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Patent # Description
2018/0301502 METHOD FOR FORMING IMAGE SENSOR DEVICE
A method for forming an image sensor device on a substrate is disclosed. The method includes (a) recessing a portion of the substrate thereby forming a first...
2018/0301501 METHOD FOR MANUFACTURING CMOS IMAGE SENSOR
A semiconductor device includes a substrate, a conductive layer, a transparent layer, a transparent hard mask layer, a carrier, and a device layer. The...
2018/0301500 IMAGE CAPTURING MODULE AND MANUFACTURING METHOD THEREOF
An image capturing module including a light emitting element, a sensing element, a first circuit substrate, a second circuit substrate, and a third circuit...
2018/0301499 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a...
2018/0301498 OPTOELECTRONIC MODULES OPERABLE TO COLLECT SPECTRAL DATA AND DISTANCE DATA
Optoelectronic modules operable to collect distance data and spectral data include demodulation pixels operable to collect spectral data and distance data via...
2018/0301497 Color image sensor without the color filters
In various embodiments, image sensors and methods of making images sensors are disclosed. In an embodiment, an image sensor includes a first pixel region...
2018/0301496 IMPLANTATION PROCESS FOR SEMICONDUCTOR DEVICE
A semiconductor device includes a substrate and a device. The substrate has a first surface and a second surface opposite to each other. The substrate includes...
2018/0301495 PHOTOELECTRIC CONVERSION DEVICE
An off-leakage current of a photodiode is reduced in a photoelectric conversion device. A photoelectric conversion device (100) includes: an oxide...
2018/0301494 OPTICAL SENSORS INCLUDING A LIGHT-IMPEDING PATTERN
Optical sensors including a light-impeding pattern are provided. The optical sensors may include a plurality of photoelectric conversion regions, a plurality...
2018/0301493 COLOR FILTER ARRAY, IMAGERS AND SYSTEMS HAVING SAME, AND METHODS OF FABRICATION AND USE THEREOF
A pixel cell with a photosensitive region formed in association with a substrate, a color filter formed over the photosensitive region, the color filter...
2018/0301492 SOLID-STATE IMAGING DEVICE
A solid-state imaging device includes a first layer, a second layer, a plurality of first microlenses, and a plurality of second microlenses. A first light...
2018/0301491 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
The present technology relates to a solid-state imaging device, a manufacturing method, and an electronic device, which can improve sensitivity while improving...
2018/0301490 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
The present technology relates to a solid-state imaging device capable of inhibiting peeling of a fixed charge film while inhibiting dark current, a method of...
2018/0301489 HERMETIC ELECTRONIC-COMPONENT PACKAGE, IN PARTICULAR FOR AN IMAGE SENSOR
In a hermetic integrated-circuit package, the peripheral wall that bounds the cavity 2 containing the integrated circuit has, all the length of the peripheral...
2018/0301488 IMAGE SENSING CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
A package and a packaging method for an image sensing chip are provided. The package includes: an image sensing chip having a first surface and a second...
2018/0301487 IMAGE SENSOR
An image sensor includes first photoelectric elements, second photoelectric elements under the first photoelectric elements, and a pixel circuit including...
2018/0301486 IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF
The image sensing device includes a pixel region in a pixel array area and a dummy pixel region in a periphery area. The pixel region includes a radiation...
2018/0301485 IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
An image sensor and a manufacturing method thereof are provided. The image sensor includes a pixel sensing circuit, a pixel electrode, and an opto-electrical...
2018/0301484 IMAGE SENSORS WITH HIGH DYNAMIC RANGE AND AUTOFOCUSING HEXAGONAL PIXELS
An image sensor may include phase detecting and autofocusing (PDAF) pixels. Each PDAF pixel may be hexagonal may be divided into two or more photodiode...
2018/0301483 SOLID-STATE IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
A method of manufacturing a solid-state image sensor, includes forming a first isolation region of a first conductivity type in a semiconductor layer having...
2018/0301482 ARRAY SUBSTRATE STRUCTURE AND MANUFACTURING METHOD OF ARRAY SUBSTRATE
The present invention involves an array substrate structure and a manufacturing method of an array substrate. The manufacturing method of an array substrate,...
2018/0301481 MANUFACTURING METHODS OF THIN FILM TRANSISTORS AND MANUFACTURING METHODS OF ARRAY SUBSTRATES
The present disclosure relates to a manufacturing method of thin film transistors (TFTs) and a manufacturing method of array substrates. The manufacturing...
2018/0301480 Flexible Organic Light Emitting Diode Display and Manufacturing Method Thereof
A flexible organic light emitting diode display and manufacturing method thereof are provided. The method includes: performing a first patterning process on an...
2018/0301479 METHOD OF MANUFACTURING A LED MATRIX DISPLAY DEVICE
A method of making a display device comprising at least implementation of the following steps: fabricate a matrix of LEDs each comprising electrodes...
2018/0301478 MANUFACTURING METHOD FOR ARRAY SUBSTRATE
A manufacturing method for an array substrate is provided. The manufacturing method includes steps of: forming a first metal layer, a gate electrode layer, a...
