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Patent # Description
2018/0330983 MANUFACTURING METHOD OF SMOOTHING A SEMICONDUCTOR SURFACE
A method is provided for preparing semiconductor structure, e.g., a semiconductor on insulator structure, comprising a device layer having a smooth surface....
2018/0330982 METHOD OF MANUFACTURING A HYBRID SUBSTRATE
A method of manufacturing a hybrid substrate is disclosed, which comprises: bonding a first semiconductor substrate to a first combined substrate via at least...
2018/0330981 Method for Thinning Substrates
According to various embodiments, a method includes: providing a substrate having a first side and a second side opposite the first side; forming a buried...
2018/0330980 CYCLIC FLOWABLE DEPOSITION AND HIGH-DENSITY PLASMA TREATMENT PROCESSES FOR HIGH QUALITY GAP FILL SOLUTIONS
Implementations disclosed herein relate to methods for forming and filling trenches in a substrate with a flowable dielectric material. In one implementation,...
2018/0330979 SHEET STICKING METHOD
There is provided a sheet sticking method including a sheet sticking step of sticking a sheet to a plate-shaped object and mounting the sheet to which the...
2018/0330978 WAFER PROCESSING METHOD
A wafer processing method includes a liquid supplying step of supplying a liquid to the front side of a wafer, a close contact making step of pressing a...
2018/0330977 METHOD AND SYSTEM FOR BALANCING THE ELECTROSTATIC CHUCKING FORCE ON A SUBSTRATE
Embodiments of the disclosure relate to methods and a system for adjusting the chucking voltage of an electrostatic chuck. In one embodiment, a system for...
2018/0330976 SYSTEMS AND METHODS FOR WAFER ALIGNMENT
Various embodiments of aligning wafers are described herein. In one embodiment, a photolithography system aligns a wafer by averaging individual via locations....
2018/0330975 IN-LINE WET BENCH DEVICE AND METHOD FOR THE WET-CHEMICAL TREATMENT OF SEMICONDUCTOR WAFERS
An in-line wet bench device for the wet-chemical treatment of semiconductor wafers, comprising a plurality of conveying rollers, each of which is rotatable...
2018/0330974 LIQUID PROCESSING APPARATUS
A liquid processing apparatus includes a processing unit, a first supply route, a first device, a second supply route, a second device, a housing, and an...
2018/0330973 WAFER CHARGES MONITORING
Apparatus and method for monitoring wafer charges are proposed. A conductive pin, a conductive spring and a conductive line are configured in series to connect...
2018/0330972 LASER PROCESSING METHOD
A laser processing method includes a step of holding a film side of a workpiece which has been divided into chips and whose reverse side carries an adhesive...
2018/0330971 SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD
A substrate cleaning apparatus includes a first processing unit configured to supply a first processing liquid for removing a residue adhering to a substrate...
2018/0330970 Semiconductor Bonding Structures and Methods
A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once...
2018/0330969 Package Structures and Method of Forming the Same
Package structures and methods of forming package structures are described. A method includes depositing and patterning a first dielectric material. The first...
2018/0330968 Method Of Fabricating Low-Profile Footed Power Package
A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which...
2018/0330967 Power Semiconductor Module Arrangement and Method for Producing the Same
A power semiconductor module arrangement includes a base plate configured to be arranged in a housing, a contact element configured to, when the base plate is...
2018/0330966 FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
A method of making a semiconductor device may include providing a carrier comprising a semiconductor die mounting site. A build-up interconnect structure may...
2018/0330965 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
Semiconductor structures and fabrication methods thereof are provided. An exemplary fabrication process includes providing a base substrate; forming a...
2018/0330964 ANNEALING METHOD FOR IMPROVING BONDING STRENGTH
The present disclosure provides an annealing method for improving interface bonding strength of a wafer. The method includes: providing a substrate, the...
2018/0330963 IN-SITU SELECTIVE DEPOSITION AND ETCHING FOR ADVANCED PATTERNING APPLICATIONS
Embodiments of the invention provide a method for in-situ selective deposition and etching for advanced patterning applications. According to one embodiment...
2018/0330962 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
A substrate treatment method capable of obtaining a flat processing target film. Molecules of an HF gas are adsorbed onto a corner SiO.sub.2 layer remaining in...
2018/0330961 METHOD FOR FORMING A PLANARIZATION STRUCTURE
A planarization structure is formed with a planar upper face enclosing a relief projecting from a planar substrate. The process used deposits a layer of a...
2018/0330960 Methods for Improved Critical Dimension Uniformity in a Semiconductor Device Fabrication Process
Exemplary methods of patterning a device layer are described, including operations of patterning a protector layer and forming a first opening in a first...
2018/0330959 METHOD FOR SELECTIVELY ETCHING WITH REDUCED ASPECT RATIO DEPENDENCE
A method for selectively etching an etch layer with respect to a mask is provided. An etch process is provided comprising a plurality of etch cycles, wherein...
2018/0330958 ETCHING METHOD
A selectivity can be improved in a desirable manner when etching a processing target object containing silicon carbide. An etching method of processing the...
