Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
2018/0301400 Heat Resistant and Shock Resistant Integrated Circuit
A heat and shock resistant integrated circuit (IC) of the present invention includes a base material, a metal layer disposed on the base material, a silicon...
2018/0301399 INTEGRATED DIE PADDLE STRUCTURES FOR BOTTOM TERMINATED COMPONENTS
Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at...
2018/0301398 SMD Package
A package encloses a power semiconductor die that has a first load terminal at a die frontside facing a footprint side of the package and a second load...
2018/0301397 SEMICONDUCTOR DEVICE
In a semiconductor device, the marginal edge of a resist member on the side closer to a substrate is between first and third positions on a metal base plate....
2018/0301396 CHIP STRUCTURE HAVING REDISTRIBUTION LAYER
A chip structure including a chip and a redistribution layer is provided. The chip includes a plurality of pads. The redistribution layer includes a dielectric...
2018/0301395 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE,...
A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a...
2018/0301394 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE,...
A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a...
2018/0301393 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE,...
A semiconductor device includes an integrated circuit that is disposed at a first face side of a semiconductor substrate, the semiconductor substrate having a...
2018/0301392 COMPONENT MODULE AND POWER MODULE
The disclosed component module includes a component comprising at least one electric contact to which at least one porous contact piece is connected; the...
2018/0301391 HEAT-SINK-ATTACHED POWER-MODULE SUBSTRATE AND POWER MODULE
Provided is a heat-sink-attached power-module substrate, in which a metal layer and first layers are formed from aluminum sheets having a purity of 99.99 mass...
2018/0301390 SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
According to an embodiment of a method, the method includes forming a first thermally conductive layer on an outer surface of a semiconductor package. The...
2018/0301389 INTEGRATED CIRCUIT PACKAGE AND METHOD OF FABRICATING THE SAME
An integrated circuit package including an integrated circuit component, a patterned dielectric liner, an insulating encapsulation, and a redistribution...
2018/0301388 PLASMA PROCESSING APPARATUS AND CONTROL METHOD
Provided is a plasma processing apparatus including a microwave radiating mechanism configured to radiate microwaves output from a microwave output unit into a...
2018/0301387 PLASMA PROCESSING APPARATUS AND CONTROL METHOD
Provided is a plasma processing apparatus including: a plurality of gas supply nozzles which are provided on a wall surface of a processing container and...
2018/0301386 CONDITIONS FOR BURN-IN OF HIGH POWER SEMICONDUCTORS
Techniques for improving reliability of III-N devices include holding the III-N devices at a first temperature less than or equal to 30.degree. for a first...
2018/0301385 Target Location in Semiconductor Manufacturing
A method of overlay control in silicon wafer manufacturing comprises firstly locating a target comprising a diffraction grating on a wafer layer; and then...
2018/0301384 FINFET SEMICONDUCTOR STRUCTURE HAVING HYBRID SUBSTRATE AND METHOD OF FABRICATING THE SAME
A FinFET semiconductor structure includes first fins and second fins extended from a semiconductor substrate, and a gate structure disposed over the first fins...
2018/0301383 SEMICONDUCTOR DEVICE
A substrate has an NMOS region and a PMOS region. A first gate electrode structure is disposed on the NMOS region of the substrate. The first gate electrode...
2018/0301382 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
A semiconductor device and a method for fabricating the semiconductor device are provided. The method includes providing a base substrate including a first...
2018/0301381 METHOD AND STRUCTURE FOR FORMING VERTICAL TRANSISTORS WITH SHARED GATES AND SEPARATE GATES
A method for manufacturing a semiconductor device includes forming a fin on a substrate, removing one or more portions of the fin prior to forming a gate...
2018/0301380 3D SEMICONDUCTOR DEVICE AND SYSTEM
A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors; at least one first metal layer...
2018/0301379 SILICON CARBIDE INTEGRATED CIRCUIT
The method of manufacturing an integrated circuit includes obtaining a silicon carbide substrate of a first conductivity type having an epitaxial layer of a...
2018/0301378 WORKPIECE DIVIDING METHOD
There is provided a dividing method for dividing a plate-shaped workpiece. The dividing method includes: a starting point region forming step of forming a...
2018/0301377 METHOD FOR FILLING A WAFER VIA WITH SOLDER
A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air...
2018/0301376 Embedded 3D Interposer Structure
A device includes an interposer, which includes a substrate; and at least one dielectric layer over the substrate. A plurality of through-substrate vias (TSVs)...
2018/0301375 CONDUCTIVE POWDER FORMATION METHOD, DEVICE FOR FORMING CONDUCTIVE POWDER, AND METHOD OF FORMING SEMICONDUCTOR...
