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Patent # Description
2018/0269129 STACKABLE POWER MODULE
The present invention relates to a stackable power module, comprising a module body having a top side and a bottom side provided with top and bottom contact...
2018/0269128 COMPUTING SYSTEM WITH A THERMAL INTERFACE COMPRISING MAGNETIC PARTICLES
Embodiments of the present disclosure provide techniques and configurations for a computing system with a thermal interface having magnetic particles. In some...
2018/0269127 Package with Embedded Heat Dissipation Features
An integrated circuit package and a method of fabrication of the same are provided. An opening is formed in a substrate. An embedded heat dissipation feature...
2018/0269126 SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
Semiconductor packages and methods of fabricating the same are disclosed. The semiconductor package may include a package substrate, a semiconductor chip,...
2018/0269125 CIRCUIT PACKAGE
A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of...
2018/0269124 SEMICONDUCTOR PACKAGE DEVICE
A semiconductor device includes a die having a pad, a passivation disposed aver the die and a portion of the pad, a polymer disposed over the passivation, a...
2018/0269123 SEMICONDUCTOR PACKAGE
The present disclosure provides a semiconductor package having a size equal to or larger than standard size 0201. The semiconductor package includes a die and...
2018/0269122 PRINTED SUBSTRATE AND ELECTRONIC DEVICE
A printed substrate having a first surface to which an electronic component is to be fixed through an underfill material includes a groove that is recessed...
2018/0269121 SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various...
2018/0269120 SEMICONDUCTOR DEVICE
Provided is a technique of reducing detachment of a sealing resin in a semiconductor device, thereby achieving an increased improvement in lifetime of the...
2018/0269119 SURFACE MODIFICATION CONTROL FOR ETCH METRIC ENHANCEMENT
A method is disclosed for monitoring and controlling a process of plasma-assisted surface modification of a layer formed on a substrate. The method includes...
2018/0269118 ETCHING METHOD AND PLASMA PROCESSING APPARATUS
The present invention relates to an etching method including a reaction layer forming step of forming a reaction layer by adsorption of a gas on a surface of...
2018/0269117 Method for Producing an Optoelectronic Device
A method for producing an optoelectronic device is disclosed. The method include preforming an inductive excitation of a current by an inductive component of...
2018/0269116 MEASUREMENT METHOD, MEASUREMENT PROGRAM, AND MEASUREMENT SYSTEM
According to one embodiment, there is provided a measurement method. The method includes acquiring layer information related to a plurality of layers to be...
2018/0269115 METHOD OF SIMULTANEOUSLY MANUFACTURING DIFFERENT TRANSISTORS
A method of manufacturing first, second, and third transistors of different types inside and on top of first, second, and third semiconductor areas of an...
2018/0269114 SEMICONDUCTOR DEVICE STRUCTURE WITH GATE SPACER HAVING PROTRUDING BOTTOM PORTION AND METHOD FOR FORMING THE SAME
A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a gate stack...
2018/0269113 METHOD AND STRUCTURE FOR IMPROVING DIELECTRIC RELIABILITY OF CMOS DEVICE
A method of manufacturing a semiconductor device includes providing a substrate structure including a semiconductor substrate, an interlayer dielectric layer...
2018/0269112 Multi-Gate Devices with Replaced-Channels and Methods for Forming the Same
A device includes a semiconductor substrate, isolation regions in the semiconductor substrate, and a Fin Field-Effect Transistor (FinFET). The FinFET includes...
2018/0269111 TRANSISTOR CHANNEL
A method for fabricating a semiconductor device includes providing a first wafer comprising a substrate and a first semiconductor material layer, bonding the...
2018/0269110 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor substrate, and a first transistor. The first transistor has a first gate on the semiconductor substrate, and a...
2018/0269109 SYSTEM AND METHOD FOR WIDENING FIN WIDTHS FOR SMALL PITCH FINFET DEVICES
A semiconductor layer is etched into a plurality of fin structures. A first nitridation process is performed to side surfaces of the fin structures. The first...
2018/0269108 FIN TYPE FIELD EFFECT TRANSISTORS WITH DIFFERENT PITCHES AND SUBSTANTIALLY UNIFORM FIN REVEAL
A semiconductor device that includes a first plurality of fin structures in a first device region and a second plurality of fin structures in a second device...
2018/0269107 Method of Forming a Semiconductor Device
A method of forming a semiconductor device includes following steps. First of all, plural mandrel patterns are formed on a target layer. Then, plural capping...
2018/0269106 SEMICONDUCTOR DEVICE HAVING MULTIPLE WORK FUNCTIONS AND MANUFACTURING METHOD THEREOF
A method of manufacturing a semiconductor device includes providing a substrate structure including a semiconductor substrate, an interlayer dielectric layer...
2018/0269105 BONDING OF III-V-AND-SI SUBSTRATES WITH INTERCONNECT METAL LAYERS
A III-V-and-Si substrate device is described including integration of a backend unit and a frontend unit. The backend unit includes interlevel dielectric (ILD)...
2018/0269104 METHOD OF SINGULATING SEMICONDUCTOR WAFER HAVING A PLURALITY OF DIE AND A BACK LAYER DISPOSED ALONG A MAJOR SURFACE
Die are singulated from a wafer having a back layer by placing the wafer onto a first carrier substrate with the back layer adjacent the carrier substrate,...
