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Patent # Description
2018/0374823 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package includes a first layer of one or more first semiconductor chips each having a first surface at which one or more first pads are...
2018/0374822 Chip on Package Structure and Method
A system and method for packaging semiconductor device is provided. An embodiment comprises forming vias over a carrier wafer and attaching a first die over...
2018/0374821 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
A semiconductor structure includes a first substrate including a first surface and a second surface opposite to the first surface; a first die disposed over...
2018/0374820 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE THEREOF
A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a...
2018/0374819 VERTICAL WIRE CONNECTIONS FOR INTEGRATED CIRCUIT PACKAGE
A method includes aligning a wire with a package body having a contact pad and moving the wire through the package body to form electrical contact with the...
2018/0374818 METHOD FOR PREPARING A SEMICONDUCTOR APPARATUS
The present disclosure is directed to method for preparing a semiconductor apparatus having a plurality of bonded semiconductor devices formed by a fusion...
2018/0374817 SEMICONDUCTOR APPARATUS
According to the present invention, a semiconductor apparatus includes a semiconductor device, a case surrounding the semiconductor device, a spring terminal...
2018/0374816 BONDING WIRE FOR SEMICONDUCTOR DEVICES
The present invention has as its object the provision of a bonding wire for semiconductor devices mainly comprised of Ag, in which bonding wire for...
2018/0374815 BONDING WIRE FOR SEMICONDUCTOR DEVICE
A bonding wire for a semiconductor device, which is suitable for on-vehicle devices bonding wire, has excellent capillary wear resistance and surface flaw...
2018/0374814 SEMICONDUCTOR DEVICE
A semiconductor device includes a semiconductor module having a semiconductor element, a radiator plate which is connected to the semiconductor element and...
2018/0374813 ASSEMBLY COMPRISING HYBRID INTERCONNECTING MEANS INCLUDING INTERMEDIATE INTERCONNECTING ELEMENTS AND SINTERED...
An assembly includes at least one first element comprising at least one first electrical bonding pad; at least one second element comprising at least one...
2018/0374812 METHOD OF FORMING SOLDER BUMPS
A method of forming solder bumps includes preparing a substrate having a surface on which a plurality of electrode pads are formed, forming a resist layer on...
2018/0374811 SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a carrier having a...
2018/0374810 BONDING PADS WITH THERMAL PATHWAYS
Apparatuses and methods for providing thermal pathways from a substrate to a thermal bonding pad. The thermal pathways may be metal extensions of the thermal...
2018/0374809 INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION AND METHOD OF MANUFACTURE THEREOF
A method of manufacture of an integrated circuit system includes: providing a semiconductor wafer with a bond pad; attaching a detachable carrier to the...
2018/0374808 Semiconductor Package
A semiconductor device is disclosed. The semiconductor device comprises a redistribution structure, a processor die, and a metal post. The metal post has a...
2018/0374807 System and Method for an Improved Interconnect Structure
Presented herein are an interconnect structure and method for forming the same. The interconnect structure includes a contact pad disposed over a substrate and...
2018/0374806 SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
A semiconductor structure and its fabrication method are provided. The fabrication method includes: providing a base substrate including a wiring region and an...
2018/0374805 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package device includes: (1) a substrate having a first surface; (2) a permeable element including a first portion disposed on the first...
2018/0374804 GROUND PLANE VERTICAL ISOLATION OF, GROUND LINE COAXIAL ISOLATION OF, AND IMPEDANCE TUNING OF HORIZONTAL DATA...
A ground isolation transmission line package device includes (1) ground isolation planes between, (2) ground isolation lines surrounding, or (3) such ground...
2018/0374803 WIRING SUBSTRATE
A wiring substrate includes a coil wiring and a magnetic layer that is in contact with a lower surface of the coil wiring and includes an opening extending...
2018/0374802 INDUCTOR STRUCTURE MOUNTED ON PCB BOARD AND VOLTAGE REGULATOR MODULE HAVING THE SAME
The present disclosure discloses an inductor structure mounted on a PCB board and a voltage regulator module having the same. The inductor structure includes...
2018/0374801 Wafer Level Package (WLP) and Method for Forming the Same
A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a conductive pad...
2018/0374800 EMBEDDED VIBRATION MANAGEMENT SYSTEM
Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by...
