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Patent # Description
2019/0006212 WAFER PRODUCING APPARATUS
A wafer producing apparatus for producing an SiC wafer from a single-crystal SiC ingot includes an ingot grinding unit, a laser applying unit that applies a...
2019/0006211 ELECTRONIC COMPONENT HANDLING UNIT
The electronic component handling unit comprises: a main body; a rotating shaft attached to the main body; a flip head attached to the rotating shaft; and a...
2019/0006209 DEVICE AND METHOD FOR HOLDING, ROTATING, AS WELL AS HEATING AND/OR COOLING A SUBSTRATE
A device and a method for holding, rotating, heating and/or cooling a substrate. The device comprises a rotor, having: at least one secondary winding, a...
2019/0006208 HEAT TREATMENT APPARATUS, METHOD OF MANAGING HEAT TREATMENT APPARATUS AND STORAGE MEDIUM
A heat treatment apparatus of heating a substrate mounted on a mounting plate heated by a heating part includes: plural types of physical quantity detecting...
2019/0006207 SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes a processing container configured to air-tightly accommodate substrates, a plurality of mounting stands configured to...
2019/0006206 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
The substrate processing method according to an exemplary embodiment includes a low temperature dissolving processing and an etching processing. The low...
2019/0006205 SYSTEM, APPARATUS, AND METHOD FOR PROCESSING SUBSTRATES USING ACOUSTIC ENERGY
A system, apparatus, and method for processing substrates using acoustic energy. In one aspect, the invention can be a system for processing flat articles...
2019/0006204 POST-CMP CLEANING APPARATUS AND METHOD WITH BRUSH SELF-CLEANING FUNCTION
Apparatuses and methods for performing a post-CMP cleaning are provided. The apparatus includes a chamber configured to receive a wafer in need of having CMP...
2019/0006203 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes a connection portion connected to the common piping and having a flow space in its interior, a chemical liquid...
2019/0006202 REPAIRING APPARATUS FOR REMOVAL OF METAL RESIDUALS ON DISPLAY SUBSTRATE
A repairing apparatus for removal of metal residuals on a display substrate is provided. The apparatus includes a storage container, comprising at least a...
2019/0006201 SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD AND STORAGE MEDIUM
A substrate liquid processing apparatus includes a liquid processing unit configured to store a processing liquid and a substrate and process the substrate...
2019/0006200 Release Film as Isolation Film in Package
A method includes forming a release film over a carrier, attaching a device over the release film through a die-attach film, encapsulating the device in an...
2019/0006199 Release Film as Isolation Film in Package
A method includes forming a release film over a carrier, forming a metal post on the release film, encapsulating the metal post in an encapsulating material,...
2019/0006198 MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
There is provided a manufacturing method of a semiconductor package in which plural semiconductor chips different in the thickness are mounted. In the...
2019/0006197 WAFER PART AND CHIP PACKAGING METHOD
A wafer part and a chip packaging method are provided. The wafer part is obtained by processing a round wafer. A profile of the wafer part is an inscribed...
2019/0006196 METHOD FOR PACKAGING CHIP AND CHIP PACKAGE STRUCTURE
A method for packaging a chip, including: forming a release layer on a first panel-level substrate, and forming redistribution layers respectively on...
2019/0006195 CHIP ENCAPSULATING METHOD AND CHIP ENCAPSULATING STRUCTURE
A chip encapsulating method includes: fixing a plurality of wafers to a first panel level substrate, the wafer including a plurality of chips; forming a...
2019/0006194 Integrated Circuit Packages and Methods of Forming Same
An integrated circuit package and a method of forming the same are provided. A method includes forming a conductive column over a carrier. An integrated...
2019/0006193 Apparatus and Method for Processing a Semiconductor Substrate
A method includes placing a semiconductor substrate on a first curved surface of a first bending tool, using a second bending tool with a second surface to...
2019/0006192 3D SEMICONDUCTOR DEVICE AND STRUCTURE
A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors and a first metal layer, where the...
2019/0006191 SEMICONDUCTOR PRODUCT AND CORRESPONDING METHOD
A semiconductor product such as an integrated circuit includes a laminar plastic substrate having first and second opposed surfaces and through holes extending...
2019/0006190 FZ SILICON AND METHOD TO PREPARE FZ SILICON
FZ silicon which shows no degradation of its minority carrier lifetime after any processing steps at a processing temperature of less than 900.degree. C. is...
2019/0006189 Laser Annealing Systems and Methods With Ultra-Short Dwell Times
Laser annealing systems and methods with ultra-short dwell times are disclosed. The method includes locally pre-heating the wafer with a pre-heat line image...
2019/0006188 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
A plasma processing method includes a substrate processing step of performing predetermined processing on a target substrate loaded into a chamber by using...
2019/0006187 Multi-Chip Structure and Method of Forming Same
A device includes a first chip is embedded in a molding compound layer, wherein the first chip is shifted toward a first direction, a second chip over the...
2019/0006186 PLASMA ETCHING METHOD AND PLASMA ETCHING APPARATUS
A shape of a hole can be improved. The plasma etching method includes a recess forming of forming a recess having a depth smaller than a thickness of a silicon...
