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Patent # Description
2018/0190548 METHOD AND A DEVICE FOR MEASURING GAS DISSOCIATION DEGREES WITH AN OPTICAL SPECTROMETER
In current application of gas, the dissociation degree in some special gas is generally detected and controlled by a physical or chemical method instead of an...
2018/0190547 WAFER AND WAFER DEFECT ANALYSIS METHOD
A wafer defect analysis method according to one embodiment comprises the steps of: thermally treating a wafer at different temperatures; measuring an oxygen...
2018/0190546 METHOD FOR FORMING REPLACEMENT METAL GATE AND RELATED DEVICE
A method for eliminating line voids during RMG processing and the resulting device are provided. Embodiments include forming dummy gates over PFET and NFET...
2018/0190545 HYBRID-CHANNEL NANO-SHEET FETS
Semiconductor devices and methods of forming a first layer cap at ends of layers of first channel material in a stack of alternating layers of first channel...
2018/0190544 HYBRID-CHANNEL NANO-SHEET FETS
Integrated chips include a first device and a second device. The first device includes a stack of vertically arranged sheets of a first channel material, a...
2018/0190542 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma...
2018/0190541 FAN-OUT LINE ARRANGEMENT, DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
A fan-out line arrangement, a display panel and a manufacture method thereof are provided. The fan-out line arrangement provided by the present disclosure...
2018/0190540 A Solid State Memory Device, and Manufacturing Method Thereof
Conductive structure technology is disclosed. In one example, a conductive structure can include an interconnect and a plurality of conductive layers overlying...
2018/0190539 METHOD FOR PREPARING SUBSTRATE WITH CARRIER TRAPPING CENTER
The present disclosure provides a method for preparing a substrate with a carrier trapping center. The method includes: implanting bubbling ions into the...
2018/0190538 METHOD OF FABRICATING STI TRENCH
A method of fabricating an STI trench includes providing a substrate. Later, a first mask is formed to cover the substrate. The first mask includes numerous...
2018/0190537 METHODS FOR REMOVAL OF HARD MASK
Embodiments of a method of processing semiconductor devices are presented. The method includes providing a substrate prepared with isolation regions having a...
2018/0190536 RECEPTACLE DEVICE, DEVICE AND METHOD FOR HANDLING SUBSTRATE STACKS
The invention relates to a retaining system for handling substrate stacks, including a retaining surface for retaining a first substrate, and one or more...
2018/0190535 Apparatus And Methods For Wafer Rotation To Improve Spatial ALD Process Uniformity
Apparatus and methods for rotating wafers during processing include a wafer rotation assembly with a support fixture connected to a shaft and a wafer transfer...
2018/0190534 SUBSTRATE HOLDER, A LITHOGRAPHIC APPARATUS AND METHOD OF MANUFACTURING DEVICES
A substrate holder for use in a lithographic apparatus and configured to support a substrate, the substrate holder including: a main body having a main body...
2018/0190533 PEELING METHOD, SEMICONDUCTOR DEVICE, AND PEELING APPARATUS
To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of...
2018/0190532 FILM FOR SEMICONDUCTOR BACK SURFACE
Provided is a film for semiconductor protection, which can prevent warpage in a semiconductor wafer or a semiconductor chip and can also prevent the occurrence...
2018/0190531 SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
A package structure and a method for fabricating thereof are provided. The package structure includes a substrate, a first connector, a redistribution layer, a...
2018/0190530 Frame mounting after foil expansion
An apparatus which comprises an expansion unit configured for expanding a foil, and a mounting unit configured for subsequently mounting the expanded foil on a...
2018/0190529 ELECTROSTATIC CHUCK HEATER
An electrostatic chuck heater includes an electrostatic chuck in which an electrostatic electrode is embedded in a ceramic sintered body; a small-zone...
2018/0190528 ELECTROSTATIC CHUCK ASSEMBLY FOR HIGH TEMPERATURE PROCESSES
An electrostatic chuck assembly includes a puck and a cooling plate. The puck includes an electrically insulative upper puck plate comprising one or more...
2018/0190527 ELECTROSTATIC CHUCK
An electrostatic chuck includes a dielectric layer including an oriented alumina sintered body having a degree of c-plane orientation of 5% or more, the degree...
2018/0190526 SUBSTRATE SUPPORT WITH IMPROVED PROCESS UNIFORMITY
A substrate support for supporting a substrate in a substrate processing system includes a baseplate and a ceramic layer arranged above the baseplate. An outer...
2018/0190525 BOWING SEMICONDUCTOR WAFERS
Methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and...
2018/0190524 SEMICONDUCTOR WAFER CARRIERS
Semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The...
2018/0190523 Substrate Breakage Detection in a Thermal Processing System
Apparatus, systems, and processes for substrate breakage detection in a thermal processing system are provided. In one example implementation, a process can...