2018/0330957 WORKPIECE PROCESSING METHOD
Disclosed herein is a workpiece processing method including a mask preparing step of preparing a mask that covers devices on a front surface of a workpiece and...
2018/0330956 CHEMICAL MECHANICAL POLISHING APPARATUS AND CONTROL METHOD THEREOF
Provided are a chemical mechanical polishing apparatus and a control method thereof. The chemical mechanical polishing apparatus includes a plurality of...
2018/0330955 POROUS TIN OXIDE FILMS
Initial film layers prepared from tin(II) chloride spontaneously generate open cavities when the initial film layers are thermally cured to about 400.degree....
2018/0330954 TRANSISTOR AND FABRICATION METHOD THEREOF
A junction-less transistor structure and fabrication method thereof are provided. The method includes providing a semiconductor substrate; and forming an...
2018/0330953 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
A semiconductor device and fabrication method are provided. The method includes providing a first dielectric layer with a first groove on a base substrate. A...
2018/0330952 METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
A method of manufacturing a semiconductor apparatus comprises forming a first photoresist on each of a first portion and a second portion of a member, exposing...
2018/0330951 DEPOSITION OF METAL SILICIDE LAYERS ON SUBSTRATES AND CHAMBER COMPONENTS
Embodiments of the present disclosure generally relate to methods and apparatus for depositing metal silicide layers on substrates and chamber components. In...
2018/0330950 METHOD FOR ASSEMBLING SUBSTRATES BY BONDING INDIUM PHOSPHATE SURFACES
The invention concerns an assembly method comprising the following steps: a) providing a first substrate comprising a first face made from crystalline indium...
2018/0330949 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
According to one embodiment, a method for manufacturing a semiconductor device is disclosed. The method can include performing a first heat treatment of a...
2018/0330948 METHOD OF FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR DEVICES
A method of fabricating a three-dimensional semiconductor device comprises stacking first hardmask layers and second hardmask layers on a lower layer including...
2018/0330947 DISPLAY PANEL AND MANUFACTURING METHOD OF DISPLAY PANEL
A display panel and a manufacturing method of a display panel are provided. The manufacturing method of a display panel includes: forming the nanoporous...
2018/0330946 DEVICES, SYSTEMS, AND METHODS FOR LIGHT EMISSION AND DETECTION USING AMORPHOUS SILICON
Amorphous silicon devices, systems, and related methods are described herein. An example method for fabricating a thin film with light-emitting or...
2018/0330945 REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILICON-CONTAINING AND CARBON-CONTAINING PRECURSORS
A doped or undoped silicon carbide film can be deposited using a remote plasma chemical vapor deposition (CVD) technique. One or more silicon-containing...
2018/0330944 TECHNIQUES TO ENGINEER NANOSCALE PATTERNED FEATURES USING IONS
A method of patterning a substrate. The method may include providing a surface feature on the substrate, the surface feature having a first dimension along a...
2018/0330943 HALOGEN ABATEMENT FOR HIGH ASPECT RATIO CHANNEL DEVICE DAMAGE LAYER REMOVAL FOR EPI GROWTH
In an embodiment, a method of processing a substrate includes introducing a first process gas or a mixture of the first process gas and a second process gas...
2018/0330942 Halogen Removal Module and Associated Systems and Methods
A chamber is formed to enclose a processing region. A passageway is configured to provide for entry of a substrate into the processing region and removal of...
2018/0330941 METHOD FOR OBTAINING A SEMI-POLAR NITRIDE LAYER ON A CRYSTALLINE SUBSTRATE
A process allowing at least one semipolar layer of nitride to be obtained, which layer is obtained from a least one among gallium, indium and aluminum on a top...
2018/0330940 SEMICONDUCTOR CLEANER SYSTEMS AND METHODS
In an embodiment, the present invention discloses a EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty...
2018/0330939 DEPOSITION OF BORON AND CARBON CONTAINING MATERIALS
Methods of depositing boron and carbon containing films are provided. In some embodiments, methods of depositing B,C films with desirable properties, such as...
2018/0330938 WAFER PROCESSING METHOD
A wafer processing method includes a close contact making step of pressing a protective film against the front side of a wafer in a radially outward direction...
2018/0330937 Broadband Light Source Including Transparent Portion with High Hydroxide Content
A laser-sustained plasma light source includes a plasma lamp configured to contain a volume of gas and receive illumination from a pump laser in order to...
2018/0330936 IMAGING MASS SPECTROMETER
A time-of-flight mass spectrometer is disclosed comprising ion optics that map an array of ions at an ion source array (71) to a corresponding array of...
2018/0330935 SYSTEMS AND APPROACHES FOR SEMICONDUCTOR METROLOGY AND SURFACE ANALYSIS USING SECONDARY ION MASS SPECTROMETRY
Systems and approaches for semiconductor metrology and surface analysis using Secondary Ion Mass Spectrometry (SIMS) are disclosed. In an example, a secondary...
2018/0330933 COOLING DEVICES AND INSTRUMENTS INCLUDING THEM
Certain configurations are described herein of an instrument comprising a passive cooling device which includes, in part, a loop thermosyphon configured to...
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