2018/0374799 ELECTRONIC CIRCUIT PACKAGE USING COMPOSITE MAGNETIC SEALING MATERIAL
Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, an electronic component mounted on a surface of the...
2018/0374798 SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED METHODS
An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The...
2018/0374797 INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
An integrated fan-out package including an integrated circuit, an insulating encapsulation, and a redistribution circuit structure is provided. The integrated...
2018/0374796 ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a...
2018/0374795 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
A semiconductor device includes a semiconductor substrate SB and a wiring structure formed on a main surface of the semiconductor substrate SB. The uppermost...
2018/0374794 SEMICONDUCTOR DEVICE AND AMPLIFIER CIRCUIT
In order to easily sort failures due to short circuit between wires in an inductor, a semiconductor device includes a plurality of inductors (first inductor,...
2018/0374793 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor device includes: first, second, and third tiers formed on a substrate, wherein the first tier is formed over the substrate, the second tier is...
2018/0374792 LAYOUT TECHNIQUE FOR MIDDLE-END-OF-LINE
In certain aspects of the disclosure, a die includes one or more fins, a gate formed over a first portion of the one or more fins, and a first source/drain...
2018/0374791 BURIED POWER RAILS
Aspects of the disclosure provide a semiconductor device and a method for manufacturing the semiconductor device. The semiconductor device includes a power...
2018/0374790 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE STRUCTURE
A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes...
2018/0374789 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE STRUCTURE
A circuit substrate and a semiconductor package structure are provided. The circuit substrate includes a body and a via hole array. The via hole array includes...
2018/0374788 SEMICONDUCTOR DEVICE
According to an embodiment of the present invention, there is provided a semiconductor device having a first semiconductor component and a second semiconductor...
2018/0374787 SEMICONDUCTOR DEVICE
To improve signal transmission characteristics of a high frequency signal of 80 GHz or higher. A semiconductor device includes a wiring board having a...
2018/0374786 FEEDTHROUGH ASSEMBLIES AND METHODS OF FORMING SAME
Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can...
2018/0374785 PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
A package structure including a circuit substrate, a semiconductor die, a redistribution layer, a plurality of conductive balls and a circuit substrate is...
2018/0374784 PACKAGE FOR AN ELECTRONIC COMPONENT, ELECTRONIC COMPONENT AND ELECTRONIC ARRANGEMENT
A package for an electronic component includes a housing and a leadframe embedded in the housing. The leadframe includes a first section, a second section and...
2018/0374783 INTEGRATED CIRCUIT PACKAGE WITH MULTI-DIE COMMUNICATION
An integrated circuit package having a first die configured to sense a first physical characteristic and provide a first data signal, and a second die, wherein...
2018/0374782 LEAD FRAME
A lead frame includes: a plurality of units each including a first lead portion and a second lead portion arranged in a first direction, wherein the units are...
2018/0374781 LEAD PACKAGE AND METHOD FOR MINIMIZING DEFLECTION IN MICROELECTRONIC PACKAGING
Package deflection and mechanical stress of microelectronic packaging is minimized in a two step manufacturing process. In a first step, a ceramic insulator is...
2018/0374780 PROCESS FOR MANUFACTURING A FLIP CHIP SEMICONDUCTOR PACKAGE AND A CORRESPONDING FLIP CHIP PACKAGE
A process for manufacturing a semiconductor flip chip package and a corresponding flip chip package. The process comprises associating conducting bump pads to...
2018/0374779 SEMICONDUCTOR DEVICE
A semiconductor device includes a plurality of stacked chips is disclosed. Each of the stacked chips includes a plurality of through vias arranged in a regular...
2018/0374778 FLOW PATH MEMBER AND SEMICONDUCTOR MODULE
A flow path member may include silicon nitride ceramics. The flow path member may have an inlet port, an outlet port, and a flow path connected to the inlet...
2018/0374777 HEAT DISSIPATION MODULE
A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat...
2018/0374776 MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to...
2018/0374775 Electrical Device Having a Covering Material
An electrical device includes an electrical component that is at least partially covered by a covering material that includes a cement material. The covering...
2018/0374774 SEMICONDUCTOR DIE ASSEMBLY HAVING HEAT SPREADER THAT EXTENDS THROUGH UNDERLYING INTERPOSER AND RELATED TECHNOLOGY
A semiconductor die assembly in accordance with an embodiment of the present technology includes a first semiconductor die, a package substrate underlying the...
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