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Patent # Description
2018/0190598 DISPLAY APPARATUS AND FABRICATING METHOD THEREOF
The present application discloses a display apparatus having a driver integrated circuit (IC) bonding area for bonding a plurality of signal lines with a...
2018/0190597 GUARD RING STRUCTURE AND METHOD FOR FORMING THE SAME
A method for forming a seal ring structure provides a semiconductor substrate having a first doping region formed over a top portion thereof. The method forms...
2018/0190596 STANDOFF MEMBERS FOR SEMICONDUCTOR PACKAGE
Semiconductor packages having support members are provided. Support members can mitigate damage to a semiconductor die mounted on a semiconductor package. In...
2018/0190595 RADIO REQUENCY MODULE AND METHOD FOR MANUFATURING THE SAME
A radio frequency module includes a wiring substrate, a plurality of components mounted on an upper surface of the wiring substrate, a sealing resin layer...
2018/0190594 MANUFACTURING METHOD OF PACKAGE STRUCTURE
A manufacturing method of a packaging structure is provided. First, a carrier is provided. A conductive layer is formed on the carrier. A conductive frame is...
2018/0190593 CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding...
2018/0190592 STRUCTURE AND METHOD TO REDUCE COPPER LOSS DURING METAL CAP FORMATION
A copper or copper alloy is formed in a reflow enhancement layer lined opening present in an interconnect dielectric material layer. A ruthenium (Ru) or osmium...
2018/0190591 FAN-OUT SEMICONDUCTOR PACKAGE
A fan-out semiconductor package includes: a first semiconductor chip; a first encapsulant; a connection member including first vias and a first redistribution...
2018/0190590 Packaged Chip and Signal Transmission Method Based on Packaged Chip
A packaged chip, including a package structure, a redistribution structure, and a carrier, where the package structure includes a first chip and a second chip...
2018/0190589 BENT-BRIDGE SEMICONDUCTIVE APPARATUS
A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of...
2018/0190588 CONTACTS FOR LOCAL CONNECTIONS
The present disclosure relates to semiconductor structures and, more particularly, to contacts for local connections and methods of manufacture. The structure...
2018/0190587 SEMICONDUCTOR DEVICE STRUCTURES INCLUDING STAIR STEP STRUCTURES, AND RELATED SEMICONDUCTOR DEVICES
A method of forming a semiconductor device assembly comprises forming tiers comprising conductive structures and insulating structures in a stacked arrangement...
2018/0190586 SEMICONDUCTOR MEMORY DEVICE AND A MANUFACTURING METHOD THEREOF
A semiconductor memory device and a manufacturing method thereof are provided in the present invention. An under-cut structure is formed at an edge of a bit...
2018/0190585 SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE
A method of forming a semiconductor device, includes forming a conductive layer in a recessed portion of a porous dielectric layer, partially removing a top...
2018/0190584 CIRCUITS FOR AND METHODS OF IMPLEMENTING AN INDUCTOR AND A PATTERN GROUND SHIELD IN AN INTEGRATED CIRCUIT
An integrated circuit device is described. The integrated circuit device comprises a substrate; a plurality of metal routing interconnect layers; an inductor...
2018/0190583 BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component directly bonded to the...
2018/0190582 SEMICONDUCTOR PACKAGE WITH EMBEDDED MIM CAPACITOR, AND METHOD OF FABRICATING THEREOF
An interposer includes a first redistribution layer, an organic substrate, a capacitor, a hard mask layer, a conductive pillar, and a second redistribution...
2018/0190581 Semiconductor Device and Method of Fabricating 3D Package with Short Cycle Time and High Yield
A method of making a semiconductor device comprising the steps of providing a first manufacturing line, providing a second manufacturing line, and forming a...
2018/0190580 BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
In various embodiments, a bonded structure is disclosed. The bonded structure can include an element and a passive electronic component having a first surface...
2018/0190579 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A package structure includes a redistribution layer, at least one bonding electrode, and a mounting layer. The redistribution layer has a first surface, a...
2018/0190578 Fan-Out Package Structure and Method
A device comprises a semiconductor structure in a molding compound layer, a first polymer layer on the molding compound layer, a second polymer layer on the...
2018/0190577 PACKAGED SEMICONDUCTOR DEVICE WITH A PARTICLE ROUGHENED SURFACE
A packaged semiconductor device with a particle roughened surface on a portion of the lead frame that improves adhesion between the molding compound and the...
2018/0190576 MODIFIED LEADFRAME DESIGN WITH ADHESIVE OVERFLOW RECESSES
The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of...
2018/0190575 LEADFRAME WITH LEAD PROTRUDING FROM THE PACKAGE
The present disclosure is directed to a leadframe package having leads with protrusions on an underside of the leadframe. The protrusions come in various...
2018/0190574 PREFORMED LEAD FRAME
A preformed lead frame includes a plurality of lead frame units and intersecting cutting paths extending between two adjacent rows of said lead frame units,...
