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Patent # Description
2018/0277509 INJECTION MOLDED SOLDER BUMPING
Methods for depositing material on a chip include forming a mold layer. The mold layer includes one or more openings over respective contact areas, each of the...
2018/0277508 PRESSURE CONTACT TYPE SEMICONDUCTOR APPARATUS
In a pressure contact type semiconductor apparatus, a second intermediate electrode on a second semiconductor chip has one or more second through holes. The...
2018/0277507 Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape
A thermal bonding sheet includes a layer, in which an average area of a pore portion in a cross section of the layer after being heated at a heating rate of...
2018/0277506 SOLDER JOINING
The present invention suppresses fracture at an interface between different materials, and provides a solder joining which includes: a solder joining layer 10...
2018/0277504 METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a...
2018/0277503 LIQUID EJECTION HEAD SUBSTRATE AND SEMICONDUCTOR SUBSTRATE
A liquid ejection head substrate includes an electrode pad for receiving driving power for liquid ejection from an outside, the electrode pad including at...
2018/0277502 METHOD AND APPARATUS FOR BACK-BIASED SWITCH TRANSISTORS
An integrated radio frequency (RF) circuit structure may include an active device on a first surface of an isolation layer. The integrated RF circuit structure...
2018/0277501 LDMOS Transistor Structure and Method of Manufacture
In an embodiment, a method includes forming a first opening in a front surface of a semiconductor substrate including a LDMOS transistor structure, and...
2018/0277500 SEMICONDUCTOR ARRANGEMENT IN FAN OUT PACKAGING INCLUDING MAGNETIC STRUCTURE AROUND TRANSMISSION LINE
A semiconductor arrangement in fan out packaging has a molding compound adjacent a side of a semiconductor die. A magnetic structure is disposed above the...
2018/0277499 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to an embodiment, a semiconductor memory device includes a substrate, an insulating film, a plurality of conductive films, an insulating member, a...
2018/0277498 SEMICONDUCTOR DEVICE
A semiconductor device includes a mounting substrate including an interface, which is connectable with a host, and a first ground layer, a surface-mounted...
2018/0277497 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
According to one embodiment, a semiconductor device includes a first semiconductor circuit layer including a first conductive layer, a second semiconductor...
2018/0277496 INTEGRATED PHYSICALLY UNCLONABLE FUNCTION DEVICE AND METHOD OF PRODUCTION THEREOF
An integrated device for physically unclonable functions is based on a set of MOS transistors exhibiting a random distribution of threshold voltages which are...
2018/0277495 Packages with Interposers and Methods for Forming the Same
A package structure includes an interposer, a die over and bonded to the interposer, and a Printed Circuit Board (PCB) underlying and bonded to the interposer....
2018/0277494 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
According to an embodiment, a semiconductor memory device includes a substrate, a first stacked body, a columnar part, a second insulating film, and a second...
2018/0277493 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
A method of manufacturing a semiconductor device includes stacking a first substrate comprising a first surface having a semiconductor element and an opposing...
2018/0277492 WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
Techniques for reducing warpage for microelectronic packages are provided. A warpage control layer or stiffener can be attached to a bottom surface of a...
2018/0277491 POWER ELECTRONICS ASSEMBLIES AND VEHICLES INCORPORATING THE SAME
A power electronics assembly includes a semiconductor device, a metal substrate, and a cooling structure. The metal substrate includes a plurality of...
2018/0277490 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
A semiconductor package includes a ground electrode formed on an upper surface of a substrate, a first electronic component disposed on the upper surface of...
2018/0277489 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a...
2018/0277488 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
A semiconductor package includes a substrate, a semiconductor element disposed on the substrate, an encapsulating layer covering side surfaces and a top...
2018/0277487 GRAPHENE WIRING STRUCTURE, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING GRAPHENE WIRING STRUCTURE, AND METHOD...
A graphene wiring structure of an embodiment has: an amorphous or polycrystalline insulating film; and a multilayer graphene on the insulating film. The...
2018/0277486 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
Even if a via hole is displaced, erosion of a first layer made of titanium is suppressed when the via hole is cleaned. A semiconductor includes a wire layer, a...
2018/0277485 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a...
2018/0277484 SEMICONDUCTOR DEVICE
A semiconductor device includes a first chip having a through via, a second chip having a first terminal that is electrically connected to the through via, and...