2018/0269103 CHAMFERLESS VIA STRUCTURES
Chamferless via structures and methods of manufacture are provided. The method includes: forming at least one non-self-aligned via within at least dielectric...
2018/0269102 FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE USING MULTILAYER RESIST LAYER
Formation methods of a semiconductor device structure are provided. The method includes forming a bottom layer, a middle layer and an upper layer over a...
2018/0269101 METHOD FOR PROCESSING TARGET OBJECT
In a method for processing a target object including a conductive layer and an insulating film formed on the conductive layer, the insulating film is etched by...
2018/0269100 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
A method for manufacturing a semiconductor device includes forming a hard mask layer overlying a device layer of a semiconductor device, a mandrel underlayer...
2018/0269099 Method for Fabricating a Semiconductor Device
A method for fabricating a semiconductor device includes receiving a silicon substrate having an isolation feature disposed on the substrate and a well...
2018/0269098 ELECTROSTATIC CHUCK HAVING THERMALLY ISOLATED ZONES WITH MINIMAL CROSSTALK
A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic...
2018/0269097 ELECTROSTATIC CHUCK DEVICE
An electrostatic chuck device according to the present invention includes: an electrostatic chuck portion having a placement surface on which a plate-like...
2018/0269096 DEVICE AND METHOD FOR ALIGNING SUBSTRATES
A device for aligning and bringing a large-area substrate into contact with a carrier substrate comprising: a substrate holding means for attaching the...
2018/0269095 LOAD PORT OPERATION IN ELECTRONIC DEVICE MANUFACTURING APPARATUS, SYSTEMS, AND METHODS
An electronic device manufacturing system may include a factory interface having a controlled environment. The electronic device manufacturing system may also...
2018/0269094 SIDE OPENING UNIFIED POD
A substrate processing system including a processing section arranged to hold a processing atmosphere therein, a carrier having a shell forming an internal...
2018/0269093 FUME-REMOVING DEVICE
The present invention relates to an apparatus for removing fume which includes, a wafer cassette for stacking wafers; and an exhaust for exhausting the fume of...
2018/0269092 FUME-REMOVING DEVICE
The present invention relates to an apparatus for removing fume which includes, a wafer cassette for stacking wafers; and an exhaust for exhausting the fume of...
2018/0269091 CHIP IDENTIFICATION SYSTEM
Otherwise-unused metal pads are utilized for mechanically marking an identification number on each chip in each reticle of each semiconductor wafer. A...
2018/0269090 TEMPERATURE CONTROL SYSTEM, SEMICONDUCTOR MANUFACTURING DEVICE, AND TEMPERATURE CONTROL METHOD
A temperature control system includes a first temperature adjustment unit storing fluid at a first temperature; a second temperature adjustment unit storing...
2018/0269089 NON-CONTACT TEMPERATURE CALIBRATION TOOL FOR A SUBSTRATE SUPPORT AND METHOD OF USING THE SAME
Embodiments of the disclosure relate to methods for measuring temperature and a tool for calibrating temperature control of a substrate support in a processing...
2018/0269088 WAFER PROCESSING APPARATUS, RECORDING MEDIUM AND WAFER CONVEYING METHOD
A wafer processing apparatus includes a controller connected to a first robot and a second robot. The controller controls the first robot so that the wafer is...
2018/0269087 MICRO DEVICE TRANSFER SYSTEM
A micro device transfer system includes a transfer head having pick-up electrodes for picking micro devices and thin-film transistors (TFTs) corresponding to...
2018/0269086 SUPPORT SUBSTRATE FOR TRANSFER OF SEMICONDUCTOR DEVICES
An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to secure the wafer...
2018/0269085 METHOD OF ADJUSTING MEASUREMENT POSITION OF RADIATION THERMOMETER AND HEAT TREATMENT APPARATUS
A pyrometer holder is mounted to an outer wall of a chamber while holding a lower radiation thermometer. The front end of the lower radiation thermometer is...
2018/0269084 SUBSTRATE TREATING APPARATUS
Disclosed is a substrate treating apparatus including a treatment container, a pin, a seal housing, a seal member, and an exhaust port. The treatment container...
2018/0269083 FINNED ROTOR COVER
Embodiments described herein generally relate to a processing apparatus having a cover piece that participates in preheating a process gas. In one...
2018/0269082 SUBSTRATE TREATMENT APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
According to an embodiment, a substrate treatment apparatus includes a hair member including a noble metal, and a liquid chemical supply member to supply a...
2018/0269081 SYSTEM AND METHOD FOR STATUS-DEPENDENT CONTROLLING OF A SUBSTRATE AMBIENT IN MICROPROCESSING
The present disclosure provides systems and techniques in which an ambient may be controlled on the basis of a current status of a micro-processed substrate so...
2018/0269080 SYSTEM AND METHOD FOR MONITORING TREATMENT OF MICROELECTRONIC SUBSTRATES WITH FLUID SPRAYS SUCH AS CRYOGENIC...
A system and method for treating a substrate is described. In particular, the system and method for treating a substrate include techniques for removing...
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