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Patent # Description
2018/0374773 HEAT SINK AND ELECTRONIC COMPONENT DEVICE
A heat sink may include: a flat plate portion; a first protruding portion which is formed on an outer peripheral portion of the flat plate portion so as to...
2018/0374772 SEMICONDUCTOR DEVICE
Provided is a technique for preventing warps of cooling plates due to a contraction of a joining material, thereby preventing a reduction in cooling...
2018/0374771 COMPLIANT HEAT SINK
A compliant heat sink for transporting heat away from at least one electronic component, the heat sink includes a body, where the body includes a flexible...
2018/0374770 ELECTRICAL ASSEMBLY
An electrical assembly including a primary electrical component having a semiconductor device, a primary heat sink having the primary electrical component...
2018/0374769 ELECTRONIC DEVICE INCLUDING REDISTRIBUTION LAYER PAD HAVING A VOID
An electronic device is disclosed. In one example, the electronic device includes a solder ball, a dielectric layer comprising an opening, and a redistribution...
2018/0374768 SEMICONDUCTOR DEVICE
A semiconductor device according to an embodiment includes a semiconductor chip including a region having through holes; a substrate having a first opening...
2018/0374767 PACKAGE FOR ELECTRONIC COMPONENT STORAGE, ELECRONIC DEVICE, AND MANUFACTURING METHOD THEREOF
An object of the present invention is to provide a seal ring having a metal brazing material layer on one surface of a base material containing KOVAR and a...
2018/0374766 WAFER AND METHOD FOR PROCESSING A WAFER
A wafer in accordance with various embodiments may include: at least one metallization structure including at least one opening; and at least one separation...
2018/0374765 SEMICONDUCTOR PATTERN FOR MONITORING OVERLAY AND CRITICAL DIMENSION AT POST-ETCHING STAGE AND METROLOGY METHOD...
A semiconductor pattern for monitoring overlay and critical dimension at post-etching stage is provided in the present invention, which include a first...
2018/0374764 WAFER PROCESSING EQUIPMENT HAVING CAPACITIVE MICRO SENSORS
Embodiments include devices and methods for detecting particles, monitoring etch or deposition rates, or controlling an operation of a wafer fabrication...
2018/0374763 POWER SWITCHING SYSTEM FOR ESC WITH ARRAY OF THERMAL CONTROL ELEMENTS
A semiconductor substrate support for supporting a semiconductor substrate in a plasma processing chamber includes a heater array comprising thermal control...
2018/0374762 METHOD FOR FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY DEVICE
A method for fabricating an array substrate, an array substrate, and a display device are disclosed. The method includes forming a whole layer of opaque film...
2018/0374761 INTEGRATING AND ISOLATING NFET AND PFET NANOSHEET TRANSISTORS ON A SUBSTRATE
Embodiments of the invention are directed to a method of forming an insulation region during fabrication of a nanosheet channel field effect transistor (FET)....
2018/0374760 SEMICONDUCTOR DEVICE AND METHOD
A method includes forming a spacer layer over a semiconductor fin protruding above a substrate, doping the spacer layer using a first dopant while the spacer...
2018/0374759 BOUNDARY SPACER STRUCTURE AND INTEGRATION
The present disclosure relates to semiconductor structures and, more particularly, to an N-P boundary spacer structure used with finFET devices and methods of...
2018/0374758 VERTICAL FIELD EFFECT TRANSISTORS
Vertical field effect transistors (FETs) with minimum pitch and methods of manufacture are disclosed. The structure includes at least one vertical fin...
2018/0374756 FINFET DEVICES
FinFET devices and processes to prevent fin or gate collapse (e.g., flopover) in finFET devices are provided. The method includes forming a first set of...
2018/0374755 FIN FIELD-EFFECT TRANSISTOR AND FABRICATION METHOD THEREOF
FinFET structures and fabrication methods thereof are provided. An exemplary fabrication method includes forming a semiconductor substrate and a plurality of...
2018/0374754 METHOD OF FORMING OXIDE LAYER FOR FINFET DEVICE
A method for forming a fin-based transistor includes forming a fin on a substrate; overlaying at least an upper portion of the fin with nitrogen-based...
2018/0374753 STACKED ELONGATED NANOSHAPES OF DIFFERENT SEMICONDUCTOR MATERIALS AND STRUCTURES THAT INCORPORATE THE NANOSHAPES
Disclosed herein are a method of forming stacked elongated nanoshapes (NSs) (e.g., stacked nanowires (NWs)) of different semiconductor materials above a...
2018/0374752 SEMICONDUCTOR STRUCTURES
Semiconductor structure is provided. An exemplary semiconductor structure includes a semiconductor substrate including fin structures. The fin structures...
2018/0374751 Novel 3D Integration Method Using SOI Substrates and Structures Produced Thereby
A process and resultant article of manufacture made by such process comprises forming through vias needed to connect a bottom device layer in a bottom silicon...
2018/0374750 Methods Of Producing Fully Self-Aligned Vias And Contacts
Methods and apparatus to form fully self-aligned vias are described. First conductive lines are recessed in a first insulating layer on a substrate. A first...
2018/0374749 MECHANICALLY STABLE COBALT CONTACTS
A cobalt contact includes a dual silicide barrier layer. The barrier layer, which may be formed in situ, includes silicides of titanium and cobalt, and...
