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Patent # Description
2018/0277610 ELECTROOPTICAL DEVICE, MANUFACTURING METHOD OF ELECTROOPTICAL DEVICE, AND ELECTRONIC EQUIPMENT
An organic EL device as an electrooptical device includes an organic EL element, a sealing member, a color filter, a dimension evaluation pattern, and a...
2018/0277609 ORGANIC EL DISPLAY DEVICE
This organic EL display device is provided with: a TFT substrate; a counter substrate; an organic EL element provided on the TFT substrate; a sealing film that...
2018/0277608 METHOD FOR PRODUCING A RADIATION DETECTOR AND RADIATION DETECTOR
The invention relates to a method for producing a radiation detector used to detect ionizing radiation including a first inorganic-organic halide Perovskite...
2018/0277607 RADIATION DETECTOR
According to one embodiment, a radiation detector includes a first conductive layer, a second conductive layer, and an intermediate layer. The intermediate...
2018/0277606 SOLID-STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD THEREOF
There is provided a solid-state image pickup device that includes a functional region provided with an organic film, and a guard ring surrounding the...
2018/0277605 SOLID-STATE IMAGE SENSOR, METHOD OF PRODUCING THE SAME, AND ELECTRONIC APPARATUS
A solid-state image sensor includes a pixel formed, upon forming a structure where a photoelectric conversion layer is laminated on a wiring layer constituting...
2018/0277604 SOLID-STATE IMAGING DEVICE, AND METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE
A solid-state imaging device includes: a plurality of pixels each including a first electrode, an organic photoelectric conversion film, and a second electrode...
2018/0277603 MEMORY DEVICE AND RECTIFIER
A memory device according to an embodiment includes a first conductive layer, a second conductive layer, a variable resistance layer disposed between the first...
2018/0277602 Memory Arrays And Methods Of Forming An Array Of Memory Cells
A method of forming an array of memory cells includes forming lines of covering material that are elevationally over and along lines of spaced sense line...
2018/0277601 MEMORY DEVICE INCLUDING A VARIABLE RESISTANCE MATERIAL LAYER
A memory device is provided. The memory device includes a variable resistance layer. A selection device layer is electrically connected to the variable...
2018/0277600 MEMORY CELLS AND MEMORY ARRAY STRUCTURES, AND FABRICATION METHODS THEREOF
A memory cell includes a substrate including a first diode region, a second diode region, a third diode region, and a fourth diode region, a first well region...
2018/0277599 MEMORY INCLUDING A SELECTOR SWITCH ON A VARIABLE RESISTANCE MEMORY CELL
Embodiments include but are not limited to apparatuses and systems including memory having a memory cell including a variable resistance memory layer, and a...
2018/0277598 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor pillar and a control electrode. The semiconductor pillar extends in a first direction, and includes a first...
2018/0277597 STORAGE DEVICE
A storage device includes a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, a fifth conductive layer,...
2018/0277596 THREE-DIMENSIONAL MEMORY DEVICES HAVING THROUGH-STACK CONTACT VIA STRUCTURES AND METHOD OF MAKING THEREOF
A three-dimensional memory device includes conductive structures located over a substrate, an alternating stack of insulating layers and electrically...
2018/0277595 SEMICONDUCTOR STORAGE DEVICE
A semiconductor storage device includes first and second wirings that are in a first layer above the substrate, extend along a first direction, and are...
2018/0277594 SEMICONDUCTOR DEVICE
The present technology relates to a semiconductor device which enables yield to be enhanced. A volatile logic circuit has a storage node, and stores inputted...
2018/0277593 LOGIC CHIP INCLUDING EMBEDDED MAGNETIC TUNNEL JUNCTIONS
An embodiment integrates memory, such as spin-torque transfer magnetoresistive random access memory (STT-M RAM) within a logic chip. The STT-MRAM includes a...
2018/0277592 TRANSPARENT DISPLAY PANEL AND DISPLAY DEVICE INCLUDING THE SAME
A transparent display panel includes a plurality of unit pixels. Each of the unit pixels includes a non-transparent region in which a first light-emitting...
2018/0277591 MICRO LIGHT EMITTING DIODE AND DISPLAY PANEL
A micro LED including an epitaxial stack layer, a first electrode and a second electrode is provided. A lower surface of the first electrode is in contact with...
2018/0277590 LIGHT-EMITTING DEVICE
A light-emitting device includes: a substrate comprising a first side and a second side opposite to the first side; multiple semiconductor stacks on the first...
2018/0277589 DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE
A display device including a substrate; a sub-pixel portion disposed on the substrate; and a wiring electrode electrically connected to the sub-pixel portion....
2018/0277588 SOLID-STATE IMAGING ELEMENT, METHOD OF MANUFACTURING THE SAME, AND IMAGING DEVICE
In pixels that are two-dimensionally arranged in a matrix fashion in the pixel array unit of a solid-state imaging element, a photoelectric conversion film...
2018/0277587 IMAGE PICKUP DEVICE AND IMAGE PICKUP APPARATUS
An image pickup device according to the present disclosure includes a first pixel and a second pixel each including a photodetection section and a light...
