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Patent # Description
2018/0286749 Fully Self-Aligned Via
A first metallization layer comprising a set of first conductive lines that extend along a first direction on a first insulating layer on a substrate. A second...
2018/0286748 BACKSIDE CONTACT TO A FINAL SUBSTRATE
A device structure is formed using a silicon-on-insulator substrate. The device structure includes a first switch and a second switch that are formed within a...
2018/0286747 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
A semiconductor structure and a fabrication method are provided. The fabrication method includes: providing a substrate; forming a dielectric layer with an...
2018/0286746 SELECTIVE DEPOSITION OF WCN BARRIER/ADHESION LAYER FOR INTERCONNECT
Provided are methods of forming diffusion barriers and adhesion layers for interconnects such as cobalt (Co) interconnects or ruthenium (Ru) interconnects. The...
2018/0286745 Parallel Plate Waveguide for Power Semiconductor Package
A power semiconductor package includes a first group of semiconductor dies attached to a first side of a substrate and evenly distributed over a width of the...
2018/0286744 Method of Manufacturing Semiconductor Device
A method of manufacturing a semiconductor device by performing a process on a substrate includes: forming a protective layer made of a polymer having a urea...
2018/0286743 ASYMMETRIC STAIR STRUCTURE AND METHOD FOR FABRICATING THE SAME
An asymmetric stair structure includes multiple unit layers and has m regions (m.gtoreq.2). In each of the m regions, a different part of unit layers having an...
2018/0286742 SEMICONDUCTOR STRUCTURE CAPABLE OF IMPROVING ROW HAMMER EFFECT IN DYNAMIC RANDOM ACCESS MEMORY AND FABRICATION...
A semiconductor structure includes a substrate with a first conductivity type and a first doping concentration, an active area with its longitudinal axis...
2018/0286741 CONTROL APPARATUS
In order to solve a problem that a large load is applied to a particular shaft of a transfer robot in accordance with acceleration during transfer of a...
2018/0286740 MANUFACTURING METHOD OF SAMPLE TABLE
A manufacturing method of sample table is provided. The sample table holds a semiconductor wafer on which a plasma process is to be performed, and the...
2018/0286739 PICKUP UNIT AND PICKUP SYSTEM OF SEMICONDUCTOR DEVICE INCLUDING THE SAME
A pickup apparatus includes a plurality of pickers sliding along a first direction and a space adjuster including a plurality of space adjusting plates. Each...
2018/0286738 LITHOGRAPHIC APPARATUS SUBSTRATE TABLE AND METHOD OF LOADING A SUBSTRATE
A lithographic apparatus substrate table comprises a plurality of first projections, whereby the first projections define a first substrate supporting plane...
2018/0286737 PROTECTIVE TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
A protective tape including an adhesive agent layer, a thermoplastic resin layer, and a matrix film layer in this order to a surface of a wafer on which a bump...
2018/0286736 SHEET FOR SEMICONDUCTOR PROCESSING
The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a...
2018/0286735 Carrier Arrangement and Method for Processing a Carrier
According to various embodiments, a method for processing a carrier may include: forming an arrangement of defects in the carrier, wherein a surface region of...
2018/0286734 MICRO-DEVICE POCKETS FOR TRANSFER PRINTING
A method of micro-transfer printing a micro-device from a support substrate comprises providing the micro-device, forming a pocket in or on the support...
2018/0286733 DIE CARRIER DEVICE AND METHOD
A system and method for constructing a carrier tape for storing and transporting die is disclosed. A system creates a depressed cavity in the computer system...
2018/0286732 ELECTROSTATIC CHUCK
According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, an electrode layer, a base plate, and a heater plate. The ceramic...
2018/0286731 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
In order to avoid cracking of a semiconductor wafer when separating the semiconductor wafer from an electrostatic chuck, there is provided a manufacturing...
2018/0286730 SUBSTRATE PROCESSING DEVICE, METHOD FOR CONTROLLING SUBSTRATE PROCESSING DEVICE, AND STORAGE MEDIUM STORING...
A substrate processing device for processing a substrate, comprising: an image sensor for detecting positions of two corners on at least one diagonal line of a...
2018/0286729 PROCESSING SYSTEM
A system includes a transfer device for transferring workpieces in an atmospheric atmosphere, a transfer unit for transferring the workpieces in a vacuum...
2018/0286728 METHOD AND APPARATUS FOR SUBSTRATE TRANSPORT APPARATUS POSITION COMPENSATION
A substrate transport empiric arm droop mapping apparatus for a substrate transport system of a processing tool, the mapping apparatus including a frame, an...
2018/0286727 METHOD OF PROCESSING SUBSTRATE
Described herein is a technique capable of improving the uniformity of device characteristics. According to the technique described herein, there is provided a...
2018/0286726 HUMIDITY CONTROL IN SEMICONDUCTOR SYSTEMS
Method for forming a clean environment for semiconductor substrates with low humidity level, including the steps of measuring a humidity level in the...
2018/0286725 SUBSTRATE RETRAINER AND SUBSTRATE PROCESSING APPARATUS
Described is a technique capable of reducing an effect of a substrate retainer on a substrate processing while maintaining a strength of a substrate retainer....