2018/0277483 CONTACT FORMATION IN SEMICONDUCTOR DEVICES
A technique relates to fabricating a semiconductor device. A contact trench is formed in an inter-level dielectric layer. The contact trench creates an exposed...
2018/0277482 REDUCING METALLIC INTERCONNECT RESISTIVITY THROUGH APPLICATION OF MECHANICAL STRAIN
Methods are provided for fabricating metallic interconnect structures having reduced electrical resistivity that is obtained by applying mechanical strain to...
2018/0277481 FABRICATION OF VERTICAL FUSES FROM VERTICAL FINS
A vertical fuse element, including, a conductive silicide base on a surface of a substrate, and a conductive silicide pillar extending in a direction...
2018/0277480 DIFFERENTIAL INDUCTOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
Provided are a differential inductor and a semiconductor device including the same, the differential inductor including first circular parts and second...
2018/0277479 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device in which the generation of a distortion of a signal is suppressed, and a method for manufacturing the semiconductor device are...
2018/0277478 SEMICONDUCTOR DEVICE
There is provided a semiconductor device including a memory region and a logic region. The memory region includes a transistor (memory transistor) that stores...
2018/0277477 STORAGE DEVICE
A storage device includes a first wiring layer, a second wiring layer spaced from the first wiring layer in a first direction, and a plurality of electrode...
2018/0277476 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
A semiconductor memory device includes a first electrode film, a second electrode film group composed of a plurality of electrode films provided on the first...
2018/0277475 A SEMICONDUCTOR POWER DEVICE COMPRISING ADDITIONAL TRACKS AND METHOD OF MANUFACTURING THE SEMICONDUCTOR POWER...
Some embodiments relate to a semiconductor power device that includes a first substrate, a second substrate, a stack and an interconnect structure. The first...
2018/0277474 CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
A circuit board and a semiconductor packages therewith are disclosed. The circuit board may include a top surface, on which at least one semiconductor chip is...
2018/0277473 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes a wiring substrate including wiring layers, a semiconductor chip including electrode pads and mounted on the wiring substrate,...
2018/0277472 LAMINATE AND MAKING METHOD
A laminate is provided comprising a support, a resin layer, a metal layer, an insulating layer, and a redistribution layer. The resin layer comprises a...
2018/0277471 THROUGH-HOLE ELECTRODE SUBSTRATE
A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole...
2018/0277470 INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR
In one embodiment, an IC package assembly for a switching regulator, can include: a power switch chip including a control electrode and a first electrode on an...
2018/0277469 SEMICONDUCTOR DEVICE AND LEAD FRAME
A semiconductor device according to a first aspect of the present invention includes a device main body, a single power supply wiring board, a plurality of...
2018/0277468 SEMICONDUCTOR DEVICE
A semiconductor device 1 includes a first drain terminal 4, connected to a drain electrode of a first semiconductor chip, a first gate terminal 5, connected to...
2018/0277467 SEMICONDUCTOR DEVICE
A semiconductor device includes field-effect transistor having a gate, a drain, and a source. A first clamping circuit is connected between the drain and the...
2018/0277466 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
To reduce a package size of a semiconductor device. According to embodiments, there is a semiconductor device comprising: a first die pad; a first inner lead...
2018/0277465 SEMICONDUCTOR PACKAGE WITH INTERCONNECTED LEADS
A semiconductor package includes a semiconductor die and a ceramic package body covering the semiconductor die. The ceramic package body includes a plurality...
2018/0277464 SEMICONDUCTOR DEVICE HAVING CORRUGATED LEADS AND METHOD FOR FORMING
A semiconductor device includes a lead frame site including a die attach region and corrugated metal leads around the die attach region. Each of the corrugated...
2018/0277463 Methods and Apparatus for Semiconductor Device Having Bi-Material Die Attach Layer
Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate...
2018/0277462 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRODE PLATE
A semiconductor device includes an electrode plate, a metallic member, and solder connecting the metallic member with the electrode plate. On a surface of the...
2018/0277461 METHODS AND APPARATUS FOR A SEMICONDUCTOR DEVICE HAVING BI-MATERIAL DIE ATTACH LAYER
Described examples include a device including a semiconductor die having a first surface with bond pads and an opposite second surface attached to a substrate...
2018/0277460 ONBOARD CONTROL DEVICE
Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a...
2018/0277459 SEMICONDUCTOR DEVICE
A semiconductor device with a FINFET, which provides enhanced reliability. The semiconductor device includes a first N channel FET and a second N channel FET...
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