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Patent # Description
2018/0315643 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
A semiconductor device manufacturing method is presented. The method entails providing a semiconductor structure comprising a substrate, one or more...
2018/0315642 METHOD AND STRUCTURE FOR MINIMIZING FIN REVEAL VARIATION IN FINFET TRANSISTOR
A semiconductor device includes a plurality of fins spaced apart from each other on a substrate; a liner layer on the substrate between each fin of the...
2018/0315641 Structure and Method for Enhancing Robustness of ESD Device
Methods and devices are provided herein for enhancing robustness of a bipolar electrostatic discharge (ESD) device. The robustness of a bipolar ESD device...
2018/0315640 PLASMA PROCESSING APPARATUS
A plasma processing apparatus includes a first mounting table on which a target object to be processed is mounted, a second mounting table provided around the...
2018/0315639 SUPPORT RING WITH MASKED EDGE
A support ring for semiconductor processing is provided. The support ring includes a ring shaped body defined by an inner edge and an outer edge. The inner...
2018/0315638 VACUUM ATTRACTION MEMBER
A substrate is arranged above a base body such that the substrate comes into contact with an upper end of a support member. Subsequently, vacuum suction is...
2018/0315637 MOUNTING OF SEMICONDUCTOR-ON-DIAMOND WAFERS FOR DEVICE PROCESSING
The present invention discloses a semiconductor-on-diamond-on-carrier substrate wafer (55). The semiconductor-on-diamond-on-carrier wafer (55) comprises: a...
2018/0315636 CARRIER SUBSTRATE ASSEMBLY, AND FABRICATION METHOD OF FLEXIBLE DISPLAY SUBSTRATE
The present disclosure provides a carrier substrate assembly, and a method of using the carrier substrate assembly, for fabricating a flexible display...
2018/0315635 ELECTROSTATIC ATTACHMENT CHUCK, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
An electrostatic attachment chuck includes: a substrate; a synthetic resin sheet joined to one main surface of the substrate; and at least a pair of electrodes...
2018/0315634 ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE
An electrostatic chuck includes: an insulating plate consisting of alumina, and YAG (Yttrium Aluminum Garnet) added with cerium, and configured to mount a...
2018/0315633 WORKPIECE CONVEYANCE APPARATUS, SEMICONDUCTOR MANUFACTURING APPARATUS, AND WORKPIECE CONVEYANCE METHOD
A workpiece conveyance apparatus having: a conveyance path on which the workpiece moves; a gas flotation section that gas-floats the workpiece over the...
2018/0315632 GAS SUPPLY DEVICE, METHOD FOR CONTROLLING GAS SUPPLY DEVICE, LOAD PORT, AND SEMICONDUCTOR MANUFACTURING APPARATUS
A purging nozzle unit of a gas supply device according to the present invention including: a housing that is capable of passing a predetermined gas so as to...
2018/0315631 METHODS AND SYSTEMS FOR PREVENTING UNSAFE OPERATIONS
A system for preventing an unsafe operation of a plurality of semiconductor wafer manufacturing machines communicatively coupled to a computing device. The...
2018/0315630 Charge Metrology for Integrated Measurement
A method for measuring charging of a semiconductor wafer associated with processing the semiconductor wafer includes using a probe assembly at a charge...
2018/0315629 TRANSFER APPARATUS AND TRANSFER METHOD
A transfer apparatus includes a transfer chamber to which a target object of a processing chamber is transferred, and an ionic liquid, held on an inner wall of...
2018/0315628 RECEIVING SYSTEM FOR COMPONENTS
A reception device for moving components along a first axis, a second axis and a third axis and that is designed to rotate in a controlled manner relative to a...
2018/0315627 LASER TREATMENT DEVICE RECTIFIER DEVICE AND LASER TREATMENT DEVICE
A laser treatment device performing treatment by irradiating a target object having a plate surface with laser light, including: a light-transmitting region...
2018/0315626 HIGH PRESSURE ANNEAL CHAMBER WITH VACUUM ISOLATION AND PRE-PROCESSING ENVIRONMENT
Embodiments of the disclosure generally relate to a method and apparatus for filling gaps and trenches on a substrate and tools for batch annealing substrates....
2018/0315625 FILM PROCESSING UNIT AND SUBSTRATE PROCESSING APPARATUS
A nozzle is stored in a nozzle storage hole of a waiting pod. In this state, a cleaning liquid is discharged to an outer peripheral surface of the nozzle from...
2018/0315624 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
A control device is provided which, at a time of upper surface treatment for treating an upper surface of a substrate with a treating device, supplies a...
2018/0315623 FILM PROCESSING UNIT, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate is held and rotated by a spin chuck, and a coating liquid is discharged to the substrate. The coating liquid that is splashed outwardly from the...
2018/0315622 APPARATUS AND METHOD FOR CLEANING A BACK SURFACE OF A SUBSTRATE
An apparatus which can remove particles, such as polishing debris, from a back surface with high removal efficiency is provided. The apparatus includes: a...
2018/0315621 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
A method for fabricating a semiconductor device, the method including forming a mold structure on a substrate such that the mold structure includes alternately...
2018/0315620 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device including a substrate, an insulating, layer on the substrate and including a trench, at least one via structure penetrating the...
2018/0315619 THIN FILM TRANSISTOR, MANUFACTURING METHOD THEREOF, AND METHOD FOR MANUFACTURING ARRAY SUBSTRATE
A thin film transistor, a manufacturing method thereof, and a method for manufacturing an array substrate are provided. The method for manufacturing the thin...
2018/0315618 SEMICONDUCTOR DEVICE AND METHOD
A method includes forming a metal gate structure over a first fin, where the metal gate structure is surrounded by a first dielectric material, and forming a...