2018/0190573 LEADFRAME INDUCTOR
One example includes a device that is comprised of a die, a leadframe, and an electrically conductive material. The die includes a circuit therein. The...
2018/0190572 METHOD OF MANUFACTURING SEMICONDUCTOR PRODUCTS, CORRESPONDING SEMICONDUCTOR PRODUCT AND DEVICE
A method for use in manufacturing semiconductor devices such as, e.g., semiconductor power devices includes providing: a semiconductor die provided with...
2018/0190571 SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORMING THE SAME
Semiconductor devices having a through-silicon-via and methods of forming the same are described herein. As an example, a semiconductor device may include a...
2018/0190570 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
In a semiconductor device, a plurality of small depressions are formed to overlap each other in a first joining region of a back surface of a heat releasing...
2018/0190569 Chip Package Structure and Manufacturing Method Thereof
A chip package structure, including a substrate, multiple chips and multiple discrete devices that are packaged on an upper surface of the substrate, and a...
2018/0190568 CERAMIC METAL CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE SAME
The present invention provides a ceramic metal circuit board including a ceramic substrate and metal plates bonded to both surfaces of the ceramic substrate...
2018/0190567 PHASE MODULE FOR A POWER CONVERTER
The invention relates to a phase module (1) for a power converter (2) comprising at least one switching element (10) and a heatsink (13). In order to improve...
2018/0190566 Apparatus and Manufacturing Method
An apparatus includes a circuit device, a heat sink fin, and a thermal interface material layer. The thermal interface material layer is thermally coupled to...
2018/0190565 THERMAL INTERFACE MATERIAL ON PACKAGE
A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes...
2018/0190564 SEMICONDUCTOR DEVICE, CORRESPONDING APPARATUS AND METHOD
A semiconductor device, such as a semiconductor power device, includes: a semiconductor die having a semiconductor die front surface, a package formed onto the...
2018/0190563 SEMICONDUCTOR DEVICE, CORRESPONDING CIRCUIT AND METHOD
A semiconductor device includes a layered package having a semiconductor die embedded therein, the semiconductor die coupled with a thermally-conductive...
2018/0190562 ELECTRONIC DEVICE HAVING A GROOVED CHIP
An electronic device includes a support plate having a mounting face. An electronic chip has a front face mounted on the mounting face of the support plate. A...
2018/0190561 EASILY DETACHABLE CPU CLIP
A clip for use with an electronic package, includes a frame structure with a pair of first side bars and a pair of second side bars commonly defining a...
2018/0190560 ELECTRONIC PACKAGE ASSEMBLY WITH COMPACT DIE PLACEMENT
An electronic package assembly is disclosed. A substrate can have an upper surface area. A first active die can have an upper surface area and a bottom...
2018/0190559 Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an...
2018/0190558 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
A manufacturing method of a package structure includes at least the following steps. A plurality of conductive connectors are formed on a circuit layer. The...
2018/0190557 SEMICONDUCTOR DEVICE INCLUDING AN ENCAPSULATION MATERIAL DEFINING NOTCHES
A semiconductor device includes a first contact element, a second contact element, a semiconductor chip, and an encapsulation material. The first contact...
2018/0190556 METHODS AND APPARATUS FOR SPARK GAP DEVICES WITHIN INTEGRATED CIRCUITS
In a described example, an apparatus includes: an integrated circuit die having multiple terminals; a leadframe having leads for external connections, at least...
2018/0190555 Molding Structure for Wafer Level Package
Apparatus, and methods of manufacture thereof, in which a molding compound is formed between spaced apart microelectronic devices. The molding compound...
2018/0190554 SEMICONDUCTOR DEVICE, METAL ELECTRODE MEMBER, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
On a conductive plate of an insulated substrate, one open end of a main body part of a cylindrical contact member is bonded by solder. In a hollow part of a...
2018/0190553 SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the...
2018/0190552 SEMICONDUCTOR WAFER AND METHOD OF PROBE TESTING
A semiconductor test system has a wafer holder with a tape portion and one or more openings through the tape portion. A semiconductor wafer is mounted over the...
2018/0190551 TESTING STRUCTURE, AND FABRICATION AND TESTING METHODS THEREOF
Testing structures, and their fabrication methods and testing methods are provided. An exemplary testing structure includes a base substrate containing a well...
2018/0190550 METHOD AND APPARATUS TO MODEL AND MONITOR TIME DEPENDENT DIELECTRIC BREAKDOWN IN MULTI-FIELD PLATE GALLIUM...
A first set of test structures for a gallium nitride (GaN) transistor that includes N field plates is disclosed, where N is an integer and X is an integer...
2018/0190549 SEMICONDUCTOR WAFER WITH SCRIBE LINE CONDUCTOR AND ASSOCIATED METHOD
A semiconductor wafer is provided that includes at least two integrated circuits (ICs); a scribe line extends adjacent to the at least two ICs; and a first...
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