2018/0190522 WAFER CARRIER
A wafer carrier including a case having an opening at one end, slots disposed in the case and receiving wafers, and a wireless communication circuitry disposed...
2018/0190521 SUBSTRATE PROCESSING APPARATUS
Disclosed is a substrate processing apparatus including: n (n is an integer of 4 or more) vacuum processing modules each provided with a vacuum container for...
2018/0190520 COMPOSITE HEAT-DISSIPATING SUBSTRATE
The present invention provides a composite heat-dissipating substrate structure, comprising: a heat-dissipating substrate and a heat-conducting metal layer....
2018/0190519 GAS SUPPLY DEVICE AND SUBSTRATE PROCESSING APPARATUS
A gas supply device of supplying a gas into a processing space from a gas supply source includes a facing plate that faces the processing space and includes...
2018/0190518 APPARATUS FOR FIELD GUIDED ACID PROFILE CONTROL IN A PHOTORESIST LAYER
Implementations described herein relate to apparatus and methods for processing a substrate. More specifically, a process chamber having movable electrodes for...
2018/0190517 RECIPE SELECTABLE DISPENSE SYSTEM AND METHOD OF OPERATING
An apparatus for cleaning a microelectronic workpiece and a method of operating is described. The apparatus includes a workpiece holding mechanism to support...
2018/0190516 COATING METHOD OF NON-NEWTONIAN FLUID MATERIAL AND COATING SYSTEM THEREOF
A coating method of a non-Newtonian fluid material and a coating system thereof are provided. The coating method includes the following steps. An equation of...
2018/0190515 SUBSTRATE PROCESSING DEVICE
A substrate processing device (10) for processing a plurality of substrates disposed at predetermined intervals includes a processing bath (12) that is...
2018/0190514 METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide methods of making an...
2018/0190513 SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGE AND STACKED SEMICONDUCTOR PACKAGES
A semiconductor packaging method, a semiconductor package and stacked semiconductor packages are provided. The method includes providing a carrier (10) having...
2018/0190512 METHOD FOR MANUFACTURING AN ENCAPSULATION COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A...
2018/0190511 METHOD FOR MANUFACTURING A COVER FOR AN ELECTRONIC PACKAGE AND ELECTRONIC PACKAGE COMPRISING A COVER
A method for manufacturing a cover for an electronic package includes placing an electrically conductive insert (including an electrical contact surface)...
2018/0190510 LOW COST PACKAGE WARPAGE SOLUTION
Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may...
2018/0190509 INTEGRATED CIRCUIT PACKAGE MOLD ASSEMBLY
An integrated circuit ("IC") package mold includes an upper mold platen that defines an upper mold cavity for receiving an upper substrate having a die attach...
2018/0190508 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A silicon oxide film having at least one opening portion is formed, on a silicon substrate. A structural member formed of a material less prone to be etched by...
2018/0190507 MANUFACTURING METHOD OF A CHIP PACKAGE STRUCTURE
A manufacturing method of a chip package structure is provided. Firstly, a conductive frame including a bottom plate and a plurality of partition plates is...
2018/0190506 COMPOSITION AND METHOD FOR POLISHING SILICON CARBIDE
The invention provides a chemical-mechanical polishing composition comprising (a) silica particles, (b) a polymer comprising sulfonic acid monomeric units, (c)...
2018/0190505 METHOD OF SELECTIVELY ETCHING SILICON OXIDE FILM ON SUBSTRATE
An etching method including: (a) providing a workpiece including a first region made of a first material and a second region made of a second material defining...
2018/0190504 SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
In a method of manufacturing a semiconductor device, an interlayer dielectric (ILD) layer is formed over an underlying structure. The underlying structure...
2018/0190503 LOW ROUGHNESS EUV LITHOGRAPHY
Provided herein are methods and related apparatus to smooth the edges of features patterned using extreme ultraviolet (EUV) lithography. In some embodiments,...
2018/0190502 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
A plasma processing apparatus includes a plasma processing chamber processing a sample using plasma, a radio frequency power supply supplying radio frequency...
2018/0190501 PLASMA PROCESSING APPARATUS
Disclosed is a plasma processing apparatus including: a first placing table including a placing surface configured to place thereon a workpiece serving as a...
2018/0190500 METHOD FOR ETCHING MULTILAYER FILM
In a method for etching a multilayer film of a target object by using a plasma processing apparatus, the multilayer film of the target object includes a layer...
2018/0190499 METHOD FOR FABRICATING METAL GATE STRUCTURE
A method for fabricating a metal gate structure includes following steps. A substrate is provided and followed by forming a high-K dielectric layer on the...
2018/0190498 MEMORY DEVICE AND METHOD OF OPERATING THE SAME
Provided herein may be a memory device and a method of operating the same. The memory device may include a memory block including a plurality of pages, and...
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