2018/0315617 MATERIAL COMPOSITION AND METHODS THEREOF
Provided is a material composition and method for that includes providing a substrate and forming a resist layer over the substrate. In various embodiments,...
2018/0315616 METHOD OF CYCLIC PLASMA ETCHING OF ORGANIC FILM USING CARBON-BASED CHEMISTRY
A method of etching is described. The method includes providing a substrate having a first material containing organic material and a second material that is...
2018/0315615 METHOD OF CYCLIC PLASMA ETCHING OF ORGANIC FILM USING SULFUR-BASED CHEMISTRY
A method of etching is described. The method includes providing a substrate having a first material containing organic material and a second material that is...
2018/0315614 PROCESS FOR ETCHING A SiN-BASED LAYER
A microelectronic method for etching a layer containing silicon nitride is provided, including the following successive steps: modifying the layer containing...
2018/0315613 CLEANING APPARATUS, CHEMICAL MECHANICAL POLISHING SYSTEM INCLUDING THE SAME, CLEANING METHOD AFTER CHEMICAL...
A cleaning apparatus for removing particles from a substrate is provided. The cleaning apparatus includes a first cleaning unit including a first dual nozzle...
2018/0315612 Methods and System of Using Organosilicates as Patterning Films
Techniques herein include methods for selectively modifying chemical properties of organosilicates including periodic mesoporous organosilicates (PMOs) in situ...
2018/0315611 SUBSTRATE PROCESSING APPARATUS AND METHOD OF CONTROLLING THE SAME
A substrate processing apparatus is disclosed. In an embodiment, a substrate processing apparatus includes a plurality of polishing units including discharge...
2018/0315610 WAFER PROCESSING METHOD
A wafer processing method includes a protective film providing step of providing a protective film on the front side of a wafer, a wafer unit forming step of...
2018/0315609 Low Thermal Budget Crystallization Of Amorphous Metal Silicides
Methods for forming a metal silicide film with low resistivity at low temperature are described. A metal silicide film is formed on a substrate surface and...
2018/0315608 SELF-ALIGNED CONTACT AND MANUFACTURING METHOD THEREOF
A semiconductor device and a method of forming the semiconductor device are disclosed. A method includes forming a gate stack over a semiconductor structure....
2018/0315607 CONFINED AND SCALABLE HELMET
An embodiment includes a system comprising: a first gate and a first contact that correspond to a transistor and are on a first fin; a second gate and a second...
2018/0315606 GATE CUT WITH HIGH SELECTIVITY TO PRESERVE INTERLEVEL DIELECTRIC LAYER
A method for preserving interlevel dielectric in a gate cut region includes recessing a dielectric fill to expose cap layers of gate structures formed in a...
2018/0315605 Method for Ion Implantation
A method for ion beam implantation is provided. The method provides an ion implantation with a multiple-geometric-orientation ion beam that accommodates a...
2018/0315604 METHOD AND APPARATUSES FOR REDUCING POROGEN ACCUMULATION FROM A UV-CURE CHAMBER
Porogen accumulation in a UV-cure chamber is reduced by removing outgassed porogen through a heated outlet while purge gas is flowed across a window through...
2018/0315603 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
A semiconductor device and its manufacturing method, relating to semiconductor techniques. The semiconductor device manufacturing method comprises: forming a...
2018/0315602 Fin Patterning Methods for Increased Process Margins
The present disclosure provides a method in accordance with some embodiments. The method includes forming a material layer that includes an array of fin...
2018/0315601 Patterning Method for Semiconductor Device and Structures Resulting Therefrom
An embodiment method includes defining a first mandrel and a second mandrel over a hard mask layer. The method also includes depositing a spacer layer over and...
2018/0315600 HALOMETALLATE LIGAND-CAPPED SEMICONDUCTOR NANOCRYSTALS
Halometallate-capped semiconductor nanocrystals and methods for making the halometallate-capped semiconductor nanocrystals are provided. Also provided are...
2018/0315599 EPITAXIAL GROWTH OF DEFECT-FREE, WAFER-SCALE SINGLE-LAYER GRAPHENE ON THIN FILMS OF COBALT
A method for depositing a layer of graphene directly on the surface of a substrate, such as a semiconductor substrate is provided. Due to the strong adhesion...
2018/0315598 Precursors and Flowable CVD Methods for Making Low-K Films to Fill Surface Features
A method for depositing a silicon-containing film, the method comprising: placing a substrate comprising at least one surface feature into a flowable CVD...
2018/0315597 METHODS AND APPARATUS FOR DEPOSITING SILICON OXIDE ON METAL LAYERS
Thin layer of silicon oxide is deposited on a substrate having an exposed layer of metal (e.g., W, Cu, Ti, Co, Ta) without causing substantial oxidation of the...
2018/0315596 CHEMICAL AMPLIFICATION METHODS AND TECHNIQUES FOR DEVELOPABLE BOTTOM ANTI-REFLECTIVE COATINGS AND DYED IMPLANT...
The disclosure herein describes methods for Photosensitized Chemically Amplified Resist Chemicals (PS-CAR) to pattern light sensitive films (e.g., photoresist...
2018/0315595 Semiconductor Device and Method of Manufacture
A semiconductor device and method of manufacture are provided. After a patterning of a middle layer, the middle layer is removed. In order to reduce or prevent...
2018/0315594 METHOD OF CLEANING AND DRYING SEMICONDUCTOR SUBSTRATE
A cleaning and drying method of a semiconductor substrate capable of suppressing collapse or breakdown of a pattern which occur at the time of drying a...
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