2018/0286724 METHODS FOR INSPECTION SAMPLING ON FULL PATTERNED WAFER USING MULTIPLE SCANNING ELECTRON BEAM COLUMN ARRAY
A method of operating a multi-column electron beam array for quality inspection of a semiconductor wafer involves dividing the whole wafer area collectively in...
2018/0286723 METHOD OF CONTROLLING DISPLAY OF OPERATION OF SEMICONDUCTOR MANUFACTURING APPARATUS AND NON-TRANSITORY COMPUTER...
A method is provided, the method including: repeatedly acquiring a state of one or more devices included in the semiconductor manufacturing apparatus;...
2018/0286722 POSITION-DETECTING AND CHIP-SEPARATING DEVICE
The present invention provides a position-detecting and chip-separating device applied to a semiconductor structure that includes a base layer and a plurality...
2018/0286721 METHOD FOR INSPECTING FLOW RATE CONTROLLER AND METHOD FOR PROCESSING WORKPIECE
A method according to an aspect includes outputting gas continuously from a flow rate controller, closing a valve, obtaining a first pressure rise ...
2018/0286720 SUBSTRATE PROCESSING SYSTEM AND CONTROL DEVICE
Disclosed is a substrate processing system that includes a substrate processing apparatus configured to perform a predetermined processing on a substrate...
2018/0286719 FILM FORMING APPARATUS AND FILM FORMING METHOD
A film forming apparatus according to the present embodiment includes a film forming chamber accommodating a substrate and performing a film forming process...
2018/0286718 WEIGHING APPARATUS, SUBSTRATE LIQUID PROCESSING APPARATUS, WEIGHING METHOD, SUBSTRATE LIQUID PROCESSING METHOD...
A processing liquid used in a substrate liquid processing apparatus can be supplied in a constant amount with high accuracy. A substrate liquid processing...
2018/0286717 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM INCLUDING THE SAME
Provided is a substrate processing apparatus for making a catalyst and a substrate close to each other or be in contact with each other in the presence of...
2018/0286716 Substrate Processing Apparatus
A substrate processing apparatus includes a substrate processing part configured to process a substrate under a vacuum atmosphere, a substrate transfer part...
2018/0286715 SUBSTRATE TRANSFER DEVICE AND SUBSTRATE TRANSFER METHOD
An atmospheric transfer device 20 includes a wafer transfer mechanism 101 holding and transferring a wafer W; a housing 100 accommodating the wafer transfer...
2018/0286714 COB DIE BONDING AND WIRE BONDING SYSTEM AND METHOD
Disclosed is a COB die bonding and wire bonding system and method. The system comprises a controller, a forward die bonder, a reverse die bonder and a conveyor...
2018/0286713 Apparatus and Method for Decapsulating Packaged Integrated Circuits
A system for decapsulating a portion of an encapsulated integrated circuit that includes copper elements has a container holding an etchant solution, a pump...
2018/0286712 HEAT SOURCE DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING SAME
The present disclosure relates to a heat source device and a substrate processing apparatus including same. The substrate processing apparatus includes: a...
2018/0286711 APPARATUS AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
The invention relates to an apparatus for manufacturing a semiconductor device comprising a reaction chamber comprising a substrate holder for holding a...
2018/0286710 CERAMIC HEATER
A ceramic heater includes a ceramic body having a plurality of pin holes for a vertical movement of lift pins, a heating member disposed inside the ceramic...
2018/0286709 PLATE-SHAPED WORKPIECE PROCESSING METHOD
A method for processing a plate-shaped workpiece having a division line and a metal member formed on the division line or in an area corresponding to the...
2018/0286708 PLATE-SHAPED WORKPIECE PROCESSING METHOD
A method for processing a plate-shaped workpiece having a division line and a metal member formed on the division line or in an area corresponding to the...
2018/0286707 GAS ADDITIVES FOR SIDEWALL PASSIVATION DURING HIGH ASPECT RATIO CRYOGENIC ETCH
Methods and apparatus for etching a feature in a substrate are provided. The feature may be etched in dielectric material, which may or may not be provided in...
2018/0286706 SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND ULTRAVIOLET IRRADIATOR SELECTING METHOD
A substrate processing device includes substrate holder, a plurality of ultraviolet irradiators, and controller. The substrate holder holds a substrate. The...
2018/0286705 FLUID CONTROL SYSTEM
An improved fluid delivery system and method that directly controls the concentration of constituent components in a fluid mixture delivered, for example, to a...
2018/0286704 PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE
A process for applying an underfill material to a die is disclosed. A wafer is diced into a plurality of dies (without having any underfill film thereon) such...
2018/0286703 Laminated Member
The present invention provides a laminated member that prevents contact of a semiconductor chip and an external leading terminal etc. without increasing the...
2018/0286702 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a semiconductor device by connecting a semiconductor chip to a lead frame using a jig, the semiconductor chip including a main...
2018/0286701 ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an...
2018/0286700 ANISOTROPIC ETCHING SYSTEMS AND METHODS USING A PHOTOCHEMICALLY ENHANCED ETCHANT
The systems and methods described herein use at least one etchant and at least one photochemically active material in conjunction with electromagnetic energy...
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