2018/0277586 IMAGE SENSORS, AND FABRICATION AND OPERATION METHODS THEREOF
An image sensor includes a substrate having a first surface and a second surface. The substrate includes a photo-sensitive region and a connection region. The...
2018/0277585 SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
Disclosed herein is a semiconductor device, including: a first substrate including a first electrode, and a first insulating film configured from a diffusion...
2018/0277584 IMAGING ELEMENT AND IMAGING APPARATUS
There is provided an imaging element including a photoelectric conversion unit formed in a substrate and a wire grid polarizer disposed at a light-incident...
2018/0277583 OPTICAL DEVICE AND METHOD OF MANUFACTURING OPTICAL DEVICE
First, a three-dimensional substrate is placed such that the rear surface is oriented upward. Next, a translucent member is placed inside a recessed portion so...
2018/0277582 IMAGE SENSOR AND METHOD FOR MANUFACTURING THEREOF
An image sensor includes a substrate, a photosensitive unit, a first grid and a color filter. The photosensitive unit is located within the substrate. The...
2018/0277581 IMAGE SENSOR
An image sensor includes: a pixel array where a plurality of pixel groups are arrayed in two dimensions, wherein each of the plurality of the pixel groups...
2018/0277580 Image Sensor and Image Processing Method Using The Same
An image sensor includes a color filter array and a light receiving element. The color filter array includes plural repeating unit cells, and at least one of...
2018/0277579 SOLID-STATE IMAGING DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE, AND IMAGING APPARATUS
A solid-state imaging device includes, in a semiconductor substrate, a pixel portion provided with a photoelectric conversion portion, which photoelectrically...
2018/0277577 STACKED GRID DESIGN FOR IMPROVED OPTICAL PERFORMANCE AND ISOLATION
A back side illumination (BSI) image sensor with a dielectric grid opening having a planar lower surface is provided. A pixel sensor is arranged within a...
2018/0277576 IMAGE SENSORS AND METHODS OF FORMING THE SAME
An image sensor includes a substrate including a light-receiving region and a light-shielding region, a device isolation pattern in the substrate of the...
2018/0277575 SOLID-STATE IMAGING DEVICE, IMAGING SYSTEM, AND MOVABLE OBJECT
A solid-state imaging device includes a plurality of pixels each including a photoelectric conversion unit, a first holding portion holding charges transferred...
2018/0277574 ACTIVE MATRIX SUBSTRATE AND METHOD FOR PRODUCING THE SAME
An active matrix substrate includes a first TFT (10), a second TFT (20) disposed per pixel, and a circuit including the first TFT. The first and second TFTs...
2018/0277573 DISPLAY DEVICE AND METHOD FOR PRODUCING DISPLAY DEVICE
A display device includes a base material having a first surface, a thin-film transistor layer formed on the first surface, a display layer formed on the...
2018/0277572 FLEXIBLE DISPLAY PANELS AND THE MANUFACTURING METHODS THEREOF
The present disclosure relates to a flexible display panel and the manufacturing method thereof. The flexible display panel includes a display area, a...
2018/0277571 MECHANISMS FOR FORMING FINFET DEVICE
Embodiments of mechanisms for forming a semiconductor device are provided. The semiconductor device includes a substrate. The semiconductor device also...
2018/0277570 DISPLAY APPARATUS
A load related to a scanning line is decreased and a load related to a common electrode is decreased without decrease in an aperture ratio of each pixel. A...
2018/0277569 DISPLAY DEVICE
A display device includes first, second and third connection wiring. The second connection wiring is located in a same layer as the first connection wiring....
2018/0277568 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR
An array substrate and a manufacturing method therefor are provided. The array substrate includes: a base substrate, a first metal layer, a first insulation...
2018/0277567 MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICES CONTAINING ANNULAR DIELECTRIC SPACERS WITHIN MEMORY OPENINGS AND...
An annular dielectric spacer can be formed at a level of a joint-level dielectric material layer between vertically neighboring pairs of alternating stacks of...
2018/0277566 MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICES CONTAINING ANNULAR DIELECTRIC SPACERS WITHIN MEMORY OPENINGS AND...
An annular dielectric spacer can be formed at a level of a joint-level dielectric material layer between vertically neighboring pairs of alternating stacks of...
2018/0277565 SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device includes wirings arranged in parallel along a first direction, the wirings including first and second wirings that are adjacent...
2018/0277564 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to an embodiment, a semiconductor memory device includes a substrate, a stacked body, a circuit section, a first insulating layer, and a first...
2018/0277563 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to an embodiment, a semiconductor memory device includes a substrate, a stacked body, a first insulating film, and a first film. The stacked body is...
2018/0277562 SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device includes a substrate, electrode films provided on a first direction side of the substrate and arranged with spacing from each...
2018/0277561 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to an embodiment, a semiconductor device includes a substrate, a stacked body, a first insulating film, a second insulating film and a plurality of...
2018/0277560 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE
According to an embodiment, a semiconductor memory device includes a stacked body in which insulating layers and electrode films are alternately stacked, a...
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