2018/0374748 INTERCONNECT STRUCTURE
Low capacitance and high reliability interconnect structures and methods of manufacture are disclosed. The method includes forming a copper based interconnect...
2018/0374747 SELF-FORMING BARRIER PROCESS
A method is provided, including the following operations: performing a deposition process on a substrate, the deposition process configured to deposit a copper...
2018/0374746 DIFFUSION BARRIER LAYER FORMATION
A method of forming a titanium nitride (TiN) diffusion barrier includes exposing a deposition surface to a first pulse of a titanium-containing precursor and...
2018/0374745 Semiconductor Constructions; and Methods for Providing Electrically Conductive Material Within Openings
Some embodiments include methods for depositing copper-containing material utilizing physical vapor deposition of the copper-containing material while keeping...
2018/0374744 FORMATION METHOD OF INTERCONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE
Formation methods of a semiconductor device structure are provided. A method includes forming a dielectric layer over a first conductive feature and a second...
2018/0374743 ETCHING METHOD
An etching method of silicon-containing oxide film is provided. The etching method includes a first step of forming an etching pattern on the ...
2018/0374742 Systems and Methods for a Semiconductor Structure Having Multiple Semiconductor-Device Layers
A multilayer semiconductor device structure having different circuit functions on different semiconductor device layers is provided. The semiconductor...
2018/0374741 Method for Forming an Alignment Mark
Disclosed is a method. The method includes forming a trench structure with at least one first trench in a first section of a semiconductor body; forming a...
2018/0374740 Substrate Support and Substrate Processing Apparatus
Described herein is a technique capable of preventing a susceptor made of quartz from being damaged by contacting a reflector deformed by thermal expansion. A...
2018/0374739 SUBSTRATE HOLDING MEMBER
A substrate holding member includes a base, and a plurality of convex parts formed at an upper surface of the base and configured to hold a substrate at top...
2018/0374738 CHIP MOUNTING APPARATUS AND METHOD USING THE SAME
A chip mounting method includes providing a first substrate including a light transmissive substrate having first and second surfaces, a sacrificial layer...
2018/0374737 HIGH TEMPERATURE HEAT PLATE PEDESTAL
An assembly, which in one form is a pedestal, includes an upper member, a lower member bonded to the upper member, and a thermal phase diffuser disposed...
2018/0374736 ELECTROSTATIC CARRIER FOR DIE BONDING APPLICATIONS
Embodiments of the disclosure relate to the use of an electrostatic carrier for securing, transporting and assembling dies on a substrate. In one embodiment,...
2018/0374735 SUBSTRATE FIXING DEVICE
A substrate fixing device includes a baseplate, an adhesive layer on the baseplate, and an electrostatic chuck on the adhesive layer. The adhesive layer...
2018/0374734 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE HOLDER AND MOUNTING TOOL
A substrate processing apparatus, includes: a substrate holder including at least one support column to which a mounting part on which a substrate is mounted...
2018/0374733 INDEXABLE SIDE STORAGE POD APPARATUS, HEATED SIDE STORAGE POD APPARATUS, SYSTEMS, AND METHODS
In some embodiments, a side storage pod of an equipment front end module is provided that includes (1) an outer enclosure having a sealing surface configured...
2018/0374732 APPARATUS FOR TRANSPORTATION OF A SUBSTRATE, APPARATUS FOR VACUUM PROCESSING OF A SUBSTRATE, AND METHOD FOR...
An apparatus for transportation of a substrate is provided. The apparatus includes a vacuum chamber having a chamber wall configured to separate a vacuum side...
2018/0374731 WAFER STORAGE CONTAINER
The present invention relates to a wafer storage container, more particularly, relates to a wafer storage container comprising a storage chamber forming an...
2018/0374730 BOWING SEMICONDUCTOR WAFERS
This specification describes methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer...
2018/0374729 WAFER JIG WITH IDENTIFICATION MARK
Disclosed herein is a wafer jig with an identification mark for use in inspecting the function of an identification mark reading mechanism for reading an...
2018/0374728 FLUID MONITORING SYSTEM AND METHOD FOR SEMICONDUCTOR FABRICATION TOOLS
A system and method provide for monitoring and controlling fluid flow in semiconductor manufacturing apparatuses. The method and system include a vortex flow...
2018/0374727 METHOD OF INSPECTING GAS SUPPLY SYSTEM
In one embodiment, a vaporizer is connected to a chamber of a substrate processing apparatus through a gas supply line and a gas introduction port. An exhaust...
2018/0374726 METHOD OF INSPECTING GAS SUPPLY SYSTEM
In one embodiment, a gas supply line is connected to a chamber of a substrate processing apparatus. A vaporizer is connected to the gas supply line. A flow...
2018/0374725 SIDE STORAGE PODS, EQUIPMENT FRONT END MODULES, AND METHODS FOR PROCESSING SUBSTRATES
Electronic device processing systems including side storage pods are described. One electronic device processing system has a side storage pod having a first...
2018/0374724 ELECTROSTATIC CHUCK WITH INDEPENDENT ZONE COOLING AND REDUCED CROSSTALK
An electrostatic chuck is described with independent zone cooling that leads to reduced crosstalk. In one example, the chuck includes a puck to carry a...
2018/0374723 APPARATUS AND METHOD FOR ETCHING ONE SIDE OF A SEMICONDUCTOR SUBSTRATE
An apparatus for etching one side of a semiconductor layer, including at least one etching tank for receiving an electrolyte, a first electrode, which is...
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