A method of forming a conductive powder includes reducing, by a reduction reaction, a conductive powder precursor gas using a plasma. Reducing the conductive...
2018/0301374 THREE-DIMENSIONAL MEMORY DEVICE HAVING CONDUCTIVE SUPPORT STRUCTURES AND METHOD OF MAKING THEREOF
An alternating stack of insulating layers and sacrificial material layers is formed over a horizontal layer, which can be formed over a ...
2018/0301373 LOW RESISTANCE INTERCONNECT
An embodiment includes a transmitter comprising: an oxide layer between a substrate and an epitaxial silicon layer; a modulator included within the silicon...
2018/0301372 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
Provided herein may be a method of manufacturing a semiconductor device. The method may include: forming a first stack in which a first pad region, a second...
2018/0301371 Contact Plugs and Methods Forming Same
A method includes forming a transistor including forming a source/drain region on a side of a dummy gate stack, forming a first Inter-Layer Dielectric (ILD)...
2018/0301370 Methods of Forming One or More Covered Voids in a Semiconductor Substrate, Methods of Forming Field Effect...
Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for...
2018/0301369 PIN CONTROL METHOD AND SUBSTRATE PROCESSING APPARATUS
A pin control method includes: measuring respective height positions of a plurality of pins, which is vertically driven respectively by a plurality of driving...
2018/0301368 WAFER PROCESSING DEVICE
A wafer processing device is a device for handling a framed wafer including a frame, a film stretched inside the frame, and a wafer attached on the film, to...
2018/0301367 ELASTIC MEMBRANE, SUBSTRATE HOLDING DEVICE, AND POLISHING APPARATUS
An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to...
2018/0301366 SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
A semiconductor device manufacturing method is disclosed. The semiconductor device manufacturing method includes: a preparation step of preparing a...
2018/0301365 METHOD OF WAFER BONDING OF DISSIMILAR THICKNESS DIE
Methods, assemblies, and equipment are described for bonding one or more die that may be of dissimilar thickness to a wafer. The die may be fabricated and...
2018/0301364 SUBSTRATE SUPPORT ASSEMBLY WITH DEPOSITED SURFACE FEATURES
An electrostatic chuck comprises a ceramic body comprising an embedded electrode and a first ceramic coating on a surface of the ceramic body, wherein the...
2018/0301363 WAFER UNLOADING METHOD
Disclosed herein is a wafer unloading method for unloading a wafer from an electrostatic chuck table electrostatically holding the wafer by applying a voltage...
2018/0301362 PLASMA PROCESSING APPARATUS AND HEATER TEMPERATURE CONTROL METHOD
A method is provided for controlling a temperature of a heater arranged in a plasma processing apparatus that converts a gas into plasma using a high frequency...
2018/0301361 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF FORMING PACKAGE BODY
An apparatus for packaging a semiconductor device is provided. The apparatus includes a first mold, a second mold and a support element. The first mold...
2018/0301360 LIGHT IRRADIATION TYPE HEAT TREATMENT APPARATUS
A light diffusion plate made of quartz and provided with a plurality of recessed spherical surfaces is placed on an upper chamber window so as to be in opposed...
2018/0301359 HEAT TREATMENT VESSEL FOR SINGLE-CRYSTAL SILICON CARBIDE SUBSTRATE AND ETCHING METHOD
A heat treatment container (1) is provided with support members (6) for supporting a disc-shaped SiC substrate (2), which is an object, at a time of an etching...
2018/0301358 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber...
2018/0301357 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber...
2018/0301356 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber...
2018/0301355 CONTROL WARPAGE IN A SEMICONDUCTOR CHIP PACKAGE
A method to control warpage in a semiconductor chip package that includes: attaching a semiconductor chip to a semiconductor chip package; attaching a...
2018/0301354 METHOD FOR MANUFACTURING A CIRCUIT CARRIER
A method for manufacturing a circuit carrier (100') having a base plate (10), an organic insulating foil (20) arranged on the base plate (10) and a metal...
2018/0301353 METHOD OF MAKING A PLURALITY OF PACKAGED SEMICONDUCTOR DEVICES
A method of making a plurality of packaged semiconductor devices. The method includes providing a carrier blank having a die receiving surface and an...
2018/0301352 CHIP PACKAGING METHOD BY USING A TEMPORARY CARRIER FOR FLATTENING A MULTI-LAYER STRUCTURE
A chip packaging method includes forming a first redistribution layer and a first dielectric layer on a first temporary carrier to generate a plurality of...
2018/0301351 Substrate Design for Semiconductor Packages and Method of Forming Same
A device includes a first die, a second die, one or more redistribution layers (RDLs) electrically connected to the first die, a plurality of connectors on a...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.