2019/0006185 WAFER PROCESSING METHOD
A wafer processing method for processing a wafer having devices on the front side is provided. The wafer processing method includes a back grinding step of...
2019/0006184 GALLIUM NITRIDE BASED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF GALLIUM NITRIDE BASED SEMICONDUCTOR DEVICE
A gallium nitride based semiconductor device is provided, where when a thickness of a transition layer is defined as the followings, the thickness of the...
2019/0006183 Metal Gate Stack Having TaAlCN Layer
Gate stacks for improving integrated circuit device performance and methods for fabricating such gate stacks are disclosed herein. An exemplary method includes...
2019/0006182 PROCEDE DE REALISATION DE CONTACT INTERMETALLIQUE A BASE DE NI SUR INXGA1-XAS
A process for manufacturing an intermetallic contact on the surface of a layer or of a substrate of oriented In.sub.xGa.sub.1-xAs material, the contact...
2019/0006181 SEMICONDUCTOR DEVICE
A semiconductor device includes: a semiconductor layer of silicon carbide including a plurality of layers disposed on a main surface side; an electrode layer...
2019/0006180 MICROASSEMBLY OF HETEROGENEOUS MATERIALS
A method for microassembly of heterogeneous materials comprises contacting a stamp with an ink disposed on a donor substrate to form an inked stamp, where the...
2019/0006179 Method for Manufacturing Semiconductor Device
The present application relates to the field of semiconductor technologies, and discloses methods for manufacturing a semiconductor device. The manufacturing...
2019/0006178 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
A semiconductor device including a substrate, a semiconductor layer, and a buffer structure is provided. The semiconductor layer is located on the substrate....
2019/0006177 ENCAPSULATED SUBSTRATE, MANUFACTURING METHOD, HIGH BAND-GAP DEVICE HAVING ENCAPSULATED SUBSTRATE
An encapsulated substrate includes a zinc oxide substrate and a composite barrier layer. The composite barrier layer includes a first film layer having a first...
2019/0006176 PROCESS OF FORMING SEMICONDUCTOR EPITAXIAL SUBSTRATE
A process of growing a barrier layer made of AlGaN on a GaN channel layer is disclosed. The process includes steps of, growing the GaN channel layer, growing...
2019/0006175 SILICON GERMANIUM SELECTIVE OXIDATION PROCESS
Implementations described herein relate to selective oxidation processes for semiconductor device manufacturing. In one implementation, the process includes...
2019/0006174 METHOD FOR PATTERNING SEMICONDUCTOR DEVICE USING MASKING LAYER
A semiconductor device and method includes a method. The method includes patterning a plurality of first mandrels over a first mask layer. The method further...
2019/0006173 Epitaxies of a Chemical Compound Semiconductor
Methods and structures includes providing a substrate, forming a prelayer over a substrate, forming a barrier layer over the prelayer, and forming a channel...
2019/0006172 METHOD FOR PROCESSING SEMICONDUCTOR DEVICE
A method for processing a semiconductor device is provided. The semiconductor device includes a protruding structure on a substrate, the protruding structure...
2019/0006171 METHODS AND DEVICES INTEGRATING III-N TRANSISTOR CIRCUITRY WITH SI TRANSISTOR CIRCUITRY
Methods and devices integrating circuitry including both III-N (e.g., GaN) transistors and Si-based (e.g., Si or SiGe) transistors. In some monolithic...
2019/0006170 High Mobility Silicon on Flexible Substrates
A semiconductor device and method for fabricating same is disclosed. Embodiments are directed to a semiconductor device and fabrication of same which include a...
2019/0006169 SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
A semiconductor wafer has a base material. The semiconductor wafer may have an edge support ring. A grinding phase of a surface of the semiconductor wafer...
2019/0006168 TIME-OF-FLIGHT MASS SPECTROMETER
An acceleration voltage generator (7) generates a high-voltage pulse to be applied to a push-out electrode (11), by operating a switch section (74) to turn on...
2019/0006167 SAMPLE ANALYSIS SYSTEMS AND METHODS OF USE THEREOF
The invention generally relates to sample analysis systems and methods of use thereof. In certain aspects, the invention provides a system for analyzing a...
2019/0006166 APPARATUS AND METHOD FOR GENERATING CHEMICAL SIGNATURES USING DIFFERENTIAL DESORPTION
The present invention is directed to a method and device to generate a chemical signature for a mixture of analytes. The present invention involves using a...
2019/0006165 System for Minimizing Electrical Discharge During ESI Operation
Methods and systems are provided for reducing the occurrence of unwanted electrical discharge when operating an electrospray ion source to generate ions for...
2019/0006164 Mass Spectrometer
Acceleration of decelerated ions and a reduction in the velocity dispersion width of decelerated ions are both achieved, whereby the sensitivity of detected...
2019/0006163 IONIZATION MASS SPECTROMETRY METHOD AND MASS SPECTROMETRY DEVICE USING SAME
A mass spectrometry device includes a sample seating part including an ultrasonic vibrator having a through hole through which liquid particles formed by the...
2019/0006162 MASS SPECTROMETER
A mass spectrometer 10 includes: an insertion port 1 through which a sample plate 8 is to be inserted; a reading device 6 including: a light emitter 61...
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