2018/0301477 DISPLAY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING DISPLAY DEVICE
A display device according to the present disclosure includes: a transistor section (100) that includes a gate insulating film (130), a semiconductor layer...
2018/0301476 LOGIC CIRCUIT AND SEMICONDUCTOR DEVICE
To reduce a leakage current of a transistor so that malfunction of a logic circuit can be suppressed. The logic circuit includes a transistor which includes an...
2018/0301475 GATE STRUCTURE, METHOD FOR MANUFACTURING GATE STRUCTURE, AND DISPLAY DEVICE
A method for manufacturing a gate structure includes: forming a buffer layer on a lateral surface of a substrate; forming a groove on the buffer layer, where...
2018/0301474 DISPLAY PANEL AND ARRAY SUBSTRATE THEREOF
The present invention provides an array substrate, which comprises a display region and a peripheral wiring region, wherein in the peripheral wiring region,...
2018/0301473 SEMICONDUCTOR DEVICE
An object is to provide a semiconductor device using an oxide semiconductor having stable electric characteristics and high reliability. A transistor including...
2018/0301472 ACTIVE MATRIX SUBSTRATE AND METHOD FOR MANUFACTURING SAME, DISPLAY DEVICE USING ACTIVE MATRIX SUBSTRATE
An active matrix substrate (1001) includes: a plurality of pixel regions arranged on a substrate (1) in a matrix pattern extending in a first and a second...
2018/0301471 THIN FILM TRANSISTOR ARRAY SUBSTRATE, SUBSTRATE AND MANUFACTURING METHOD THEREOF
A substrate, a thin film transistor array substrate, and a manufacturing method are provided. The substrate includes a main plate, a first film layer, a second...
2018/0301470 ASYMMETRIC JUNCTION ENGINEERING FOR NARROW BAND GAP MOSFET
A method for forming a semiconductor device. It includes forming fin structures on a substrate, where the fin structure defines source and drain regions. It...
2018/0301469 FINFET DEVICES WITH MULTIPLE CHANNEL LENGTHS
A method including patterning a continuous fin having a first segment and a second segment in a semiconductor layer, the first segment is arranged at an angle...
2018/0301468 RGBW DISPLAY PANEL
The invention provides an RGBW display panel, or vertically adjacent or horizontally adjacent red sub-pixels, green sub-pixels, blue sub-pixels, and white...
2018/0301467 ARRAY SUBSTRATE AND DISPLAY DEVICE
An array substrate and a display device are provided. The array substrate includes a base substrate. The base substrate includes a display area and a...
2018/0301465 MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
A manufacturing method of a semiconductor structure is provided. The manufacturing method of the semiconductor structure includes the following steps: forming...
2018/0301464 COST-EFFECTIVE METHOD TO FORM A RELIABLE MEMORY DEVICE WITH SELECTIVE SILICIDATION AND RESULTING DEVICE
A method of forming a memory device with a dielectric blocking layer and selective silicidation and the resulting device are provided. Embodiments include...
2018/0301463 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
A semiconductor device is obtained in which a first insulating film for a gate insulating film of a memory element is formed over a semiconductor substrate in...
2018/0301462 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
In a semiconductor device including a higher-breakdown-voltage MISFET, an improvement is achieved in the breakdown voltage of the MISFET, while preventing an...
2018/0301461 SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device includes a first electrode film and a second electrode film spreading along a first direction and a second direction, first...
2018/0301460 SUBSTRATE PROCESSING METHOD AND DEVICE MANUFACTURED BY THE SAME
Provided is a substrate processing method that may prevent the non-uniformity of the thickness of landing pads deposited on each step in the process of...
2018/0301459 METHODS OF FABRICATING SEMICONDUCTOR MEMORY DEVICES
A method of fabricating a semiconductor memory device includes forming a bit line and a bit line capping pattern on the semiconductor substrate, forming a...
2018/0301458 STORAGE NODE CONTACT STRUCTURE OF A MEMORY DEVICE AND MANUFACTURING METHODS THEREOF
The present invention provides a storage node contact structure of a memory device comprising a substrate having a dielectric layer comprising a recess, a...
2018/0301457 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
A method for fabricating a semiconductor device includes: forming a mold stack pattern including a plurality of openings in an upper portion of a substrate and...
2018/0301456 SEMICONDUCTOR DEVICES INCLUDING STRUCTURES FOR REDUCED LEAKAGE CURRENT AND METHOD OF FABRICATING THE SAME
A semiconductor device and a method for fabricating the same are provided. A semiconductor device having a substrate can include a lower semiconductor layer,...
2018/0301455 Thyristor Volatile Random Access Memory and Methods of Manufacture
Memory cells are formed with vertical thyristors to create a volatile memory array. Power consumption in such arrays is reduced or controlled with various...
2018/0301454 Memory Cells and Memory Arrays
Some embodiments include a memory cell having first, second and third transistors, with the second and third transistors being vertically displaced relative to...
2018/0301453 FIN-TYPE FIELD EFFECT TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A fin-type field effect transistor comprising a substrate, at least one gate stack and epitaxy material portions is described. The substrate has fins and...
2018/0301452 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
A semiconductor device includes an active fin on a substrate, a gate structure on the active fin, a gate spacer structure on a sidewall of the gate structure,...
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