes (LEDs) that exhibit a specified beam angle. The display panel can be used for a head-mounted...
2018/0190864 LIGHT EMITTING DIODE
A light emitting diode is provided to comprises: a substrate that has an elongated rectangular shape in one direction; a light emitting structure positioned on...
2018/0190863 SEMICONDUCTOR LIGHT-EMITTING DEVICE
A semiconductor light-emitting device includes a first conductive semiconductor layer on a substrate, a superlattice layer including a plurality of first...
2018/0190862 SOLID STATE LIGHTING DEVICES WITH DIELECTRIC INSULATION AND METHODS OF MANUFACTURING
Solid state lighting devices and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state lighting device includes a first...
2018/0190861 LIGHT EMITTING ELEMENT AND LIGHT EMITTING DEVICE INCLUDING THE SAME
Disclosed are a light emitting element, which may reduce power consumption, and a light emitting device including the same. The light emitting element includes...
2018/0190860 SYSTEM AND METHOD FOR CLEAVING PHOTOVOLTAIC STRUCTURES
A cleaving apparatus for cleaving a photovoltaic structure into multiple strips is described. The apparatus can include a supporting post and a cleaving...
2018/0190859 METAL OXIDE FILM FORMATION METHOD
Disclosed herein in a method of forming a metal oxide film, which can provide a high-quality metal oxide film while enhancing production efficiency. The method...
2018/0190858 PACKAGE STRUCTURE OF LONG-DISTANCE SENSOR AND PACKAGING METHOD OF THE SAME
A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate...
2018/0190857 PACKAGING METHOD OF LONG-DISTANCE SENSOR
A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, and a cap. The substrate...
2018/0190856 PACKAGE STRUCTURE OF LONG-DISTANCE SENSOR AND PACKAGING METHOD OF THE SAME
A package structure of a long-distance sensor includes a substrate, a light-emitting chip, a sensing chip, two packaging gel bodies, a cap, and two sheltering...
2018/0190855 OPTICAL ISOLATION SYSTEMS AND CIRCUITS AND PHOTON DETECTORS WITH EXTENDED LATERAL P-N JUNCTIONS
Disclosed examples include lateral photovoltaic sensors and systems with one or more semiconductor structures individually including a lateral sensor face to...
2018/0190854 DEVICE FOR EMITTING AND DETECTING PHOTONS AND METHOD OF PRODUCING THE SAME
A single device for emitting and detecting photons. The device comprises a semiconductive layer (3), active material (5), further dielectric layer (17) and...
2018/0190852 MULTIJUNCTION METAMORPHIC SOLAR CELL FOR SPACE APPLICATIONS
A multijunction solar cell assembly and its method of manufacture including first and second discrete semiconductor body subassemblies, each semiconductor body...
2018/0190851 GROUP-IV SOLAR CELL STRUCTURE USING GROUP-IV or III-V HETEROSTRUCTURES
Device structures, apparatuses, and methods are disclosed for photovoltaic cells that may be a single-junction or multijunction solar cells, with at least a...
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